Sample rotation has always been present in surface analysis techniques when selecting the place to be analysed, ex situ and more recently in situ in the spectrometers' ultrahigh vacuum chambers. However, in this work the advantage of sample rotation during Auger electron spectroscopy sputter depth profiling is shown by a systematic investigation of multilayer Cr/Ni thin films and some other samples from everyday analytical practice. The sample rotation reduced, or—at a favourable sample sputtering geometry, i.e. at a large ion incidence angle—even eliminated some ion beam and sample effects, which optimizes the depth resolution and enables us to keep it constant also in the depth of multicrystalline thin film structures. The more uniform ion sputtering rate is achieved by averaging local incidence angles and by making the ions strike the sample from different sides, as in the case of a multidirectional ion source; all these suppress the sputter-induced roughness, polish the initially rough surfaces and essentially decrease the ion-beam-angle-dependent effects, namely sputtering yield, preferential and selective sputtering as well as the effects caused by the non-homogeneity of the ion beam. The combination of sample rotation and a large ion incidence angle ( > 80°) also reduces other effects on Δ z such as ion mass and energy influence and ion-beam-induced transport processes perpendicular to the sample surface, while a beneficial influence on the reduction in the beam effects on compound samples, such as nitrides and oxides, was also observed; this should be investigated in more detail.
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