A 1.1-V 6.4-Gb/s/pin 16-Gbit DDR5 is presented in 10-nm class CMOS technology. Various functions and circuits' techniques are newly adopted to improve performance and power consumption compared with DDR4 SDRAM. First, to realize two times higher speed than DDR4, the injection-locked oscillator (ILO) delay locked loop (DLL) is adopted for the low jitter high-speed performance. The proposed DLL with phase rotator (PR) and ILO allows to minimize the clock tree of DRAM, lowering skew and jitter in the DRAM internal clock path. Second, for the high-speed write operation, DQS gate opening control and write leveling are very important to minimize the turnaround time of DRAM, and thus new sequence and logic for the write-level training are introduced in this article. Third, to maximize the data valid window of read DQs, duty cycle adjustable serialize circuit methods are proposed. Finally, to improve the interface speed, the decision feedback equalization (DFE) and feedforward equalization (FFE) are adopted to Rx and Tx, respectively. By implementing all the items mentioned earlier, the 1.1-V 6.4-Gb/s/pin 16-Gbit DDR5 achieved 6.4-Gb/s/pin performance at 1.05-V V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DD</sub> , with its power bandwidth efficiency 30% higher than that of DDR4.