Abstract
There are a large number of interconnections in the microwave module, among which the lead wire interconnection is widely used. Under the environmental load, the solder joint of the lead wire interconnection often appears to have cracks and other defects, which directly affect the return loss and insertion loss when transmitting electrical signals through solder joints, and indirectly affect the performance of the microwave module. For this reason, the segmented modeling method is realized by segmenting the lead wire interconnection structure into two parts in this paper, and the equivalent circuit model of the lead wire interconnection with the cracked solder joint is established using the equivalent circuit method. The correlation mechanism of the shape of the solder joint of the lead wire interconnection is studied, and formulas for predicting electrical performance based on return loss and insertion loss are derived. This paper realizes the prediction of the electrical performance of the lead wire interconnection with the defect, and can provide a reference for engineers and technicians.
Highlights
With the development of electronic equipment towards high frequency, high density, and high reliability, the requirements for assembly interconnection among modules in microwave components are becoming higher [1], especially as a lead wire interconnection method in typical interconnection processes
The self-inductance of the solder joint still exists under high frequency conditions, and the AC resistance in the equivalent circuit model of the solder joint is related to the working frequency
Skin effect changes the current distribution inside the solder joint of lead wire interconnection at a high frequency, which leads to the increase of the transmission line impedance and the increase of signal transmission loss
Summary
With the development of electronic equipment towards high frequency, high density, and high reliability, the requirements for assembly interconnection among modules in microwave components are becoming higher [1], especially as a lead wire interconnection method in typical interconnection processes. Because electronic equipment often works under the environment of high and low continuous of changing temperature and strong vibration load, it often causes cracks in the solder joint of high frequency microwave components [2,3]. Under high frequency conditions, the parasitic capacitance of the solder joint cannot be ignored. Skin effect changes the current distribution inside the solder joint of lead wire interconnection at a high frequency, which leads to the increase of the transmission line impedance and the increase of signal transmission loss. The impedance discontinuity caused by defects of the solder joint will lead to further deterioration of the signal transmission quality. The effect of morphology and geometry parameters of the solder joint on the electromagnetic signal transmission in the high frequency band must be further studied. The morphology and geometric parameters of solder joints change directly owing to the Electronics 2020, 9, 642; doi:10.3390/electronics9040642 www.mdpi.com/journal/electronics
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