III-V Compound Semiconductors Research Articles

The impact of cooling rate on the structure and properties of VGF-InP single crystals

InP is a III-V compound semiconductor with a zinc-blende crystal structure, widely used in optical communications, high-frequency millimeter-wave devices, optoelectronic integrated circuits, and solar cells. During the growth of VGF-InP single crystals, defects such as twinning, dislocations, and polycrystals are prone to occur. Experimental research on the cooling rate, an important control condition during the growth process, was conducted. By analyzing a large amount of discrete cooling data from the premium InP production and using spherical fitting algorithms for numerical analysis, the optimal cooling curve was obtained. Forward and reverse experimental verification results show that by adjusting the cooling rate at each growth stage, the recurrence of twinning and dislocations was successfully improved. Increasing the cooling rate during the shouldering process helps suppress intrinsic twinning but tends to increase dislocation density during the equal diameter stage process, leading to dislocation proliferation. Therefore, while increasing the cooling rate during shouldering, it is necessary to appropriately reduce the cooling rate during the equal diameter stage process to effectively suppress dislocation proliferation. By precisely controlling the temperature gradient and cooling rate inside the furnace, the thermal field conditions during the crystal growth process can be optimized, significantly improving the quality of InP single crystals.

Indirect-to-direct bandgap transition in GaP semiconductors through quantum shell formation on ZnS nanocrystals

Although GaP, a III-V compound semiconductor, has been extensively utilized in the optoelectronic industry for decades as a traditional material, the inherent indirect bandgap nature of GaP limits its efficiency. Here, we demonstrate an indirect-to-direct bandgap transition of GaP through the formation of quantum shells on the surface of ZnS nanocrystals. The ZnS/GaP quantum shell with a reverse-type I heterojunction, consisting of a monolayer-thin GaP shell grown atop a ZnS core, exhibits a record-high photoluminescence quantum yield of 45.4% in the violet emission range (wavelength = 409 nm), validating its direct bandgap nature. Density functional theory calculations further reveal that ZnS nanocrystals, as the growth platform for GaP quantum shells, play a crucial role in the direct bandgap formation through hybridization of electronic states with GaP. These findings suggest potential for achieving direct bandgaps in compounds that are constrained by their inherent indirect energy gaps, offering a strategy for tailoring energy structures to significantly improve efficiencies in optoelectronics and photovoltaics.

InP/LiNbO3 Covalent Heterointerface Construction via an Asymmetric Plasma Activation Strategy for Hybrid Integrated Quantum Systems.

Lithium niobate (LiNbO3) is emerging as an appealing candidate for integrated optical applications with enhanced complexity, owing to its inherent abundant optoelectronic properties. To compensate for the inability of LiNbO3 to generate indistinguishable single photons, the evanescent coupling heterointerface constructed between III-V compound semiconductors (e.g., InP) and LiNbO3 through plasma activation provides a feasible solution for balancing the integration efficiency and interfacial stability while achieving sub-50 nm alignment accuracy between devices, thus offering ultracompact on-chip light sources for classical optoelectronics and quantum optics. However, a challenge remains in the formation of the InP/LiNbO3 platform due to the huge mismatch in the coefficient of thermal expansion. Here, we demonstrate the InP/LiNbO3 covalent heterointerface using an asymmetric plasma activation strategy. Different plasmas are used for the activation of InP and LiNbO3 specifically, balancing the enhancement of surface functional group density with the avoidance of defect generation effectively. More importantly, combined with surface comprehensive characterizations and interface performance, we determine that the introduction of ammonia solution enables the surface hydroxyl groups to be "effective" as LiNbO3 surface relaxation increases the chance of -OH groups' contact. Therefore, a robust covalent bond network is established across the InP/LiNbO3 interface at 80 °C with an enhanced bonding strength of 9.7 MPa. Moreover, a hybrid quantum photonic chip based on the InP/LiNbO3 platform is designed to compute the coupling efficiency and the impact of misalignment on it, demonstrating the potential of extending the platform to hybrid integrated quantum systems.

Effect of cap layer and post growth on-site hydride passivation on the surface and interface quality of InAsP/InP hetero and QW structures

The performance of devices made from III-V compound semiconductors relies heavily on their surface and interface properties. The InAsP/InP material system is recently gaining interest due to its suitability for the next generation of long-haul classical and quantum communication applications. Researchers are studying how surface and interface properties affect the efficiency of the device and concludes that the epitaxial growth conditions responsible for creating surface and interface states require further improvement. To address this, we have studied the effect of the top (cap) layer and post-growth on-site hydride passivation on the properties of InAsP/InP hetero-structures grown using metal-organic vapor phase epitaxy technique. The flow rate and flux ratios of the hydrides significantly affect the surface reaction rates and gas-phase diffusion coefficients, which in turn impact the As↔P exchange mechanisms. Our findings suggest that post-growth on-site arsine passivation encourages the As↔P substitutions at the vicinity of the desorption sites of phosphorus, leading to the arsenic-rich surface of InAsP with the diffused hetero-interfaces. The activation energy for such As↔P exchange reaction mechanism is evaluated as ∼ (1.4 ± 0.3) eV. On the other hand, it has been observed that the thin cap layer of InP protects the surface of the InAsP epilayer and thereby preserving the sharp interface. Further, surface photovoltage and photoluminescence spectroscopy is employed to examine the role of the diffused and sharp interface of InAsP/InP hetero-structures in charge carrier transport, their redistribution and recombination process. Our analysis of the energy transitions occurring in the surface photovoltage and photoluminescence spectrum reveal that the energy band alignment and the subsequent charge carrier redistribution processes is influenced by the surface and interface states. These changes in the surface photovoltage phase spectra of InAsP/InP system also support the role of surface and interface states in the generation and separation of the charge carriers. The study provides insights into the effects of As↔P exchange on surface and interfacial quality, highlighting the implications for optoelectronic device development using InAsP/InP material system.

Direct Calculations of the Dielectric and Optical Parameters of Some Compound Semiconductors: A Study Using the Lorentz Oscillator and Wemple-DiDomenico Models

The Lorentz single oscillator model is widely utilized to describe the electron-phonon interaction in solids. The use of this model to calculate the dielectric function and optical parameters of compound semiconductors represents a novel approach in materials science which may lead to develop new materials with tailored optical properties and consequently can offer vast applications in areas such as quantum computing and quantum information processing. This work presents direct calculations of the complex dielectric function and some optical parameters, such as refractive index, extinction coefficient, and reflectivity for some selected III-V and II-VI compound semiconductors using Lorentz oscillator model. The dielectric and optical dispersion parameters among the infrared and visible electromagnetic spectra follows the so-called Transmission-Absorption-Reflection-Transmission (TART) trend. The TART curve provides information about how a material interacts with light at different wavelengths, which is crucial for understanding and optimizing various optoelectronic devices. Moreover, dielectric loss functions such as loss tangent, surface energy loss function and volume energy loss function are investigated. The refractive index dispersion is analyzed using Wemple–DiDomenico single effective oscillator model and Sellmeier equation. The energy of the effective single oscillator (Eo) and the dispersion energy (Ed) are estimated.

Indium Phosphide Single Crystal Furnace Cooling Crystallization Temperature Control Model Research.

Indium phosphide (InP) single crystals, as key III-V compound semiconductor materials, play an irreplaceable role in various fields, such as optical communication and microwave millimeter-wave communication. Vertical gradient freeze (VGF) has become one of the main methods for industrial production of InP single crystals due to its advantages in temperature gradient control. However, defects such as twins and dislocations are easily generated during the production of InP single crystals by the VGF method. Through an in-depth study of the thermal field during the growth of InP single crystals, it is found that the cooling rate of the thermal field during single crystal growth is crucial and is closely related to the generation of twins, dislocations, and polycrystallization defects. Therefore, constructing a cooling model based on temperature control and the quality of InP single crystals has a positive driving effect on improving the yield of single crystal products. In this paper, by establishing a thermal field model of an InP single crystal furnace produced by the VGF method, the characteristics of temperature variation are analyzed in depth. Subsequently, numerical analysis of discrete cooling data during the cooling crystallization process is conducted, considering the quality of the InP single crystal growth. Combined with the spline regression algorithm, the optimal cooling model is fitted. Through positive and reverse experiment verification, the model shows significant effects in controlling internal stress in the crystal and reducing defect generation. Based on this model, we have successfully achieved effective suppression of defects, such as twins and dislocations, thereby significantly improving the quality of InP single crystals. This research not only provides a solid theoretical basis for the production of InP single crystals but also provides strong support for experimental applications.

Optimizing TCAD Model and Temperature-Dependent Analysis of Pt/AlN Schottky Barrier Diodes for High-Power and High-Temperature Applications

This research presents a comprehensive investigation and optimization of the Pt/AlN Schottky Barrier diode (SBD) using technology computer-aided design (TCAD) modeling. The study explores the electrical characteristics of AlN SBDs with various metal contacts, including Aluminum (Al), Silver (Ag), Tungsten (W), Gold (Au), Nickel (Ni), and Platinum (Pt). Through the comparative analyses of different metal/AlN Schottky contacts, the Pt/AlN structure emerges as the most promising due to its superior barrier height and lower leakage current. At [Formula: see text]K, the diode demonstrates a barrier height of 2.72[Formula: see text]V, a nearly ideal leakage current of 0.046[Formula: see text]pA, and a breakdown voltage of 363[Formula: see text]V. The research extends to examining the temperature-dependent electrical behavior of Pt/AlN Schottky diodes, particularly for high-power and high-temperature applications. Analysis carried out across temperatures ranging from [Formula: see text]K to [Formula: see text]K reveals a trend of increasing ON resistance and consistently lower leakage current with rising temperature. Importantly, the study indicates that the impact of temperature on the barrier height and breakdown voltage of the diode is negligible, thus rendering it suitable for high-temperature operation. Leveraging the unique properties of AlN as an ultra-wide bandgap material within the III-V compound semiconductor family, this research provides valuable insights into the potential applications of Pt/AlN Schottky contact. The study highlights that the Pt/AlN Schottky contact is effective not only for high-power, high-temperature SBDs but also as superior metal/semiconductor gate contacts for field-effect transistors (FETs). Their suitability is attributed to their ability to handle high voltages, minimize reverse leakage current, and demonstrate improved thermal stability.

Synthesis and Tuning of Electronic, Optical, and Photoelectrochemical Properties of Copper Metavanadate Alloys via Alkaline Earth Metal Substitution

Unlike the well-studied and technologically advanced Group III-V and Group II-VI compound semiconductor alloys, alloys of ternary metal oxide semiconductors have only recently begun to receive widespread attention. Here, we describe the effect of alkaline earth metal substitution on the optical, electronic, and photoelectrochemical (PEC) properties of copper metavanadate (CuV2O6). As a host, the Cu-V-O compound family presents a versatile framework to develop such composition-property correlations. Alloy compositions of A0.1Cu0.9V2O6 (A = Mg, Ca) photoanodes were synthesized via a time and energy-efficient solution combustion synthesis (SCS) method. The effect of introducing alkaline earth metals (Mg, Ca) on the crystal structure, microstructure, electronic, and optical properties of copper metavanadates was investigated by powder X-ray diffraction (PXRD), scanning electron microscopy (SEM), diffuse reflectance spectroscopy (DRS), transmission electron microscopy (TEM), and Raman spectroscopy. The PXRD, TEM, and Raman spectroscopy data demonstrated the polycrystalline powder samples to be mutually soluble, solid solutions of copper and alkaline earth metal metavanadates and not simple mixtures of these compounds. The DRS data showed a systematic decrease in the optical bandgap with Cu incorporation. These trends were corroborated by electronic band structure calculations. Finally, the PEC properties exhibited a strong dependence on the alloy composition, pointing to possible applicability in solar water splitting, heterogeneous photocatalysis, phosphor lighting/displays, and photovoltaic devices.

Diffusion models of grown-in and implanted p-type dopant in III-V semiconductor compounds

This research shows that the diffusion of grown-in and implanted Be atoms in III-V considered semiconductor materials, such as the Liquid-Encapsulated Czochralski-grown (LEC) GaAs as well as the Gas-Source Molecular Beam Epitaxy (GSMBE) In0.53Ga0.47As, In0.73Ga0.27As0.58P0.42, In0.53Ga0.47As/In0.73Ga0.27As0.58P0.42, In0.53Ga0.47As/InP compounds, taking place during the Rapid Thermal Annealing (RTA) process, is perfectly well explained by the “full” version of the kick-out mechanism operating through singly positively ionized Be interstitials and group III self-interstitial ions (Ga, In) in all their states of positive charge including neutral. Numerical solutions of the differential equations, corresponding to the considered system of diffusion reactions, have been calculated using the finite difference approach and our elaborate finite difference-Bairstow method. Such a model naturally emerges from most research works, including ours, in the considered field, over the last decades and makes it possible to “reconcile” their different diffusion models. In this study, we also present and analyze the Secondary Ion Mass Spectrometry (SIMS) profiles of the distribution of implanted Be in GaAs at an energy of 100 keV with a high dose of 1.0 ⋅ 1015cm−2 and annealed at temperatures ranging from 700 to 850 °C for à time ranging from 60 to 240s.

Morphological and Electrical Characterization of AlGaN/GaN Heterostructures Modified By Atomic Layer Etching

Modern microelectronic components for high-power and high-frequency applications based on III-V compound semiconductors offer high break down voltage (GaN: 5 MV/cm and AlN: 15 MV/cm) at low specific on-resistance. However, it requires reliability and reproducibility of the production processes. Going to higher frequencies (5 GHz and beyond) and more integration in consumer electronics, smaller structure sizes are needed. This is going along with increasing demands on the manufacturing processes like dry etching. The main goal is to reach smaller and high controllable etching rates, going down to single atomic layers, low damage, and minimized surface roughness. Atomic layer etching (ALE) represents a key technology in order to achieve such requirements.An ALE process consists of two independent steps forming a repeatable cycle with a specific etching amount per cycle (EPC). First a surface modification is done by a chemical precursor i.e., adsorbing or oxidizing the surface. The second step is the removal of the modified layer, either physically by low energy non-reactive ion bombardment (Plasma Enhanced ALE [PEALE]) or chemically by a reactive species (Thermal ALE). The two steps are separated by an inert gas purge. This purging grants the removal of the chemistry after the first step, preventing further chemical reaction and transporting the chemical products out of the chamber after the second step.In this study, a PEALE conducted on different tools is used, for gate and contact recess study in a AlGaN/GaN heterostructure to form high electron mobility transistors (HEMT) with reduced ohmic contact resistance and threshold voltages. The results show a reduction of ohmic contact resistance at reduced forming temperatures and a linear dependence of the threshold voltage on gate recess depth. In order to determine the etching rate and roughness, atomic force microscopy (AFM) measurements were performed.The PEALE module is either integrated into a cluster tool consisting of atomic layer deposition (ALD) and chemical vapor deposition (CVD) or done in a combined ALD/ALE chamber. This opens the possibility of etching and depositing in-situ, reducing contamination and degradation of the substrate material.By this means, metal insulator semiconductor (MIS)-HEMTS with a recessed gate are studied. The monitoring of the individual processes is achieved by test structures like transfer length method structures (TLM) and metal oxide semiconductor (MOS), which showed the improved electric performance of these devices and may indicate unwanted interface issues, respectively. Additional, pre- and post-treatments could improve the interfaces further. The results will be presented and discussed in terms of ALE process development and optimization.This work was financially supported within the ALEStar project by the government of the Free-state of Saxony and the European Regional Development Fund under grant no. SAB 100402929.

Achievement of extremely small subthreshold swing in Vertical Source-All-Around-TFET with suppressed ambipolar conduction

In this manuscript, we come up with a new line-tunneling-based channel-engineered GaAsSb/GaSb heterojunction Source-All-Around Vertical Nanowire TFET (SAA-NW-VTFET) and analyzed by Sentaurus TCAD-3D simulation. In this proposed model, increased tunneling area at the source-channel interface and the n+-pocket region, along with selective III-V compound semiconductors, have boosted the ON-current in the device. On the other hand, non-uniform channel doping and reduced tunneling area at the drain end have significantly suppressed the ambipolar current. The significant results in terms of ON-current (ION = 0.789 × 10−4 A/μm), OFF-current (IOFF = 1.08 × 10−17 A/μm), ION/IOFF ratio (7.25 × 1012), threshold voltage (0.2 V), point subthreshold swing (SS = 3 mV/dec) and average SS (SSavg = 7 mV/dec) are obtained in the simulation study. In addition, the effect of temperature (250 K–450 K) on device DC characteristics and DIBT is also presented.

(Invited) Enhanced Photocatalysis on TiO2-Passivated III-V Compound Semiconductors and 2D Material Heterostructures for Water Splitting and CO2 Reduction

We report enhanced photocatalysis for H2 evolution and CO2 reduction using TiO2-passivated InP and GaAs photocathodes.1-4 The TiO2 layer makes the InP semiconductor photochemically stable. This represents a major step forward in photocatalysis, which has typically been limited to metal oxide materials. In addition to making these surfaces stable, the TiO2 film, deposited by atomic layer deposition (ALD), also provides a substantial enhancement in the efficiency of H2 evolution. We find that passivating GaAs with just a few nm of TiO2 produces a shift in the onset potential of H2 evolution by +0.35 V at 1 mA/cm2 and enhances the photocurrent by 32-fold over bare GaAs (at 0 V vs. RHE). Here, thinner TiO2 films produce a larger enhancement than thicker films, which correlates with the higher density of O-vacancies (i.e., Ti3+ surface states) observed in these thinner films using X-ray photoemission spectroscopy (XPS). While TiO2 films 1-5nm thick produce large enhancements, no enhancement is observed for TiO2 thicknesses above 10 nm, which are crystalline and, therefore, considerably more insulating than thinner amorphous TiO2 films.Using transient reflectance spectroscopy (TRS), we measure the photoexcited carrier dynamics in a GaP/TiO2 photoelectrode, as well as the electrostatic field dynamics at this semiconductor-liquid interfaces in situ under various electrochemical potentials.5 Here, the electrostatic fields at the surface of the semiconductor are measured via Franz−Keldysh oscillations (FKO). These spectra reveal that the nanoscale TiO2 protection layer enhances the built-in field and charge separation performance of GaP photoelectrodes.We also demonstrated plasmon-resonant enhancement of photocatalysis on monolayer WSe2.6 In addition, we measured the stacking dependence and resonant interlayer excitation of monolayer WSe2/MoSe2 heterostructures for photocatalytic energy conversion.7 Qiu, J., G. Zeng, M. Ge, S. Arab, M. Mecklenburg, B. Hou, C. Shen, A.V. Benderskii and S.B. Cronin, Correlation of Ti3+ states with photocatalytic enhancement in TiO2-passivated p-GaAs. Journal of Catalysis, 337, 133 (2016).Qiu, J., G.T. Zeng, M.A. Ha, M.Y. Ge, Y.J. Lin, M. Hettick, B.Y. Hou, A.N. Alexandrova, A. Javey and S.B. Cronin, Artificial Photosynthesis on TiO2-Passivated InP Nanopillars. Nano Letters, 15, 6177-6181 (2015).Qiu, J., G.T. Zeng, M.A. Ha, B.Y. Hou, M. Mecklenburg, H.T. Shi, A.N. Alexandrova and S.B. Cronin, Microscopic Study of Atomic Layer Deposition of TiO2 on GaAs and Its Photocatalytic Application. Chemistry of Materials, 27, 7977-7981 (2015).Wang, Y. and S.B. Cronin, Performance Enhancement of TiO2-encapsulated Photoelectrodes Based on III–V Compound Semiconductors, in Ultrathin Oxide Layers for Solar and Electrocatalytic Systems. 2022, Royal Society of Chemistry. p. 103-134.Xu, Z.H., B.Y. Hou, F.Y. Zhao, Z. Cai, H.T. Shi, Y.W. Liu, C.L. Hill, D.G. Musaev, M. Mecklenburg, S.B. Cronin and T.Q. Lian, Nanoscale TiO2 Protection Layer Enhances the Built-In Field and Charge Separation Performance of GaP Photoelectrodes. Nano Letters, 21, 8017-8024 (2021).Chen, J., C.S. Bailey, Y. Hong, L. Wang, Z. Cai, L. Shen, B. Hou, Y. Wang, H. Shi, J. Sambur, W. Ren, E. Pop, and S.B. Cronin., Plasmon-Resonant Enhancement of Photocatalysis on Monolayer WSe2. ACS Photonics, 6, 787 (2019).Chen, J., C.S. Bailey, D. Cui, Y. Wang, B. Wang, H. Shi, Z. Cai, E. Pop, C. Zhou and S.B. Cronin, Stacking Independence and Resonant Interlayer Excitation of Monolayer WSe2/MoSe2 Heterostructures for Photocatalytic Energy Conversion. ACS Applied Nano Materials, DOI:10.1021/acsanm.9b01898 (2020).

Ⅲ-V Compound Semiconductor Multijunction Solar Cells and their Low-Cost Manufacturing Technique

Ⅲ-V Compound Semiconductor Multijunction Solar Cells and their Low-Cost Manufacturing Technique

Preparation and Investigation of Micro-Transfer-Printable Single-Crystalline InP Coupons for Heterogeneous Integration of III-V on Si

New requirements for high-frequency applications in wireless communication and sensor technologies need III-V compound semiconductors such as indium phosphide (InP) to complement silicon (Si)-based technologies. This study establishes the basis for a new approach to heterogeneous integration of III-V on Si aimed at the transfer of single-crystalline InP coupons on Si via micro-transfer printing (μTP). The InP coupons will act as high-quality virtual substrates that allow selective homo-epitaxy. We present the chemical-mechanical polishing-based preparation and structural characterization of µm-thin (001) InP platelets, starting from high-quality 4-inch bulk crystals and micro-patterning into transferable coupons of several hundred µm2. The obtained InP platelets exhibit the desired thickness—below 10 ± 1 µm—and low surface roughness—<0.3 nm—on both sides, meeting the precondition for µTP and epitaxy. X-ray rocking curve measurements provide accurate spatial maps of the total strain, which indicate small strain variations in the µm-thin InP sample. Rocking curve mappings of the (0 0 4) reflection reveal half-widths below 16 arcsec in the majority of the sample area after thinning that is similar to commercially available InP bulk substrates. Pole figure measurements show no evidence of stress-induced micro-twinning or stacking faults. Overall, minor indications of crystal quality degradation in the product platelets, compared with the bulk samples, were detected.

Direct bonding of LiNbO3 and GaAs at room temperature by using activated Si atom layer

Heterogeneous integration of LiNbO3 and GaAs at room temperature has been achieved by using an activated Si atom interlayer, which demonstrate effectiveness in the fabrication of GaAs based LiNbO3 wafer. By using the activated Si atom interlayer as the adhesive layer, 4-inch LiNbO3 wafer is successfully directly bonded to the surface of GaAs wafer. The wafer bonding rate reaches over 95%. After bonding, the LiNbO3/GaAs bonding pair is cut into 10 × 10 mm2 square bonded chips. After annealing, the maximum bonding strength of square bonded chips exceeds 22 MPa. This means that the bonding strength of LiNbO3/GaAs wafer can be comparable to that of bulk materials. The characterization results of the bonding interface confirm that the intermediate amorphous Si layer is effective in improving the bonding strength and quality of LiNbO3/GaAs heterojunction. Heterogeneous integration of LiNbO3 with GaAs and other Ⅲ-Ⅴ compound semiconductor materials is conducive to reducing the area occupied by optical communication platforms and improving the overall efficiency of devices.

Application of TiO2/Ag/TiO2 as an Ohmic Contact to an AlGaAs Layer in a GaAs Solar Cell

This paper investigates the possibility of using a nanolaminate TiO2/Ag/TiO2 structure as a transparent conductive coating on GaAs solar cells. A novel result is that this structure forms an Ohmic contact to Al-rich AlGaAs, which is used as a “window” layer in GaAs-based solar cells. The TiO2/Ag/TiO2 structure is deposited by RF magnetron sputtering at room temperature. This nanolaminate coating has good optical and electrical properties: a high transmittance of 94% at 550 nm, a sheet resistance of 7 Ω/sq, and a figure of merit (FOM) of 105 × 10−3 Ω−1. These properties are the result of the presence of a discontinuous layer of Ag between two thin layers of TiO2. The morphology of a discontinuous layer of Ag nanogranules is confirmed by the observation of a cross-section of a sample with high-resolution transmission electron microscopy (HRTEM) and EDX analyses. Current–voltage diode characteristics of GaAs solar cells measured under standard test illumination at 1000 W/m2 are analyzed. The formation of an Ohmic contact is explained by the Fermi-level pinning effect caused by nanosized Ag particles in the nanolaminate TiO2/Ag/TiO2 structure. The obtained results demonstrate a new application of oxide−metal−oxide (OMO) coatings as Ohmic contacts to III-V compound semiconductors.

Integration Technology of Micro-LED for Next-Generation Display.

Inorganic micro light-emitting diodes (micro-LEDs) based on III-V compound semiconductors have been widely studied for self-emissive displays. From chips to applications, integration technology plays an indispensable role in micro-LED displays. For example, large-scale display relies on the integration of discrete device dies to achieve extended micro-LED array, and full color display requires integration of red, green, and blue micro-LED units on the same substrate. Moreover, the integration with transistors or complementary metal-oxide-semiconductor circuits are necessary to control and drive the micro-LED display system. In this review article, we summarized the 3 main integration technologies for micro-LED displays, which are called transfer integration, bonding integration, and growth integration. An overview of the characteristics of these 3 integration technologies is presented, while various strategies and challenges of integrated micro-LED display system are discussed.

Limiting factors for the growth rate of epitaxial III-V compound semiconductors

Limiting factors for the growth rate of epitaxial III-V compound semiconductors are investigated. A model based on the two connected diffusion equations for the group III and V adatoms applies for planar layers and different nanostructures including III-V nanowires. An expression for the step growth rate is obtained and a physical parameter is revealed which determines an element which actually limits the growth process. Keywords: III-V compound semiconductors, surface diffusion of adatoms, desorption, step growth rate.

Dielectrically Modulated III-V Compound Semiconductor Based Pocket Doped Tunnel FET for Label Free Biosensing Applications.

In this paper, a novel structure of double gate tunnel FET has been proposed and simulated for biosensing applications. The device uses III-V compound semiconductors and an n+ doped pocket at the source channel junction. Biomolecules of different dielectric constants (K) with different charge densities (Nbio), both negative and positive, are inserted in the nano-gap cavities (15 nm ×1.5 nm) that have been created under gates near source channel junction to capture biomolecules. From extensive 2D simulations, ION sensitivity of 4.351 ×108/1.03 ×108/1.514 ×109 , subthreshold swing sensitivity of 15.67/20.21/18.57 mV/dec, and threshold voltage sensitivity of 18/12/23 mV for neutral (K = 12)/negatively charged biomolecules ( [Formula: see text] C/cm2, K = 12)/positively charged biomolecules ( [Formula: see text] C/cm2, K = 12) respectively has been observed. Also, transconductance sensitivity of 9.74 ×107 and ION/IOFF sensitivity of 5.255 ×108 for neutral biomolecules (K = 12) has been calculated. Furthermore, the device performance with one-third filled cavities, two-third filled cavities and fully filled cavities has also been studied. The performance of the proposed biosensor has been compared with the previously published work and it has been observed that the sensitivity of the proposed biosensor is 100 times better than the best reported biosensor.

Modeling Insights Into the Assembly Challenges of Focal Plane Arrays

Ongoing technological advances in photodetector material growth and processing, readout integrated circuits, and robust hybridization (packaging) methods for assembling high-resolution and small-pitch size pixel arrays are the main enabling factors for pushing the frontiers of high-performance Focal Plane Array (FPA) technologies for imaging systems. This paper details the development of analytical and numerical models and demonstrates their use to generate insights into the feasibility of two flip-chip assembly processes for packaging infrared (IR) detector chips. The modelling studies focus on the challenges of forming the indium interconnection arrays in the case of the FPA technologies using Group III-V compound semiconductor materials and ultra-fine pitch pixel array layouts. The accurate alignment of the IR detector chip onto the readout chip in the case of high-density pixel architectures is a critical requirement for the packaging process. To gain better understanding of this requirement, which has a clear implication for the quality and subsequent reliability performance of the FPA, compression and reflow bonding process models are developed using suitable modeling approaches and methods and then demonstrated for two distinctive focal plane array design configurations. The novelty of this work is in the developed modeling capabilities utilizing different computational methods, from large deformation and contact analysis finite element to energy-based and harmonic motion mechanics, to characterize and optimize the mechanical and dynamic non-linear behavior of the indium solder joints and their formation during FPA packaging. The feasibility of bonding techniques for different resolution FPAs and under flip-chip misalignment conditions is assessed. The modeling results pointed to a very strict, sub-micrometer flip-chip placement accuracy requirement for the assembly of FPAs with ultra-fine indium bump array resolution.