Resistive Switching Random Access Memory Research Articles

Improved resistive switching characteristics of solution processed ZrO2/SnO2 bilayer RRAM via oxygen vacancy differential

In this study, a solution-processed bilayer structure ZrO2/SnO2 resistive switching (RS) random access memory (RRAM) is presented for the first time. The precursors of SnO2 and ZrO2 are Tin(Ⅱ) acetylacetonate (Sn(AcAc)2) and zirconium acetylacetonate (Zr(C5H7O2)4), respectively. The top electrode was deposited with Ti using an E-beam evaporator, and the bottom electrode used an indium–tin–oxide glass wafer. We created three devices: SnO2 single-layer, ZrO2 single-layer, and ZrO2/SnO2 bilayer devices, to compare RS characteristics such as the I–V curve and endurance properties. The SnO2 and ZrO2 single-layer devices showed on/off ratios of approximately 2 and 51, respectively, along with endurance switching cycles exceeding 50 and 100 DC cycles. The bilayer device attained stable RS characteristics over 120 DC endurance switching cycles and increased on/off ratio ∼2.97 × 102. Additionally, the ZrO2/SnO2 bilayer bipolar switching mechanism was explained by considering the Gibbs free energy (ΔG o) difference in the ZrO2 and SnO2 layers, where the formation and rupture of conductive filaments were caused by oxygen vacancies. The disparity in the concentration of oxygen vacancies, as indicated by the Gibbs free energy difference between ZrO2 (ΔG o = −1100 kJ mol−1) and SnO2 (ΔG o = −842.91 kJ mol−1) implied that ZrO2 exhibited a higher abundance of oxygen vacancies compared to SnO2, resulting in improved endurance and on/off ratio. X-ray photoelectron spectroscopy analyzed oxygen vacancies in ZrO2 and SnO2 thin films. The resistance switching characteristics were improved due to the bilayer structure, which combines a higher oxygen vacancy concentration in one layer with a lower oxygen vacancy concentration in the switching layer. This configuration reduces the escape of oxygen vacancies to the electrode during RS.

Accurate evaluation method for HRS retention of VCM ReRAM

Long-term retention is one of the major challenges concerning the reliability of redox-based resistive switching random access memories based on the valence change mechanism (VCM). The stability of the programmed state has to be ensured over several years, leaving a sufficient read window between the states, which is even more challenging at large statistics. Thus, the underlying physical mechanisms have to be understood and experimental data have to be evaluated accurately. Here, it shows that the retention behavior of the high resistive state (HRS) is more complex than that of the low resistive state and requires a different evaluation method. In this work, we experimentally investigate the retention behavior of 5M VCM devices via accelerated life testing and show the difficulties of commonly used evaluation methods in view of the HRS. Subsequently, we present a new evaluation method focusing on the standard deviation of the HRS current distribution. Hereby, an activation energy for the degradation process can be extracted, which is essential for the prediction of the devices’ behavior under operating conditions. Furthermore, we reproduce the experimentally observed behavior with our 3D Kinetic Monte Carlo simulation model. We confirm the plausibility of our evaluation method and are able to connect the calculated activation energy to the migration barriers of oxygen vacancies that we implemented in the model and that we believe play a key role in the experimentally observed degradation process.

Comment on "Bipolar Resistive Switching in Lanthanum Titanium Oxide and an Increased On/Off Ratio Using an Oxygen-Deficient ZnO Interlayer".

The Mott-based resistive switching random access memory (RRAM) has been considered as a promising candidate for next-generation nonvolatile mass storage. Its performance relies on the oxygen migration process. In ACS Appl. Mater. Interfaces 2022, 14, 17682-17690, Wang et al. demonstrated that inserting a ZnO layer between the top tungsten electrode and the lanthanum titanium oxide (LTO) layer can improve the ON/OFF current ratio of the RRAM. This improvement was attributed to the increased oxygen vacancies in the ZnO layer. We argue their interpretation with the role, significance, and statistics of the oxygen vacancy in the samples. Our experimental evidence contradicts their claim, and we propose that hydroxy groups should be the responsible candidate for their claimed oxygen vacancy peak at around 531-532 eV in the O 1s photoelectron spectroscopy observed in their samples. We thus propose an alternative mechanism for the ON/OFF ratio enhancement with the ZnO interlayer: the ZnO layer prevents the LTO oxygen and hydroxy groups migration and from reacting with the multivalent tungsten electrode.

A Zn(ii)-metal ion directed self-healing wide bandgap semiconducting supramolecular metallohydrogel: effective non-volatile memory design for in-memory computing

5-Amino-1-pentanol was used as a low molecular weight gelator to develop a room temperature stable supramolecular hydrogel with Zn(ii)-ions, which offers an efficient resistive random access memory switching application.

Study of a charge transition-driven resistive switching mechanism in TiO2-based random access memory via density functional theory.

The nature of the conducting filament (CF) with a high concentration of oxygen vacancies (VOs) in oxide thin film-based resistive random access memory (RRAM) remains unclear. The VOs in the CF have been assumed to be positively charged (VO2+) to explain the field-driven switching of RRAM, but VO2+ clusters in high concentration encounter Coulomb repulsion, rendering the CF unstable. Therefore, this study examined the oxidation state of VOs in the CF and their effects on the switching behavior via density functional theory calculations using a Pt/TiO2/Ti model system. It was concluded that the VOs in the CF are in a low oxidation state but are transformed to VO2+ immediately after release from the CF. In addition, the short-range interactions between VOs were confirmed to facilitate the rupture and rejuvenation of the CF by reducing the required activation energy. Finally, an improved switching model was proposed by considering the charge transition of VOs, providing a plausible explanation for the reported coexistence of two opposite bipolar switching polarities: the eight-wise and the counter-eight-wise polarities.

Atomic Layer Deposition of NiO Using Different Precursors with Different Oxygen Sources

NiO thin films have attracted tremendous attention owing to their outstanding chemical stability, good magnetic and catalytic properties1. It is also considered an efficient electrocatalyst for water oxidation, and is one of the few p-type semiconductive oxides with optical transparency due to its wide bandgap of 3.6 eV. Furthermore, NiO films can control high and low conductive states under an external electric field, which is very useful for developing resistance-switching random-access memory devices2.NiO films have been prepared by different deposition techniques, including sputtering, sol-gel, pulsed laser deposition, spray pyrolysis, and chemical vapor deposition (CVD), atomic layer deposition (ALD). Among these, ALD is a powerful technique to grow thin conformal films with fine-tuning of both composition and thickness. The commonly used nickel precursors for ALD process are Ni(Cp)2, Ni(MeCp)2, Ni(EtCp)2, Ni(dmamp)2, Ni(dmamb)2, Ni(acac)2, Ni(apo)2, Ni(dmg)2, Ni(thd)2, and Ni(amd)2 in combination with ozone, water, hydrogen peroxide, or oxygen plasma1. However, ALD of NiO is not well developed yet. The major disadvantages associated with these nickel precursors are low volatility, thermal instability, and poor reactivity or narrow ALD window. Some of these precursors are expensive or very difficult to synthesize. The aforementioned situations indicate that developing a new ALD process for the NiO film with new precursors is pertinent.In this work, we explored different Ni-precursors such as Ni ketoiminates, Ni(ipki)2 and Ni(eeki)2 (their synthesis has been proposed earlier3), and Alanis, provided by Air Liquide. These different reactants combined with different oxygen sources (H2O and O3) resulted in high-quality NiO thin films. Surface analyses indicate NiO films are stoichiometric. They are uniform and exhibit a columnar morphology as determined by TEM (Fig.1a). From the growth characteristics, it is found that the Ni precursors have a strong effect on the GPC. Similarly, the oxygen source affects GPC but it also influences the morphology of the layer leading to significant roughness variations (observed by XRR and AFM). The use of H2O can also result in a nucleation delay. Polycrystalline films are observed when the reaction temperature reaches 125°C, and the crystallinity is further enhanced with deposition temperature (Fig.1b). After comprehensive optimization of the ALD process with Alanis precursor, it has been possible to reach one of the highest growth rate of 1.5 Å/cy, which is nearly seven times higher than that obtained with Ni(EtCp)2 based reaction with the same ALD reactor and having a wide temperature window (100 to 175 °C) with ozone. The same precursor also reacted well with water, giving a GPC of 0.9 Å with an initial nucleation delay. With the use of Ni-ketoiminates, the growth rate could be enhanced considerably with a GPC of 0.7 Å in combination with O3 at a higher temperature.The NiO layers were subsequently used as catalysts for water photooxidation in alkaline medium. The electrochemical properties are better when compared to layers grown by PVD. References Y. Zhang, L. Du, X. Liu, and Y. Ding, A high growth rate atomic layer deposition process for nickel oxide film preparation using a combination of nickel (II) diketonate-diamine and ozone, App. Surf. Sci., 2019, 481, 138-143.H.L. Lu, G. Scarel, X.L. Li, M. Fanciulli, Thin MnO and NiO films grown using atomic layer deposition from ethylcyclopentadienyl type of precursors, J. Cryst. Growth, 2008, 310, 5464-5468.3. D. Zywitzki, D.H. Taffa, L. Lamkowski, M. Winter, D. Rogalla, M. Wark, and A. Devi, Tuning coordination geometry of nickel ketoiminates and its influence on thermal characteristics for chemical vapour deposition of nanostructured NiO electrocatalysts, Inorg. Chem., 2020,59, 14, 10059-10070. Figure 1

Improved Resistive Switching Behaviors of Al/Ag-Doped Fe2O3 Film/ITO Devices Fabricated with a Radio-Frequency Co-Sputtering System

We fabricated Fe2O3−x and Ag-doped Fe2O3−x devices with resistive switching behavior by using a radiofrequency cosputtering system. Our results indicated that doping Ag into Fe2O3−x can effectively improve device performance, increasing the data retention test time to beyond 104 s and resulting in switching cycles of approximately ∼3 × 102 times; resistance on/off ratios of approximately ∼103; and mean setting and reset voltages of 0.94 V and −1.35 V, respectively. The improvement in performance had several possible reasons. In our case, conductive filament formation was mainly induced by oxygen vacancies and Ag atoms. X-ray photoelectron spectroscopy showed that oxygen vacancies increased significantly with Ag doping. This phenomenon can improve device performance. Ag atoms served as trap centers, allowing for the easy trapping and release of charges. This effect facilitated the formation of conductive filaments. Ag-doped Fe2O3−x has significant potential for application in resistive switching random access memory devices.

Electron-Sponge Nature of Polyoxometalates for Next-Generation Electrocatalytic Water Splitting and Nonvolatile Neuromorphic Devices.

Designing next-generation molecular devices typically necessitates plentiful oxygen-bearing sites to facilitate multiple-electron transfers. However, the theoretical limits of existing materials for energy conversion and information storage devices make it inevitable to hunt for new competitors. Polyoxometalates (POMs), a unique class of metal-oxide clusters, have been investigated exponentially due to their structural diversity and tunable redox properties. POMs behave as electron-sponges owing to their intrinsic ability of reversible uptake-release of multiple electrons. In this review, numerous POM-frameworks together with desired features of a contender material and inherited properties of POMs are systematically discussed to demonstrate how and why the electron-sponge-like nature of POMs is beneficial to design next-generation water oxidation/reduction electrocatalysts, and neuromorphic nonvolatile resistance-switching random-access memory devices. The aim is to converge the attention of scientists who are working separately on electrocatalysts and memory devices, on a point that, although the application types are different, they all hunt for a material that could exhibit electron-sponge-like feature to realize boosted performances and thus, encouraging the scientists of two completely different fields to explore POMs as imperious contenders to design next-generation nanodevices. Finally, challenges and promising prospects in this research field are also highlighted.

Growth and characterization of sputter-deposited Ga2O3-based memristive devices

In the last few years, there has been significant interest in gallium oxide devices for resistive switching technologies due to its remarkable sensitivity to oxygen. In this study, we present the growth and resistive switching of a (2¯01) oriented (75 ± 3) nmβ-Ga2O3 thin film on a Ru/Al2O3 substrate using magnetron radio frequency sputtering. The observed resistive switching was attributed to the formation and rupture of conductive filaments constituted by oxygen vacancies in the β-Ga2O3 film as confirmed by x-ray photoelectron spectroscopy and energy-dispersive x-ray spectroscopy. The electrical conduction was found to be of Ohmic nature in the low-resistance ON state, while the high-resistance OFF state was governed by the Poole–Frenkel transport mechanism. Exhibiting stable endurance cycles, long retention times, and ON/OFF ratios of up to 104, the devices can be considered as promising prototypes for future nonvolatile resistive switching random access memory with respect to both switching performance and device stability.

Reliability Aspects of 28 nm BEOL‐Integrated Resistive Switching Random Access Memory

Approaching the application of redox‐based resistive switching random access memory (ReRAM), the research focus shifts more and more toward different aspects of reliability. Herein, it is vital to account for the statistics in large memory blocks, as certain failure mechanisms are observed to only affect a few bits per million. In a cooperation between RWTH Aachen and Infineon Technologies, the variability, retention, and endurance of filamentary valence change memory, integrated into 28 nm CMOS on Mbit scale are comprehensively studied. This article reviews the main findings of this project. It is found that the programmed states follow characteristic normal or log‐normal statistics based on dynamic equilibrium in the random walk of oxygen vacancies in the switching layer, experimentally observed as read noise. On long timescales, these statistics are remarkably stable, providing high data retention. However, the existing long‐term degradation can be characterized by shifting and broadening of the programmed high resistive state distributions. A high endurance of more than 500 k cycles is demonstrated on the Mbit scale. Only a tail of a few devices appears to fail to reset. Via kinetic Monte Carlo modeling, the voltage divider of ReRAM cell and periphery has been identified as the origin of this failure.

Bio-Organic Based Resistive Switching Random-Access Memory

A non-volatile memory is a solid-state device that can retain data even power supply is terminated. It is an essential data storage device that serves as a backbone for the advancement of Internet-of-Things. There are various emerging non-volatile memory technologies in different technology-readiness levels, to replace the existing technologies with limited memory density, operating speed, power consumption, manufacturability, and data security. Of the emerging technologies, resistive switching technology is one of the most promising next generation non-volatile random-access memories. The fundamental working principle of the resistive-switching random-access memory (ReRAM) is based on memristor characterises with metal-insulator-metal stacking structure. Same as other solid-state devices, ReRAM is also facing issue of electronic waste when the memory device is discarded. To overcome this issue, bio-organic materials as green and sustainable engineering materials have been used to fabricate ReRAM. In this review, development of bio-organic based ReRAM, in particular the resistive switching mechanisms and device performance, have been discussed and challenging and future applications of this memory have been provided.

Amorphous BN-Based Synaptic Device with High Performance in Neuromorphic Computing.

The von Neumann architecture has faced challenges requiring high-fulfillment levels due to the performance gap between its processor and memory. Among the numerous resistive-switching random-access memories, the properties of hexagonal boron nitride (BN) have been extensively reported, but those of amorphous BN have been insufficiently explored for memory applications. Herein, we fabricated a Pt/BN/TiN device utilizing the resistive switching mechanism to achieve synaptic characteristics in a neuromorphic system. The switching mechanism is investigated based on the I-V curves. Utilizing these characteristics, we optimize the potentiation and depression to mimic the biological synapse. In artificial neural networks, high-recognition rates are achieved using linear conductance updates in a memristor device. The short-term memory characteristics are investigated in depression by controlling the conductance level and time interval.

Material to system-level benchmarking of CMOS-integrated RRAM with ultra-fast switching for low power on-chip learning

Analog hardware-based training provides a promising solution to developing state-of-the-art power-hungry artificial intelligence models. Non-volatile memory hardware such as resistive random access memory (RRAM) has the potential to provide a low power alternative. The training accuracy of analog hardware depends on RRAM switching properties including the number of discrete conductance states and conductance variability. Furthermore, the overall power consumption of the system inversely correlates with the RRAM devices conductance. To study material dependence of these properties, TaOx and HfOx RRAM devices in one-transistor one-RRAM configuration (1T1R) were fabricated using a custom 65 nm CMOS fabrication process. Analog switching performance was studied with a range of initial forming compliance current (200–500 µA) and analog switching tests with ultra-short pulse width (300 ps) was carried out. We report that by utilizing low current during electroforming and high compliance current during analog switching, a large number of RRAM conductance states can be achieved while maintaining low conductance state. While both TaOx and HfOx could be switched to more than 20 distinct states, TaOx devices exhibited 10× lower conductance, which reduces total power consumption for array-level operations. Furthermore, we adopted an analog, fully in-memory training algorithm for system-level training accuracy benchmarking and showed that implementing TaOx 1T1R cells could yield an accuracy of up to 96.4% compared to 97% for the floating-point arithmetic baseline, while implementing HfOx devices would yield a maximum accuracy of 90.5%. Our experimental work and benchmarking approach paves the path for future materials engineering in analog-AI hardware for a low-power environment training.

(Invited) Advanced Modeling of Nanoscale Devices

Moore’s scaling law has survived during more than 50 years because the transistor fabrication recipes have been continuously adapted and technology boosters have been gradually introduced, e.g. strain, high- dielectrics, or 3-D FinFETs. The driving force behind these innovations has always been the intuition of clever researchers who benefited from classical technology computer aided design (TCAD) tools. The latter have been used in the semiconductor industry since the end of the 1970’s, when the first 2-D simulations of CMOS devices became feasible on a supercomputer [1]. Over the last 40 years, transistors have undergone tremendous evolutions, their dimensions being reduced by several orders of magnitude, while the physical models at the core of commercially available device simulators have remained the same: electron transport is still described by classical drift-diffusion (DD) equations, which have been modified to capture parts of the quantum mechanical effects affecting nano-transistors, e.g. geometrical confinement tunnelling leakages, or energy quantization [2].A new generation of advanced TCAD tools that go beyond the DD equations and rely on atomistic quantum mechanical concepts is needed to reproduce the characteristics of today’s nanostructures and to predict the performance of not-yet-fabricated components. Such tools should combine different modelling approaches to be able to treat various device types, from state-of-the-art nano-transistors to photo-detectors based on two-dimensional materials or resistive switching random access memories. For example, to shed light on the behaviour of valence change memory (VCM) cells, which consist of metal-insulator-metal stacks, molecular dynamics (MD), kinetic Monte Carlo (KMC), density functional theory (DFT), and quantum transport (QT) should be allied, as illustrated in the accompanying figure. By doing so, the growth of nano-filaments through realistic oxides embedded between two metallic electrodes can be accurately simulated and the electrical current flowing through computed with, e.g., the Non-equilibrium Green’s Function (NEGF) formalism [3]. In this presentation the multi-method simulation environment shown the accompanying Figure will be briefly reviewed. The main focus will be set on the discussion of few applications, among them transistors and memory cells.

Comparative analysis of low-frequency noise based resistive switching phenomenon for filamentary and interfacial RRAM devices

We investigate the low-frequency noise (LFN) characteristics of resistive switching random access memory (RRAM) devices with metal–insulator–metal structures of TiN/Ti/TiO2/TiN (filamentary) and TiN/Ti/TiO2/HfO2/TiN (interfacial). By comparing filamentary and interfacial RRAM devices, we stipulate guidelines for noise sources according to the resistance states or resistive switching mechanisms of RRAM device. In filamentary RRAM devices, the dominant noise source in the low resistance state is the localized oxygen vacancies, whereas the noise characteristics in the high resistance state represent a bulk effect. In interfacial RRAM devices, the noise characteristics in both resistance states represent the bulk effect. The physical mechanism of the multilevel cell operation is inferred by the I–V characteristics in both Icc and Vreset control modes. Specifically, the changes in the structure of the conductive filament inside the switching layer can be confirmed through LFN measurement.

Integration of Non-Filamentary Pr0.7Ca0.3MnO3– Based Memristor With Silicon-PN Junction

Crossbar memristor arrays are gaining interest in the semiconductor industry for high-density storage and in-memory computing applications. For efficient array operations, highly non-linear selector (1S) or transistor (1T) devices are connected in series with memristor devices to rectify sneak path leakage currents. For selector-memristor integration, process and device compatibility is a must. In this work, we have experimentally demonstrated the integration of Pr <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.7</sub> Ca <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.3</sub> MnO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> (PCMO) based resistive random access memory (RRAM) and Silicon (Si) junction devices. We propose and evaluate various integration schemes for Si-PN junction Diode (1D) and PCMO-RRAM (1R) to identify a successful approach where both devices retain their characteristics after integration. Moreover, the electrical measurements for the integrated 1D1R structure show the SET switching of PCMO-RRAM. Lastly, we show bipolar RRAM switching analogous to 1S1R configuration using an anti-parallel diode connection. The integration approach can be used to design a scaled-1S1R or 1T1R cell for large-scale crossbar memristor arrays with PCMO-RRAM.

Low-Frequency Noise-Based Mechanism Analysis of Endurance Degradation in Al/αTiOx/Al Resistive Random Access Memory Devices.

In this work, we analyze a resistive switching random access memory (RRAM) device with the metal-insulator-metal structure of Al/αTiOx/Al. The transport mechanism of our RRAM device is trap-controlled space-charge limited conduction, which does not change during the endurance test. As the number of resistive switching (RS) cycles increases, the current in the low-resistance state (LRS) does not change significantly. In contrast, degradation in the high-resistance state (HRS) is noticeably evident. According to the RS cycle, the current shift fits well with the stretched-exponential equation. The normalized noise power spectral density (Si/I2) measured in the HRS is an order of magnitude higher than that in the LRS owing to the difference in the degree of trap occupancy, which is responsible for the transition of resistance states. During the consecutive RS, the Si/I2 in the HRS rapidly decreases for approximately 100 cycles and then saturates. In contrast, in the LRS, the Si/I2 does not change significantly. Here we propose a model associated with the endurance degradation of the experimental device, and the model is verified with a 1/f noise measurement.

Programming Strategy Optimization of RRAM Fabricated by 28 nm Standard CMOS Process

The switching characteristics of HfOx-based resistive switching random access memory (RRAM) fabricated on front-end of 28 nm standard CMOS process are investigated. The integration of RRAM in the front-end of the CMOS process would minimize the influence of parasitic parameters caused by interconnection line and interlayer oxide on the one transistor one RRAM (1T1R) cells. By adopting pulse program-verify measurement for cycling test, we observe two nonideal phenomena in the commercialized RRAM devices for the first time: 1) low resistance state (LRS) current periodically decays exponentially accompanied by incremental SET pulse number and then increases abruptly when the cycle reaches a certain level and 2) high resistance state (HRS) current fluctuated dramatically during RESET operation. The current fluctuation is mainly due to the generation of new oxygen vacancies (Vos) near the bottom electrode and gap region by electrons trapping/detrapping. By adopting efficient pulse amplitude modulation, the optimized programming strategy has greatly reduced the switching instability and improved the endurance of the devices. Mechanisms of the instability and the optimization strategy are explained by a modified trap-assisted tunneling (TAT) model based on the generation and redistribution of Vos during cycling operations.

An ab initio investigation of the structural, mechanical, electronic, optical, and thermoelectric characteristics of novel double perovskite halides Cs2CaSnX6 (X = Cl, Br, I) for optically influenced RRAM devices.

Hybrid lead halide perovskites have been considered as promising candidates for a large variety of optoelectronic applications. By exploring novel combinations of lead-free double perovskite halides, it is possible to find a suitable replacement for poisonous lead halide perovskites, enhancing electronic and optical response for their application as optically-influenced resistive switching random access memory (RRAM). In this work, the structural, mechanical, elastic, electronic, optical, and thermoelectric characteristics of lead-free double halide perovskites were investigated by Vienna ab initio simulation package (VASP) to explore their role in RRAM. From the analysis of mechanical constraints, it is clear that all three composites of Cs2CaSnX6 (X = Cl, Br, I) are mechanically stable and ductile in nature. The electronic bandgap with and without spin-orbit coupling (SOC), and total and sub-total density of states (TDOS, sub-TDOS) have been calculated using the Perdew-Burke-Ernzerhof generalized gradient approximation (PBE-GGA) potentials. The observed direct band gaps of 3.58 eV, 3.09 eV, and 2.60 eV for Cs2CaSnCl6, Cs2CaSnBr6, and Cs2CaSnI6, respectively, reveal the suitability of these specified composites as resistive switching material for RRAM devices. Additionally, the optical characteristics, such as complex refractive index, absorption coefficient, and reflectivity of the compounds under consideration have been calculated under the action of incident photons of 0 to 14 eV energy. The thermoelectric properties of Cs2CaSnX6 (X = Cl, Br, I) double perovskite halide were computed and analyzed with the help of the BoltzTraP Code.

A two-terminal binary HfO2 resistance switching random access memory for an artificial synaptic device

We reported a HfO2 RRAM using an innovative tablet method by pressing the HfO2 nanocrystals into a circle-shaped ceramic wafer under high pressure.