Μm Complementary Metal Oxide Semiconductor Research Articles

Design and application of D‐band bandpass filter based on 0.18 μm complementary metal oxide semiconductor process

AbstractThis paper designs a bandpass filter for D‐band and 0.18 μm complementary metal oxide semiconductor (CMOS) process. The bandpass filter is composed of an inverted L‐shaped coupling microstrip line and a cross‐coupled resonator, and is coupled to produce two controlled transmission zeros. A defected ground structure is used to make a good impedance match. The designed filter has a 3 dB impedance bandwidth of 52 GHz (149–201 GHz) with a center frequency of 175 GHz and an insertion loss of 3.23 dB. The design of this paper is a CMOS 0.18 μm process capable of applying the D‐band bandpass filter with the advantages of lower insertion loss, broadband, and compact size.

Integrated package and calibration of high-g MEMS ASIC acceleration sensor

To achieve the intelligentization and miniaturization goals of high-g acceleration sensors, this paper proposes a super high-g accelerometer using ASIC (Application-Specific Integrated Circuit) and MEMS (Micro-Electro-Mechanical Systems) integrated packaging. The sensor structure is a membrane island structure and the ASIC interface is manufactured using 0.35 µm CMOS (Complementary Metal-Oxide-Semiconductor) technology. Two prototypes were calibrated and the sensitivities are 0.206 µV/g and 0.337 µV/g. The package frequency of sensors is 74.5 kHz. The sensor range is 200,000 g, with an overload resistance of up to 250,000 g, the enhancement of overload resistance of sensors with integrated ASIC chips has been achieved. The resolution of the prototype is 371.10 g, which is 71.95 % higher compared to the sensor without integrated ASIC. The signal-to-noise ratio (SNR) is 72.363 dB, which has been improved by 24.73 %, verifying the effective improvement of resolution and SNR of the sensors with the addition of ASIC chips.

Design of SEE-Tolerant analog switch chip with a novel diode structure *

This paper proposes a novel circuit-level design in order to enhance the radiation tolerance of an analog switch integrated circuit. After analyzing the mechanisms of single-particle sensitivity in a high-voltage analog switch chip fabricated using a commercial 1 μm complementary metal–oxide–semiconductor process, a diode unit was employed to reduce the V GS (voltage between the gate and the base) of the parasitic triode within the metal–oxide–semiconductor field-effect transistor of the switch. This reduction lowered the probability of activating the parasitic triode in response to single-event effect (SEE). Subsequently, single-particle irradiation experiments proceeded with the high-voltage analog switch chip, both with and without the diode unit. In the unreinforced device, the current of the power supply reached 100 mA within 11 s of single-particle irradiation at 75.8 MeV•cm2 mg−1. In contrast, in the reinforced device, the current of the power supply remained relatively stable under irradiation at both 37.2 and 75.8 MeV•cm2 mg−1. These findings indicate that the reinforced analog switch chip exhibits an SEE tolerance exceeding 75.8 MeV•cm2 mg−1, highlighting its potential to enhance the radiation tolerance of analog switches.

Ultra-low-power super class-AB adaptive biasing operational transconductance amplifier with enhanced gain for biomedical applications

The operational transconductance amplifier (OTA) proposed in this article is a bulk-driven (BD), single-stage, super-class-AB, adaptive biasing, functioning in the subthreshold region (ST) with an enormously low power supply of ± 0.25 V, providing high-gain. The input core of the OTA circuit is composed of adaptively biased BD differential input pairs based on flipped voltage follower (FVF), which drive in class-AB mode with a partial positive feedback (PPF) approach. The circuit additionally employs FVF and self-cascode (SC)-based low-power current mirror loads at its output to obtain significantly high gain and unity gain frequency. In addition, using adaptive loads based on source-degenerated metal oxide semiconductor (MOS) resistors raises dynamic current more efficiently, consequently improving the slew rate and unity gain frequency (UGF) without drawing additional power. Employing the cadence spectre tool and the UMC 0.18 μm complementary metal oxide semiconductor (CMOS) process technology, the designed OTA has been simulated. The simulation outcomes substantiate that the amplifier provides high open loop DC gain of 75 dB, 18.75 kHz UGF with a phase margin of 63.93º, and input-referred noise (IRN) of 0.734 µV/Hz0.5 at 1 kHz frequency. The proposed OTA consumes just 60.15 nW of power. The performance results confirmed that the proposed OTA circuit is appropriate in biomedical applications.

Analysis of an operational trans-conductance amplifier with positive feedback

In this paper, we present an analysis of an operational trans-conductance amplifier (OTA) with two positive feedback. The direct current (DC) transfer function is obtained by analyzing the OTA using the drain current in the weak inversion region. The analysis results were verified through comparison with SPICE simulations, and the characteristics of the DC transfer function analysis for the OTA design are well matched with the simulation results. The designed OTA dissipates a low power of 41.4 nW, and features the slew rate is improved by 436% compared to a conventional OTA without two positive feedback. Additionally, a DC gain and a unity-gain bandwidth is improved by 36 dB and 6.7 times, respectively. The OTAs are designed for the 0.18 μm complementary metal–oxide–semiconductor (CMOS) process.

A Li-ion battery charger based on LDO regulator with pre-charge mode in 180 nm CMOS technology

This paper presents a novel Li-Ion battery charger that utilizes a low-dropout (LDO) regulator and incorporates four control modes: low constant current mode, pre-charge current mode, fast constant current mode, and constant voltage mode. The charger aims to meet specific criteria such as high precision, high efficiency, and small form factor. Through simulation results, the following specifications were obtained using a 1.8 V supply in a 0.18 μm complementary metal–oxide–semiconductor (CMOS) technology: a trickle current of 124.7 mA, a pre-charge current of 466.94 mA, a maximum charge current of 1.06 A, and a charge voltage of 4.21 V. The proposed charger demonstrates an efficiency of 92%.

Piezoelectric energy harvesting interface with fast open-circuit voltage sampling

This paper presents a piezoelectric energy harvesting interface with fast open-circuit voltage (VOC) sampling and a wide operating frequency range. The fractional open-circuit voltage (FOCV) method is the primary method for maximum power point tracking (MPPT) in energy harvesting systems, due to its easy implementation and relatively low cost. For this method to be efficient, it is necessary to shorten the time required for VOC sampling. To minimize power loss due to VOC sampling, a novel technique is proposed that is capable of sampling the VOC within a time shorter than half a cycle by using an adaptive tracking pulse instead of conventional fixed ones. We also present a peak detector design technique that can operate across a broad frequency spectrum and adapt to diverse vibration scenarios. The proposed technique reduces the duty cycle of the tracking pulse to 0.42%, which is 3.7 times smaller than the conventional 1.56%. The proposed circuit, designed using a 0.35μm complementary metal oxide semiconductor (CMOS) process, consumes just 94nA at 100Hz, 3V VOC, and a 1kΩ load. In a 2~4V VOC range and a 15~500Hz frequency range, the MPPT efficiency exceeds 95%, peaking at 99.9%, and the power efficiency remains over 93%, reaching a maximum of 97.7%.

Reconfigurable Low-Power CMOS Amplifier Stages for Broadband Impedance Spectroscopy

In this paper, a fully differential amplifier is proposed in a 1.8 V-0.18 μm CMOS (Complementary Metal-Oxide-Semiconductor) technology, which can accommodate both voltage (V-mode) and current (C-mode) inputs. Post-layout simulation results show a fixed gain amplifier exhibiting a 26 dB (V-mode)/89 dBΩ (C-mode) gain and a programmable gain amplifier featuring a 6–26 dB gain, overall yielding a 26.8–46.4 dB dB (V-mode)/89.6–109.2 dBΩ (C-mode) programmable gain range, with a 100 MHz bandwidth and a power and area consumption of 360.5 µW and 0.0177 mm2, respectively. This amplifier has been designed considering the constraints and specifications (including low voltage, low power, reduced noise and high common mode rejection ratio) for its use in an analogue Lock-in-based Frequency Response Analyser-Impedance Spectroscopy (FRA-IS) device. The proposed design introduces a novel fully differential open-loop structure based on a transconductance–transimpedance (TC-TI) topology for high performance applications with a broad programmable bandwidth. To compare this work, different figures of merit (FoMs) are introduced as well as a comparison table with other simulated and experimental results, reporting an overall better performance in terms of gain, frequency and power-area consumption.

An on-chip soft-start pseudo-current hysteresis-controlled buck converter for automotive applications

This paper introduces a novel direct current to direct current (DC-DC) buck converter that uses a pseudo-current hysteresis controller and an on-chip soft start circuit for improved transient performance in automotive applications. The proposed converter, implemented with Taiwan semiconductor manufacturing company (TSMC) 0.18 µm complementary metal oxide semiconductor (CMOS) one-poly-six-metal (1P6M) technology, includes a rail-to-rail current detection circuit and an on-chip soft start circuit to handle transient responses and improve efficiency. Transient response analysis shows fast settling times of 28 µs for both load current changes from 100 mA to 1 A and reversals with consistent transient voltages of approximately 190 mV and peak power efficiency of 99.32% at 5 V output voltage and 100 mA load current. Additionally, the converter maintains a constant output voltage of approximately 5 V across the entire load current range with an average accuracy of 90.41%. A comparative analysis with previous work shows superior performance in terms of figure of merit (FOM). Overall, the proposed pseudo-current hysteresis controlled buck converter exhibits remarkable transient response, load regulation and power efficiency, positioning it as a promising solution for demanding applications, particularly in automotive systems where precise voltage regulation is crucial.

A 90.9 dB SNDR 95.3 dB DR Audio Delta-Sigma Modulator with FIA-Assisted OTA.

This paper presents a low-power, high-gain integrator design that uses a cascode operational transconductance amplifier (OTA) with floating inverter-amplifier (FIA) assistance. Compared to a traditional cascode, the proposed integrator can achieve a gain of 80 dB, while reducing power consumption by 30%. Upon completing the analysis, the value of the FIA drive capacitor and clock scheme for the FIA-assisted OTA were obtained. To enhance the dynamic range (DR) and mitigate quantization noise, a tri-level quantizer was employed. The design of the feedback digital-to-analog converter (DAC) was simplified, as it does not use additional mismatch shaping techniques. A third-order, discrete-time delta-sigma modulator was designed and fabricated in a 0.18 μm complementary metal-oxide semiconductor (CMOS) process. It operated on a 1.8 V supply, consuming 221 µW with a 24 kHz bandwidth. The measured SNDR and DR were 90.9 dB and 95.3 dB, respectively.

An Optimized Temperature Compensated Ring Oscillator with Low Power Consumption and Low Variation

In this paper a low power ring oscillator with three differential delay stages and one output buffer stage is designed for Radio Frequency Identification (RFID) applications. The proposed oscillator is designed with neural network model and its parameters are optimized with Teaching–Learning Based Optimization (TLBO) algorithm. The central frequency of the oscillator becomes independent of the temperature with the help of two temperature compensation techniques. In the first technique, the PMOS load transistor of each stage is connected to the NMOS diode connected - in series - transistor. Since these two transistors work in complement of each other, the temperature variation of each stage’s output voltage is decreased. In the second technique, the current variation of oscillator stages versus temperature is reduced since the diode connected transistor is employed in the current source structure. The simulation is done in 0.18 µm Complementary Metal-Oxide Semiconductor (CMOS) technology with the help of Cadence software and the chip area of the layout designed with this software is 19×25 µm2. The designed oscillator exhibits the following parameters: a central frequency of 7.5 MHz, the power dissipation is 238 nW and the frequency deviation is 210 ppm/̊C in the temperature range of 0 to 120ºC, the noise phase and the period jitter are -87.05 dBc/Hz and 0.578 ns (rms), respectively, at 100 KHz offset frequency and 10000 clock cycle.

An 8 bit-ENOB Sampling-rate Reconfigurable Asynchronous SAR ADC with Metastability Watchdog Circuit for Activity-driven Multi-Channel CMOS Readout ASICs for Space Applications

This article presents an innovative architecture and design of an 8-bits Effective-Number-of-Bits (ENOB) Asynchronous Successive-Approximation-Register (ASAR) Analog-to-Digital-Converter (ADC), aiming at activity-driven multi-channel Complementary-Metal-Oxide-Semiconductor (CMOS) readout Application-Specific-Integrated-Circuits (ASICs) for imaging and spectroscopic applications in space field. The proposed ADC needs only a single low duty-cycle clock signal ‘CLKSampling’ to initiate the conversion process and generates all other required clock signals internally. Unlike conventional ASAR ADCs, this ADC makes use of a unique rising edge only variable delay-cell to introduce desired delay values to the internally generated clock signal. In addition, the ADC features sampling-rate (fs)-reconfigurability, from typical 40 kHz to 167 kHz, with a proportional power consumption. Also, the proposed architecture is flexible with respect to the time-period and duty-cycle of the ‘CLKSampling’ signal, that can be tailored keeping in view the primary requirements of the desired applications. Moreover, the proposed design is equipped with a simple metastability watchdog circuitry. Fabricated in a 0.35 µm CMOS process at 3.3 V supply, the ADC secures a measured ENOB, and Signal-to-Noise-and-Distortion-Ratio (SNDR) of 7.76-bits, and 48.47 dB, respectively at the typical fs of 40 kHz. Measured Integral-Non-Linearity (INL), and Differential-Non-Linearity (DNL) are within one LSB. The ADC normalized figure-of-merit (FoMWN) - proposed to fairly compare high voltage-based ADCs with low voltage-based ADCs - is 476 fJ/C-step at its maximum fs with all the sections of the ADC operating at 3.3 V. The FoMWN improves to 261.7 fJ/c-step and 243 fJ/c-step with the digital section and delay-cell operated at 1.2 V with and without level-shifters power contribution, respectively without any performance deterioration.

Design and Analysis of Complementary Metal–Oxide–Semiconductor Single-Pole Double-Throw Switches for 28 GHz 5G New Radio

We propose a single-pole double-throw (SPDT) switch with low insertion loss (IL), high isolation, and high linearity for a 28 GHz 5G new radio. The transmit (TX) path is a π-network consisting of a parallel dynamic-threshold metal–oxide–semiconductor (DTMOS) transistor, M1, with large body-floating resistance, RB (DTMOS-R M1), a series one-eighth-wavelength (λ/8) transmission line (TL), and a parallel capacitance, Cant. The series λ/8-TL in conjunction with the parallel Cant and transistors’ capacitance constitute an equivalent λ/4-TL with a characteristic impedance of 50 Ω. This leads to low IL in the TX mode and decent isolation in the receive (RX) mode. The RX path is an L-network constituting a series impedance (of parallel inductance L1 and DTMOS-R M2) and a parallel DTMOS-R M3. This leads to a decent IL in the RX mode and isolation in the TX mode. The first SPDT switch (SPDT SW1) is designed and implemented in a 90 nm complementary metal–oxide–semiconductor (CMOS) with a top metal thickness (TMT) of 3.4 μm. A comparative SPDT switch (SPDT SW2) in a 0.18 μm CMOS with a thinner TMT of 2.34 μm is also designed and implemented. In the TX mode, SPDT SW1 achieves a measured IL of 0.67 dB at 28 GHz and 0.58–1 dB for 17–34.9 GHz and a measured isolation of 44.3 dB at 28 GHz and 25.6–62.3 dB for 17–34.9 GHz, one of the best IL and isolation results ever reported for millimeter-wave CMOS SPDT switches. The measured input 1 dB compression point (P1dB) is 28.5 dBm at 28 GHz. Moreover, in the RX mode, SPDT SW1 attains a measured IL of 1.9 dB at 28 GHz and 1.83–2.1 dB for 25–38.3 GHz and an isolation of 25 dB at 28 GHz and 24.5–27 dB for 25–38.3 GHz. The measured P1dB is 24 dBm at 28 GHz.

Design and Validation of a V-Gate n-MOSFET-Based RH CMOS Logic Circuit with Tolerance to the TID Effect

This study designed a radiation-hardened (RH) complementary metal oxide semiconductor (CMOS) logic circuit based on an RH variable-gate (V-gate) n-MOSFET that was resistant to the total ionizing dose (TID) effect and evaluated its tolerance to radiation. Among the different CMOS logic circuits, NOT, NAND, and NOR gates were designed using V-gate n-MOSFETs by employing layout transformation techniques and standard p-MOSFETs. Before the process design, we predicted the radiation damage using modeling and simulation techniques and validated the tolerance by conducting actual radiation tests after the process design. Furthermore, we implemented the CMOS logic circuit process design in a 0.18 µm CMOS bulk process. The actual radiation test applied a total cumulative radiation dose of 25 kGy at 5 kGy per hour in a high-level gamma-ray irradiation facility. Consequently, the resistance of the RH CMOS logic circuit based on the RH V-gate n-MOSFET to the TID effect was validated through experiments.

Design of 5.1 GHz ultra-low power and wide tuning range hybrid oscillator

<p><span lang="EN-US">The objective of the proposed work is to demonstrate the use of a hybrid approach for the design of a voltage-controlled oscillator (VCO) which can lead to higher performance. The performance is improved in terms of the tuning range, frequency of oscillation, voltage swing, and power consumption. The proposed hybrid VCO is designed using an active load common source amplifier and current starved inverter that are cascaded alternatively to achieve low power consumption. The proposed VCO achieves a measured phase noise of -74 dBc/Hz and a figure of merit (FOM) of -152.6 dBc/Hz at a 1 MHz offset when running at 5.1 GHz frequency. The hybrid current starved-current starved VCO (CS-CS VCO) consumes a power of 289 µW using a 1.8 V supply and attains a wide tuning range of 96.98%. Hybrid VCO is designed using 0.09 µm complementary metal–oxide–semiconductor (CMOS) technology. To justify the robustness, reliability, and scalability of the circuit different corner analysis is performed through 500 runs of Monte-Carlo simulation.</span></p>

An Area-Efficient up/down Double-Sampling Circuit for a LOFIC CMOS Image Sensor.

A lateral overflow integration capacitor (LOFIC) complementary metal oxide semiconductor (CMOS) image sensor can realize high-dynamic-range (HDR) imaging with combination of a low-conversion-gain (LCG) signal for large maximum signal electrons and a high-conversion-gain (HCG) signal for electron-referred noise floor. However, LOFIC-CMOS image sensor requires a two-channel read-out chain for LCG and HCG signals whose polarities are inverted. In order to provide an area-efficient LOFIC-CMOS image sensor, a one-channel read-out chain that can process both HCG and LCG signals is presented in this paper. An up/down double-sampling circuit composed of an inverting amplifier for HCG signals and a non-inverting attenuator for LCG signals can reduce the area of the read-out chain by half compared to the conventional two-channel read-out chain. A test chip is fabricated in a 0.18 μm CMOS process with a metal-insulator-metal (MIM) capacitor, achieving a readout noise of 130 μVrms for the HCG signal and 1.19 V for the LCG input window. The performance is equivalent to 103 dB of the dynamic range with our previous LOFIC pixel in which HCG and LCG conversion gains are, respectively, 160 μV/e- and 10 μV/e-.

Low-Cost Indirect Measurements for Power-Efficient In-Field Optimization of Configurable Analog Front-Ends with Self-X Properties: A Hardware Implementation

This paper presents a practical implementation and measurement results of power-efficient chip performance optimization, utilizing low-cost indirect measurement methods to support self-X properties (self-calibration, self-healing, self-optimization, etc.) for in-field optimization of analog front-end sensory electronics with XFAB 0.35 µm complementary metal oxide semiconductor (CMOS) technology. The reconfigurable, fully differential indirect current-feedback instrumentation amplifier (CFIA) performance is intrinsically optimized by employing a single test sinusoidal signal stimulus and measuring the total harmonic distortion (THD) at the output. To enhance the optimization process, the experience replay particle swarm optimization (ERPSO) algorithm is utilized as an artificial intelligence (AI) agent, implemented at the hardware level, to optimize the performance characteristics of the CFIA. The ERPSO algorithm extends the selection producer capabilities of the classical PSO methodology by incorporating an experience replay buffer to mitigate the likelihood of being trapped in local optima. Furthermore, the CFIA circuit has been integrated with a simple power-monitoring module to assess the power consumption of the optimization solution, to achieve a power-efficient and reliable configuration. The optimized chip performance showed an approximate 34% increase in power efficiency while achieving a targeted THD value of −72 dB, utilizing a 1 Vp-p differential input signal with a frequency of 1 MHz, and consuming approximately 53 mW of power. Preliminary tests conducted on the fabricated chip, using the default configuration pattern extrapolated from post-layout simulations, revealed an unacceptable performance behavior of the CFIA. Nevertheless, the proposed in-field optimization successfully restored the circuit’s performance, resulting in a robust design that meets the performance achieved in the design phase.

A low‐power NPN‐based band‐gap voltage reference in an ultra‐wide temperature range

AbstractA low‐power negative‐positive‐negative (NPN)‐based bandgap voltage reference (BGR) over an ultra‐wide temperature range is presented. The conventional NPN‐based BGRs cannot maintain a low‐temperature coefficient (TC) with low power consumption in an ultra‐wide temperature range due to its inherent reverse junction saturation current of NPN bipolar junction transistors (BJT) in the high‐temperature range. This work introduces a new NPN‐based BGR unaffected by such saturation current. Based on Vanguard International Semiconductor Corporation (VIS) 0.18 μm/0.15 μm complementary metal oxide semiconductor (CMOS) Bipolar‐CMOS‐DMOS (BCD) process, the BGR receives the best 1.25‐mV deviation over the temperature range of −40°C to 150°C, much less than 38.5 mV from Brokaw‐type BGR. Meanwhile, the proposed BGR with the stacked NPNs for higher output voltage was fabricated. It consumes about 2 uA from a 5‐V power supply, and its average temperature coefficient is 14.89 ppm/°C. Also, the average line sensitivity is 0.039%/V.

A power efficient fully adiabatic logic circuit design approach: application to inverter and 8421 to excess-3 code converter

Decreasing power consumption is the leading challenge for very-large-scale-integrated (VLSI) designers. This paper introduces an innovative prototype for a power-efficient standard or a fully-adiabatic binary-coded-decimal (BCD) 8421 to Excess-3 (XS-3) code converter. The proposed design is compared with traditional complementary metal oxide semiconductor (CMOS) as well as two popular fully adiabatic logic families: adiabatic dynamic CMOS logic (ADCL) and two phase clocked adiabatic static CMOS logic (2PASCL). This investigation was conducted at frequencies ranging from 100 to 900 MHz. The circuit employs 0.3 μm CMOS technology, with channel length and width set at 0.3 μm and 0.75 μm, respectively. The power savings for the proposed logic at 500 MHz when compared to standard CMOS logic, ADCL, and 2PASCL are 54.54%, 28.57%, and 16.67%, respectively.

Set/Reset Bilaterally Controllable Resistance Switching Ga‐doped Ge2Sb2Te5 Long‐Term Electronic Synapses for Neuromorphic Computing

AbstractLong‐term plasticity of bio‐synapses modulates the stable synaptic transmission that is quite related to the encoding of information and its emulation using electronic hardware is one of important targets for neuromorphic computing. Ge2Sb2Te5 (GST) based phase change random access memory (PCRAM) has become a strong candidate for complementary‐metal‐oxide‐semiconductor (CMOS) compatible integrated long‐term electronic synapses to cope with the high‐efficient and low power consumption data processing tasks for neuromorphic computing. However, the performance of PCRAM electronic synapses is still quite limited due to the challenges in linear and continuous conductance regulation, which originates from the fast and uncontrollable resistance switching characteristic of conventional PCRAM for the data storage application. Here an in‐depth study is reported on the impact of gallium (Ga) doping on GST (GaGST) structural properties and on the corresponding 0.13 µm CMOS technology fabricated PCRAM integrated devices with a mushroom structure. The Ga doping effectively retarded the crystallization process of GST by augmenting the local disorder of GeTe4‐nGen tetrahedron, which subsequently leads to the Set/Reset bilaterally controllable resistance switching of corresponding PCRAM devices. The optimized 6.5%GaGST electronic synapses demonstrate gradual resistance switching characteristics and a good multilevel retention feature and eventually exhibit outstanding long‐term synaptic plasticity like potentiation/depression and spiking time dependent plasticity in four forms. Such long‐term electronic synapses are applied to handwritten digits recognition (96.22%) and CIFAR‐10 image categorization (93.6%) and attain very high accuracy for both tasks. These results provide an effective method to achieve high performance PCRAM electronic synapses and highlight the great potential of GaGST PCRAM as a component for future high‐performance neuromorphic computing.