Large Number Of Interconnections Research Articles

Study of the underground tunnel planning. Cognitive modelling

A study of the underground tunnel planning reliability for megacities is proposed based on the use of foresight and cognitive modeling methodologies. Using the foresight methodology allows, with the help of expert estimation procedures, to identify critical technologies and build alternatives of scenarios with quantitative characteristics. For the justified implementation of a particular scenario, cognitive modeling is used, which allows to build causal relationships based on knowledge and experience, understand and analyze the behavior of a complex system for a strategic perspective with a large number of interconnections and interdependencies. The suggested study allows the reliability planning of underground tunnels on the basis of reasonable scenarios selection and justification of their creation priority.

P‐1.15: TFT‐based Addressing and Readout Circuits for Hybrid LAE‐CMOS Interfacing

A key challenge of a hybrid system combining Large-Area Electronics (LAE) and Large-Scale Electronics (LSE) is that a large number of interconnects and fan-outs are needed to interface between LAE array and CMOS ICs, making fabrication and integration complex and problematic. This paper presents a solution to reduce the interfacing complexity by replacing CMOS-based interface ICs with dual-gate TFT-based addressing and readout circuits to achieve monolithic integration.

Simulation Petri Net Model in the Tasks of Operational Control of Discrete Production

The presented article describes the approach to solving the task of discrete production control based on the reference imitation model. A discrete production system, represented by typical technological equipment, was chosen as the object of research. The simulation model uses the mathematical apparatus of temporary Petri nets. A method for automated synthesis of ready-to-use production models has been formed and tested. The method is based on the idea of synthesizing a production process model from models of typical technological processes. In the practice of applying Petri nets, the complexity of developing, subsequent interpretation of models, and, consequently, making changes are factors that significantly hinder their practical use. A new way of influencing the criterion is proposed by setting different incidence ratios in the Petri net. In the structure of the incidence matrix, the invariable and variable parts are distinguished. A method for specifying the structure of the variable part through the vector of parameters is described, which made it possible to use a metaheuristic algorithm for finding its best structure. The problem of optimal production planning defined for the approach described above is formulated. The bioinspired algorithm of jumping frogs is adapted to the search for the best network structure for a given optimality criterion. Changes in the specified algorithm made it possible to reduce the number of search steps, as well as work with discrete type parameters. In the process of solving, the most popular optimality criterion was used. The obtained theoretical results are within the framework of the optimization-simulation approach and are its logical development. The developed approach to solving the problem of optimal production control develops the theory of Petri nets, makes it more suitable for modeling complex systems with a branched structure and a large number of interconnections. On the basis of the developed theoretical provisions, a test example is presented that characterizes the effect of their application. Recommendations for the practical use of the proposed approach in the sense of minimizing the time for making managerial decisions with the required accuracy are determined.

Triboelectric UV patterning for wearable one-terminal tactile sensor array to perceive dynamic contact motions

Triboelectric nanogenerators (TENGs) have attracted intensive attention for the self-powered tactile signalling because strong potential signals are generated even by weak mechanical stimuli. The TENG-based sensors typically request one or two interconnecting wires in each pixel, hence a large number of interconnections are necessary to acquire multiple position information. Here, we introduce innovative triboelectric UV patterning on a single stretchable elastomer dielectric film and fabricate a position-encoded tactile sensor requiring only one interconnection line. We investigate controllable change of triboelectric potentials simply adjustable by UV irradiation time on saturated thermoplastic block copolymers. The one-terminal triboelectrically-patterned tactile sensor (TPTS) perceives the position and time of dynamic contact motions such as sliding, ball rolling, sequential or simultaneous touches, and grasping. We believe that this study will pave the way for the novel design of self-powered tactile sensors for various applications such as artificial skin.

System approach to the underground construction objects planning based on foresight and cognitive modelling methodologies

The system approach to the underground construction objects planning based on foresight and cognitive modeling methodologies is proposed. Using the foresight methodology allows with the help of expert estimation procedures to identify critical technologies and build alternatives of scenarios with quantitative characteristics. For the justified implementation of a particular scenario the cognitive modelling is used, which allows to build causal relationships based on knowledge and experience, understand and analyze the behaviour of a complex system for a strategic perspective with a large number of interconnections and interdependencies. The suggested system approach allows planning of underground objects on the basis of reasonable scenarios selection and justification of their creation priority.

Оптимизация сборочного производства на основе имитации сетей Петри

The paper describes the approach to solving the problem of optimal planning of the production process. A discrete production system represented by the operations of machining, welding and painting was chosen as the object of research. The study states the problem of optimization of assembly production, which contains a typical criterion of optimality. A mechanism for meeting the criterion using a simulation model based on a Petri net is determined. The rules for developing feedback on the state of the network model and a method for controlling the simulation of the Petri net based on the analysis of its states are given. A binary function is used to analyze the states of the model. The developed approach to process optimization develops the theory of Petri nets, makes it more suitable for modeling complex systems with a branched structure and a large number of interconnections, which is a typical situation for production systems. The most universal approaches of control theory, e.g. feedback principle, are used, which implies a significant degree of universality and replicability of the approach. On the basis of the developed theoretical provisions, a test example is presented that characterizes the effect of their application. The presence of assembly production at most mechanical-engineering enterprises determines the high practical significance of the developed approach

Integrative Approach to Assessing the Complex of Correlations between Indicators of Physiological Functions.

We present the results of application of the combined correlation matrix method in some clinical studies. A practical algorithm is proposed for constructing a correlation matrix that compactly reflects a large number of interconnections for the situations when several diagnostic methods are used in an experimental clinical or preclinical trial. Several approaches to assessing and displaying the relationships are demonstrated for comparison.

Equivalent Circuit Based Performance Coupling Analysis Method for Lead Wire Interconnection with Defects

There are a large number of interconnections in the microwave module, among which the lead wire interconnection is widely used. Under the environmental load, the solder joint of the lead wire interconnection often appears to have cracks and other defects, which directly affect the return loss and insertion loss when transmitting electrical signals through solder joints, and indirectly affect the performance of the microwave module. For this reason, the segmented modeling method is realized by segmenting the lead wire interconnection structure into two parts in this paper, and the equivalent circuit model of the lead wire interconnection with the cracked solder joint is established using the equivalent circuit method. The correlation mechanism of the shape of the solder joint of the lead wire interconnection is studied, and formulas for predicting electrical performance based on return loss and insertion loss are derived. This paper realizes the prediction of the electrical performance of the lead wire interconnection with the defect, and can provide a reference for engineers and technicians.

Modelling and characterisation of ultrasonic joints for Li-ion batteries to evaluate the impact on electrical resistance and temperature raise

Abstract In automotive and stationary Li-ion battery packs, a large number of individual cells, typically hundreds to thousands of cells, are electrically connected to achieve pack specification. These large number of interconnections are mainly achieved by welding cell tab to bus-bar using a welding technique of choice. Ultrasonic metal welding (UMW) is one of the common joining technique employed to join pouch cell’s tabs to bus-bar. Although commonly employed, there is little research currently exist in literature reporting the joint characteristics in terms of electrical resistance and temperature raise due to charge-discharge current. Li-ion batteries reaching sub-milliohm internal resistance, risks the temperature raise at the joint could be even higher than the cell itself which raise a serious safety concern and they are to be addressed. This research investigates the electrical and thermal characteristics of ultrasonic joints of 0.3 mm aluminium/nickel coated copper tabs to 1.0 mm copper bus-bar. This article reports the dynamic behaviour of electrical resistance and corresponding temperature increase as a result of current flow. To capture the electrical and thermal behaviour of the joint, a numerical model has been developed and validated with experimental results, which can be employed to analyse battery pack performance.

Application of BIM technology in operation of port marine structures

The features of the BIM model development for marine port facilities operation are discussed. Infrastructure objects differ significantly from linear and area objects, the use of information modeling for transport infrastructure requires a new approach to organization of design, construction and especially for operation. Most seaports were built long ago and there is not to have the project documentation for them. It is therefore very relevant is the problem of adapting existing building and design documentation to develop models of operation. Infrastructure projects always have a large number of interconnections that are irregular and difficult to formalize into an information model. Port berthing facilities in an intensive mode interact with the courts, a water space, the cargo base and special cargo handling equipment. On the example of the design model of the seaport, we collected sufficient data for their further integration into the BIM model and the transfer of information in digital form for its repeated use at different stages of the life cycle of the seaport. The individual information schemes and elements for standardization of the design of offshore mooring structures, taking into account of turnover in object-oriented format with attribute data are offered. The model includes the necessary information on all parameters of operation of the berthing facility, planning of measures for emergency situations, standard calendar work plan, schedules for monitoring the technical condition, financial estimates for operational maintenance, repairs, etc. The activities on the automation of deformation monitoring system, calculation of structural strength of the main structural elements and control risks are additionally proposed. The transition to life-cycle contracts in the operation of marine berthing facilities is justified.

Identifiability of large-scale non-linear dynamic network models applied to the ADM1-case study

In this work, both the structural and practical identifiability of the Anaerobic Digestion Model no. 1 (ADM1) is investigated, which serves as a relevant case study of large non-linear dynamic network models. The structural identifiability is investigated using the probabilistic algorithm, adapted to deal with the specifics of the case study (i.e., a large-scale non-linear dynamic system of differential and algebraic equations). The practical identifiability is analyzed using a Monte Carlo parameter estimation procedure for a ‘non-informative’ and ‘informative’ experiment, which are heuristically designed.The model structure of ADM1 has been modified by replacing parameters by parameter combinations, to provide a generally locally structurally identifiable version of ADM1. This means that in an idealized theoretical situation, the parameters can be estimated accurately. Furthermore, the generally positive structural identifiability results can be explained from the large number of interconnections between the states in the network structure. This interconnectivity, however, is also observed in the parameter estimates, making uncorrelated parameter estimations in practice difficult.

3-D TSV Six-Die Stacking and Reliability Assessment of 20- $\mu$ m-Pitch Bumps on Large-Scale Dies

3-D integration typically involves multiple chips stacking with large numbers of interconnections within each chip. There are several fundamental technology challenges that need to be addressed in order to realize 3-D integration, such as Cu through-silicon via (TSV) expansion, transistor degradation or open failures on Cu contamination, microbump stress, and so on. The reliability issues on TSV and microbumps are very critical not only for a stacked chip package, but also during wafer-level processes. In this paper, the authors successfully stacked six chips with a thickness of 50 $\mu \text{m}$ and assessed their reliability. Each chip consists of 122054 bumps with a bump diameter of $10~\mu \text{m}$ and a pitch of 20 $\mu \text{m}$ . These bumps were built directly on TSVs, which have a diameter of $5~\mu \text{m}$ . Measured electrical resistance is well matched with calculated electrical resistance. Finally, this paper presents the reliability results of the 3-D IC packages that are embedded in molding compound.

A Thin-Film, Large-Area Sensing and Compression System for Image Detection

This paper presents a sensing and compression system for image detection, based on large-area electronics (LAE). LAE allows us to create expansive, yet highly-dense arrays of sensors, enabling integration of millions of pixels. However, the thin-film transistors (TFTs) available in LAE have low performance and high variability, requiring the sensor data to be fed to CMOS ICs for processing. This results in a large number of interconnections, which raises system cost, and limits system scalability and robustness. To overcome this, the presented system employs random projection, a method from statistical signal processing, to compress the pixel data from a large array of image sensors in the LAE domain using TFTs. Random projection preserves the information required for subsequent classification, and, as we show, is highly tolerant to device-level variabilities and amenable to parallelized implementation. The system integrates an amorphous-silicon (a-Si) TFT compression circuit with an array of a-Si photoconductors, representing an 80 × 80 active matrix, performing up to 80× compression of the 80 signal interfaces. For demonstration, image classification of handwritten digits from the MNIST database is performed, achieving average error rates of 2-25% for 8-80× compression (e.g., 7% at 20× compression).

(Invited) Near-Field Coupling Integration Technology

Invention of IC was driven by “Tyranny of Numbers”, a challenge implied by large number of interconnects in a large-scale system. Modern ICs integrate many miles of wiring and billions of contacts. Moore's Law, however, will die, and we cannot rely just on integration on a chip. A revolutionary solution of the connection problem is now needed for further integration. Our proposal, as More-Than-Moore, is to replace mechanical connection using wiring, solder, and connectors by electrical one using near-field coupling. Transmission Line Coupler by electromagnetic coupling for module connection and ThruChip Interface by inductive coupling for chip stacking is presented and discussed in this paper.

(Invited) Near-Field Coupling Integration Technology

Invention of IC was driven by “Tyranny of Numbers”, a challenge implied by large number of interconnects in a large-scale system. Modern ICs integrate many miles of wiring and billions of contacts. Moore's Law, however, will die, and we cannot rely just on integration on a chip. A revolutionary solution of the connection problem is now needed for further integration. My proposal, as More-Than-Moore, is to replace mechanical connection using wiring, solder, and connectors by electrical one using near-field coupling. In this presentation, ThruChip Interface by inductive coupling for chip stacking and Transmission Line Coupler by electromagnetic coupling for module connection will be presented and discussed.

Deeply Pipelined Digit-Serial LDPC Decoding

Highly parallel VLSI implementations of low-density parity-check (LDPC) decoders have a large number of interconnections, which can result in designs with low logic density. Bit-serial architectures have been developed that reduce the number of wires needed, however, they do not fully realize the potential for deeply pipelined serial data processing. Digit- online arithmetic allows operations to be performed in a serial, digit-by-digit manner, making it ideal for use in implementing a digit-serial LDPC decoder. Digit-online circuits for the primitive operations required for an offset min-sum LDPC decoder are simple, and allow deep pipelining at the digit level. A new hardware architecture for LDPC decoding is demonstrated, using redundant number systems for the internal representation of values. We present post-layout decoder results for the (2048, 1723) 10GBASE-T LDPC code in a general-purpose 65 nm CMOS technology. The decoder requires a core area of 10.89 mm and operates at a clock frequency of 980 MHz. The decoder can simultaneously decode two 4-bit frames at 41.8 Gbit/s or one 10-bit frame at 20.9 Gbit/s.

Overlapping Partitioning Techniques for Simulation of Strongly Coupled Distributed Interconnects

The large number of interconnects in high-speed circuits is a major bottleneck for fast simulation of such circuits. Recently, waveform relaxation methods based on transverse partitioning (WR-TP) were proposed to address this issue. It was shown that the complexity of WR-TP grows only linearly with the number of lines. However, as the coupling between the lines becomes stronger, the WR-TP algorithm either fails to converge or the number of iterations required for convergence increases. In this paper, an overlapping partitioning method for WR-TP is presented, which overcomes the effect of strong coupling between the lines. Numerical examples are presented which demonstrate the accuracy and efficiency of the proposed method for tightly coupled lines.

TU-B-220-03: Development of CMUT Transducer Array Assemblies for Medical Diagnostics

Purpose: Significant work in the last 10 years has been directed towards the development of capacitive Micromachined Ultrasound Transducer (cMUT) arrays and associated assemblies for medical imaging. These implementations are intended to address a spectrum of applications including Intra‐Vascular (IVUS), Low Cost Portable and large area arrays for breast imaging among others. The close integration of cMUT arrays with associated processing electronics is intended to alleviate a series of issues having direct bearing on product arrays: Electrical loading of the cMUTs during transmit and receive leads to a reduction in round‐trip sensitivity as well as increased power dissipation. Large 2D arrays required for real‐time volumetric imaging require 10's of thousands of elements resulting in a significant bottleneck for traditional cable‐based interconnects. The cost of interconnect and processing channels built using standard techniques in current ultrasound machines when scaled from 100's of elements to 10's of thousands is prohibitive. This talk will examine the issues around close integration and explore the proposed solutions to address these challenges. Method and Materials: The close integration of cMUT transducers with associated processing electronics promises to yield improvements in image quality, probe manufacturability and reduction in cost for point of care and large area arrays. To date there have been at least three solutions to these issues proposed: i) Fabrication of cMUTs directly on top of the electronic devices, ii) Direct assembly of cMUT chips to the associated electronics, and iii) Double‐sided flip‐chip assembly of both the cMUT arrays and the electronics to an intervening substrate made of organic or other materials. Each of these methods has associated benefits and disadvantages and these will be reviewed along with the presentation of the results of our work in some of these areas. Results: To date we have explored the direct attach of cMUTs to electronics as well as double‐sided flip‐chip attach using rigid interposers. Interposers promis to provide the ability to realize seamless tiling of array modules for fabrication of large array areas for full field of view automated breast ultrasound. However, due to the very large number of interconnects and through substrate vias needed via density remains challenging. We will present the results of our latest work in this area. Direct attach of cMUTs to associated electronics is promising for point of care low cost probes. However large area arrays based on this approach rely on the availability of high voltage TSVs which are not yet available in volume production. Fabrication of cMUTs directly on top of device electronics has been explored by other groups and some recent results will be briefly reviewed. Conclusions: Significant challenges remain in close integration of cMUTs with associated interface electronics for complex transducer array assemblies. Three currently proposed solutions to close integration have been reviewed. It is likely that each of these will find a niche in specific applications.

Campo de pesquisa em contabilidade: uma análise de redes sob a perspectiva institucional

This investigation aims to identify the important authors and the key institutions involved in the field of research in accounting from 2004 to 2008, from the perspective of institucional theory. A bibliometric and sociometric study was conducted, of a descriptive nature, in which 825 articles from journals and periodicals were analysed. These were divided into three thematic areas: education and research; managerial accounting; and external users. The networks of cooperation have been presented, considering the institutions as a whole and the authors divided according to thematic areas. Posteriorly, the study proceded to analyze the institutions and the authors who showed the most publications in the sample. The main results showed that a) the area of external users has the largest number of publications and that the area of education and research is on the rise; b) the university USP stands out as the institution with the highest number of links to authors and as being the central actor in the network of cooperation among institutions; c) the network of cooperation, on the theme of education and research, is shown to be more fragmented; d) the networks whose themes are managerial accounting and, mainly, the external users stand out by presenting a large number of interconnections between groups by means of weak ties. It follows that the field analysis is marked by the existence of dense networks of cooperation between authors and among national institutions, but low regarding international institutions. It may be noted, also, that the analyses, applying concepts from institutional theory, allowed the identification of principal agents in the field of accounting research.

The Role of Optics and Electronics in High-Capacity Routers

This paper examines the role of optical and electronic technologies in future high-capacity routers. In particular, optical and electronic technologies for use in the key router functions of buffering and switching are compared. The comparison is based on aggressive but plausible estimates of buffer and switch performance projected out to around 2020. The analysis of buffer technologies uses a new model of power dissipation in optical-delay-line buffers using optical fiber and planar waveguides, including slow-light waveguides. Using this model together with models of storage capacity in ideal and nonideal slow-light delay lines, the power dissipation and scaling characteristics of optical and electronic buffers are compared. The author concludes that planar integrated optical buffers occupy larger chip area than electronic buffers, dissipate more power than electronic buffers, and are limited in capacity to, at most, a few IP packets. Optical fiber-based buffers have lower power dissipation but are bulky. The author also concludes that electronic buffering will remain the technology of choice in future high-capacity routers. The power dissipation of high-capacity optical and electronic cross connects for a number of cross connect architectures is compared. The author shows that optical and electronic cross connects dissipate similar power and require a similar chip area. Optical technologies show a potential for inclusion in high-capacity routers, especially as the basis for arrayed-waveguide-grating-based cross connects and as components in E/O/E interconnects. A major challenge in large cross connects, both optical and electronic, will be to efficiently manage the very large number of interconnects between chips and boards. The general conclusion is that electronic technologies are likely to remain as integral components in the signal transmission path of future high-capacity routers. There does not appear to be a compelling case for replacing electronic routers with optically transparent optical packet switches