Contact Doping Research Articles

N-Type Doping Effect of Anthracene-Based Cationic Dyes in Organic Electronics.

n-Type doping for improving the electrical characteristics and air stability of n-type organic semiconductors (OSCs) is important for realizing advanced future electronics. Herein, we report a selection method for an effective n-type dopant with an optimized structure and thickness based on anthracene cationic dyes with high miscibility induced by a molecular structure similar to that of OSCs. Among the doped OSCs evaluated, rhodamine B (RhoB)-doped OSC exhibits the highest density, a smallest roughness of 2.69 nm, a phase deviation of 0.85° according to atomic force microscopy measurements, and the highest electron mobility (μ), showing its high miscibility. Surface doping of RhoB affords the lowest contact resistance of 2.01 × 105 Ω cm compared to bulk and contact doping, resulting in an effective doping structure. The RhoB-doped OSC retains 81.63% of the original μ value of 6.13 × 10-2 cm2 V-1 s-1 after 15 days, whereas pristine OSC shows a lower μ of 2.33 × 10-2 cm2 V-1 s-1 and maintains only 4.41% of the original value after 15 days. Our findings demonstrate that this methodology is effective for the selection of a high-performance n-type dopant for OSCs toward the development of high-performance and air-stable n-type organic electronics.

Inkjet-Printed, High-Performance MoS2 Transistors and Unipolar Logic Electronics.

Two-dimensional (2D) semiconductor field-effect film transistors combine large carrier mobility with mechanical flexibility and therefore can be ideally suitable for wearable electronics or at the sensor interfaces of smart sensor systems. However, such applications require large-area solution processing as opposed to single-flake devices, where the critical challenge to overcome is the high interflake resistance values. In this report, using a narrow-channel, near-vertical transport device architecture, we have fabricated inkjet-printed sub-20 nm channel electrolyte-gated transistors with predominantly intraflake carrier transport. Therefore, the electronics transport in these transistors is not dominated by the high interflake resistance, and the intraflake material properties including doping density, defect concentration, contact resistance, and threshold voltage modulation can be examined and optimized independently to achieve a current density as high as 280 μA·μm-1. In addition, through the passivation of the sulfur vacancies with a tailored surface treatment, we demonstrate an impressive On-Off current ratio exceeding 1 × 107, complemented by a low subthreshold swing of 100 mV·decade-1. Next, exploiting these high-performance transistors, unipolar depletion-load-type inverters have been fabricated that show a maximum gain of 31. Furthermore, we have realized NAND, NOR, and OR gates, demonstrating their seamless operation at a frequency of 1 kHz. Therefore, this work represents an important step forward to realize electronic circuits based on printed 2D thin film transistors.

High modulation efficiency sinusoidal vertical PN junction phase shifter in silicon-on-insulator

In this paper, a sinusoidal vertical PN junction phase shifter on a silicon waveguide is designed, and the results demonstrate that modifying the shape of the PN junction significantly increases the area of the depletion region within the standard waveguide width of 500 nm, thereby enhancing the overlap between the depletion region and optical waveguide modes under reverse bias conditions. Furthermore, by adjusting the sinusoidal amplitude (A) of the doping contact interface, it is observed that when A=0.065µm, the resulting sinusoidal PN junction most effectively enhances the interaction between carriers and photons, leading to the highest modulation efficiency and the lowest loss. Based on this, further adjustment of the doping concentration distribution in the waveguide was conducted using a doping compensation method. It is observed that setting the doping concentration at 3×1018cm−3 in the heavily doped region and at 1×1018cm−3 in the lightly doped region enables the phase shifter to achieve high modulation efficiency while maintaining low loss. This is attributed to the highest optical intensity being concentrated in the central region of the waveguide, as well as to the positive correlation between doping concentration and modulation efficiency. The final designed device with a length of 1.5 mm successfully attained a low V π L of 0.58V⋅cm, resulting in high modulation efficiency. By employing traveling wave electrodes and ensuring that the effective refractive index of the radio frequency (RF) matches the optical group index (OGI), circuit-level simulations were conducted. The device exhibited a 3 dB bandwidth of 8.85 GHz and eye diagrams of up to 40 Gbit/s, with a maximum extinction ratio (ER) of 8.27 dB and a bit error rate (BER) of 8.83×10−6, which can be widely used in the field of high-speed silicon optical modules.

An Electrically Pumped Topological Polariton Laser.

With a seminal work of Raghu and Haldane in 2008, concepts of topology have been introduced into optical systems, where some of the most promising routes to an application are efficient and highly coherent topological lasers. While some attempts have been made to excite such structures electrically, the majority of published experiments use a form of laser excitation. In this paper, we use a lattice of vertical resonator polariton micropillars to form an exponentially localized topological Su-Schrieffer-Heeger defect. Upon electrical excitation, the system unequivocally shows polariton lasing from the topological defect using a carefully placed gold contact. Despite the presence of doping and electrical contacts, the polariton band structure clearly preserves its topological properties. At high excitation power the Mott density is exceeded, leading to highly efficient lasing in the weak coupling regime. This work is an important step toward applied topological lasers using vertical resonator microcavity structures.

Performance investigation of doped multi-layer graphene nanoribbon as interconnects in modern technology nodes

In this paper, the performance of intercalation doped multilayer graphene nanoribbons (MLGNR) with modern technology nodes is meticulously investigated. An unconditionally stable FDTD method is used to analyze the transient output of the circuit. Several cases of MLGNR interconnects under different doping materials, stacking directions and contact modes have been discussed. With multiple experiments carried out, it is shown that the Li-doped MLGNR interconnect with vertical stacking orientation has the most outstanding performance, which has the least delay compared with the traditional Cu interconnect and other counterparts in 3-nm and 5-nm nodes. In summary, the Li-doped vertically stacked MLGNR is very promising for carbon nano interconnects in the next generation of integrated circuits.

High-Performance Contact-Doped WSe2 Transistors Using TaSe2 Electrodes.

Two-dimensional (2D) transitional metal dichalcogenides (TMDs) have garnered significant attention due to their potential for next-generation electronics, which require device scaling. However, the performance of TMD-based field-effect transistors (FETs) is greatly limited by the contact resistance. This study develops an effective strategy to optimize the contact resistance of WSe2 FETs by combining contact doping and 2D metallic electrode materials. The contact regions were doped using a laser, and the metallic TaSe2 flakes were stacked on doped WSe2 as electrodes. Doping the contact areas decreases the depletion width, while introducing the TaSe2 contact results in a lower Schottky barrier. This method significantly improves the electrical performance of the WSe2 FETs. The doped WSe2/TaSe2 contact exhibits an ultralow Schottky barrier height of 65 meV and a contact resistance of 11 kΩ·μm, which is a 50-fold reduction compared to the conventional Cr/Au contact. Our method offers a way on fabricating high-performance 2D FETs.

Tuning the transport polarity of tungsten diselenide-based n-type FET to p-typeby MoO3 contact doping

Atomically thin tungsten diselenide (WSe2) has emerged as a promising material for next-generation electronic and optoelectronic devices. The surface functionalization of molybdenum trioxide (MoO3) improves the performance of WSe2 FET. The strong hole doping from MoO3 to WSe2 was revealed by measuring the electrical properties of the FET and calculating the electron mobility of WSe2 devices. We demonstrated effective P doping of MoO3 on WSe2 FET devices, and the hole mobility of WSe2 FET devices was improved by 3 orders of magnitude after contact doping with MoO3 at 3.2nm.

Crosstalk optimization and gate oxide reliability analysis in intercalation doped MLGNR with reduced vertical thickness

In this paper, the performance of intercalation doped multilayer graphene nanoribbons (MLGNR) with reduced vertical thickness is investigated, and the impact of crosstalk on latency and gate oxide reliability is analyzed. An unconditionally stable FDTD method is used to analyze the transient output of the circuit. Several cases of MLGNR with reduced vertical thickness under different doping materials, stacking directions and contact modes have been discussed. The experimental data show that the Li-doped MLGNR interconnect with horizontal stacking and side contact (SC) has the most outstanding performance, and the delay fluctuation caused by crosstalk is improved by 17.8 % ∼ 68.1 % compared with the Cu interconnect. When specularity p = 0.2, the PDCP (power delay crosstalk product) is found 44.2 % ∼ 61.5 % lower than the Cu interconnect. In addition, the AFR (average failure rate) has also been investigated, and the data showed that the AFR of Li-doped SC-MLGNR remained lowest among all interconnects discussed, for comparison the Cu interconnect is 4.2–5 times larger than the former. In summary, the vertical thickness reduced Li-doped horizontally stacked SC-MLGNR is very promising as carbon nano interconnects in the next generation of integrated circuits.

A new superior electronic properties Si allotrope for power electronic device applications

A new I−4 space group silicon allotrope is proposed in this paper. The electronics properties, mechanical properties and Ag(100)/I4Si(100) interface properties are studied using first principle calculations method. The results of the phonon show that I−4 Si is dynamically stable. Elastic constants reveal I−4 Si is dynamical stable. Electronics properties calculations reveal that the CBM and VBM of I−4 Si are at X and M point, which indicates that I−4 Si is an indirect band gap semiconductor with a high band gap of 1.95 eV. To satisfy the demands for fabricating electronic devices, the N-type doping, P-type doping and Ohmic contact are studied, too. The fermi energy level of N-type and P-type I−4 Si move into conduction band and valence band, respectively. The Schottky barrier of Ag/I-4 interface is 0.65 eV. Meanwhile, the current-voltage curve becomes highly symmetric, suggesting an Ohmic behavior of the Ag(100)/I4Si(100) interface. Critical breakdown field calculations results show that the critical breakdown field of I−4 Si is 9.05 × 105 V cm−1, which is 3.02 times that of the diamond Si. Because band gap and critical breakdown field of I-4 Si are much greater than that of diamond Si, I-4 Si is potential electronic semiconductor material. Thus, I−4 Si can be applied in the field of modern power electronic device applications due to its superior electronic properties.

MoS2 Field-Effect Transistor Performance Enhancement by Contact Doping and Defect Passivation via Fluorine Ions and Its Cyclic Field-Assisted Activation.

MoS2-based field-effect transistors (FETs) and, in general, transition metal dichalcogenide channels are fundamentally limited by high contact resistance (RC) and intrinsic defects, which results in low drive current and lower carrier mobilities, respectively. This work addresses these issues using a technique based on CF4 plasma treatment in the contacts and further cyclic field-assisted drift and activation of the fluorine ions (F-), which get introduced into the contact region during the CF4 plasma treatment. The F- ions are activated using cyclic pulses applied across the source-drain (S/D) contacts, which leads to their migration to the contact edges via the channel. Further, using ab initio molecular dynamics and density functional theory simulations, these F- ions are found to bond at sulfur (S) vacancies, resulting in their passivation and n-type doping in the channel and near the S/D contacts. An increase in doping results in the narrowing of the Schottky barrier width and a reduction in RC by ∼90%. Additionally, the passivation of S vacancies in the channel enhances the mobility of the FET by ∼150%. The CF4 plasma treatment in contacts and further cyclic field-assisted activation of F- ions resulted in an ON-current (ION) improvement by ∼90% and ∼480% for exfoliated and CVD-grown MoS2, respectively. Moreover, this improvement in ION has been achieved without any deterioration in the ION/IOFF, which was found to be >7-8 orders.

A Novel N-Type Molecular Dopant With a Closed-Shell Electronic Structure Applicable to the Vacuum-Deposition Process.

Rational design, synthesis, and characterization of a new efficient versatile n-type dopant with a closed-shell electronic structure are described. By employing the tetraphenyl-dipyranylidene (DP0) framework with two 7π-electron systems modified with N,N-dimethylamino groups as the strong electron-donating substituent, 2,2',6,6'-tetrakis[4-(dimethylamino)phenyl]-4,4'-dipyranylidene (DP7), a closed-shell molecule with an extremely high-lying energy level of the highest occupied molecular orbital, close to 4.0eV below the vacuum level, is successfully developed. Thanks to its thermal stability, DP7 is applicable to vacuum deposition, which allows utilization of DP7 in bulk doping for the development of n-type organic thermoelectric materials and contact doping for reducing contact resistance in n-type organic field-effect transistors. As vacuum-deposition processable n-type dopants are very limited, DP7 stands out as a useful n-type dopant, particularly for the latter purpose.

Realization of MoTe2 CMOS inverter by contact doping and channel encapsulation

The Fermi level pinning effect significantly limits the application of electrical devices based on two-dimensional materials like transition metal dichalcogenide. Here, a CMOS inverter, which is comprised of an n- and a p-MoTe2 FET with optimized properties, has been successfully fabricated by using contact doping and channel encapsulation methods. Contact doping is to control the polarity of MoTe2-FET and improve contact properties, which is achieved by laser irradiation in different environmental conditions. The channel of two MoTe2-FETs was encapsulated by hexagonal boron nitride (h-BN) to enhance carrier mobility and device stability. The fabricated CMOS inverter showed a very high gain value of 31 at V dd = 4 V at RT.

Self‐Aligned Contact Doping for Performance Enhancement of Low‐Leakage Carbon Nanotube Field Effect Transistors

AbstractCarbon nanotube (CNT) field effect transistors (CNFETs) show promise for the next generation VLSI systems due to their excellent scalability, energy efficiency, and speed. However, high leakage current is a drawback of large diameter CNTs (diameter (DCNT) ≥ 1.4 nm) due to the small electronic band gap (EG) ≤ 0.6 eV and effective mass. This work investigates the on‐current and off‐current tradeoff for two populations of semiconducting‐enriched CNT with DCNT ≈ 1.0 nm displaying a simultaneous 50x improvement in minimun current (IMIN) with 2.5x degradation in contact resistance compared to DCNT ≈ 1.4 nm using a Pd side‐bonded contact. A method to enhance the performance of low‐leakage CNFETs is demonstrated using sub‐monolayer self‐aligned contact doping with 0.8 nm of MoOX, which delivers a 57% reduction in contact resistance to DCNT ≈ 1.0 nm. Robustness is verified after annealing at 200 °C for 30 min and monitoring stability across 6 months post‐fabrication with no change in electrical behaviors.

Toward High-Performance p-Type Two-Dimensional Field Effect Transistors: Contact Engineering, Scaling, and Doping.

n-type field effect transistors (FETs) based on two-dimensional (2D) transition-metal dichalcogenides (TMDs) such as MoS2 and WS2 have come close to meeting the requirements set forth in the International Roadmap for Devices and Systems (IRDS). However, p-type 2D FETs are dramatically lagging behind in meeting performance standards. Here, we adopt a three-pronged approach that includes contact engineering, channel length (Lch) scaling, and monolayer doping to achieve high performance p-type FETs based on synthetic WSe2. Using electrical measurements backed by atomistic imaging and rigorous analysis, Pd was identified as the favorable contact metal for WSe2 owing to better epitaxy, larger grain size, and higher compressive strain, leading to a lower Schottky barrier height. While the ON-state performance of Pd-contacted WSe2 FETs was improved by ∼10× by aggressively scaling Lch from 1 μm down to ∼20 nm, ultrascaled FETs were found to be contact limited. To reduce the contact resistance, monolayer tungsten oxyselenide (WOxSey) obtained using self-limiting oxidation of bilayer WSe2 was used as a p-type dopant. This led to ∼5× improvement in the ON-state performance and ∼9× reduction in the contact resistance. We were able to achieve a median ON-state current as high as ∼10 μA/μm for ultrascaled and doped p-type WSe2 FETs with Pd contacts. We also show the applicability of our monolayer doping strategy to other 2D materials such as MoS2, MoTe2, and MoSe2.

Dual Electronic Modulations on NiFeV Hydroxide@FeOx Boost Electrochemical Overall Water Splitting.

Nickel-iron based hydroxides have been proven to be excellent oxygen evolution reaction (OER) electrocatalysts, whereas they are inactive toward hydrogen evolution reaction (HER), which severely limits their large-scale applications in electrochemical water splitting. Herein, a heterostructure consisted of NiFeV hydroxide and iron oxide supported on iron foam (NiFeV@FeOx /IF) has been designed as a highly efficient bifunctional (OER and HER) electrocatalyst. The V doping and intimate contact between NiFeV hydroxide and FeOx not only improve the entire electrical conductivity of the catalyst but also afford more high-valence Ni which serves as active sites for OER. Meanwhile, the introduction of V and FeOx reduces the electron density on lattice oxygen, which greatly facilitates desorption of Hads . All of these endow the NiFeV@FeOx /IF with exceptionally low overpotentials of 218 and 105 mV to achieve a current density of 100 mA cm-2 for OER and HER, respectively. More impressively, the electrolyzer requires an ultra-low cell voltage of 1.57 V to achieve 100 mA cm-2 and displays superior electrochemical stability for 180 h, which outperforms commercial RuO2 ||Pt/C and most of the representative catalysts reported to date. This work provides a unique route for developing high-efficiency electrocatalyst for overall water splitting.

Characteristics of Resonant Tunneling in Nanostructures with Spacer Layers

The effect of spacer layers on electron transport through two-barrier nanostructures was studied using the numerical solution of the time-dependent Schrodinger–Poisson equations with exact discrete open boundary conditions. The formulation of the problem took into account both the active region consisting of a quantum well and barriers, as well as the presence of highly doped contact layers and spacer layers. The use of the time formulation of the problem avoids the divergence of the numerical solution, which is usually observed when solving a stationary system of the Schrodinger–Poisson equations at small sizes of spacer layers. It is shown that an increase in the thickness of the emitter spacer leads to a decrease in the peak current through the resonant tunneling nanostructures. This is due to the charge accumulation effects, which, in particular, lead to a change in the potential in an additional quantum well formed in the emitter spacer region when a constant electric field is applied. The valley current also decreases as the thickness of the emitter spacer increases. The peak current and valley current are weakly dependent on the thickness of the collector spacer. The collector spacer thickness has a strong effect on the applied peak and valley voltages. The above features are valid for all three different resonant tunneling nanostructures considered in this study. For the RTD structures based on Al0.3Ga0.7As/GaAs, the optimized peak current value Ipmax = 5.6 × 109 A/m2 and the corresponding applied voltage Vp = 0.44 V. For the RTD structures based on AlAs/In0.8Ga0.2As, Ipmax = 14.5 × 109 A/m2 (Vp = 0.54 V); for RTD structures based on AlAs/In0.53Ga0.47As, Ipmax = 45.5 × 109 A/m2 (Vp = 1.75 V).

Dopant Diffusion Inhibition in Organic Field-Effect Transistors Using Organic Semiconductor/High-Molecular-Weight Polymer Blends

Molecular contact doping in organic field-effect transistors (OFETs) has been proved to be a very efficient strategy to reduce the device contact resistance. It consists of inserting a dopant layer between the organic semiconductor (OSC) and the top gold contacts to reduce the energy barrier required to inject/release charges. However, a main bottle-neck for its implementation is that the dopant diffuses toward the OFET channel with time, doping the OSC, and hampering the on/off switching device capability. In this work, we fabricated OFETs based on the benchmark OSC 2,7-dioctyl[1]benzothieno[3,2-b][1]benzothiophene (C8-BTBT-C8) by a solution shearing technique. First, we show that the OFET performance of these devices is significantly improved when a layer of the p-dopant 2,3,5,6-tetrafluoro-7,7,8,8-tetracyanoquinodimethane (F4TCNQ) is inserted before the evaporation of the gold source/drain contacts. Remarkably, we demonstrate that the dopant diffusion can be controlled by blending the OSC with polystyrene (PS) of different molecular weights. In-depth electrical characterization combined with studies of surface and in-depth distribution of the dopant by time-of-flight secondary ion mass spectrometry (ToF-SIMS) unambiguously show that in thin films of OSC blends with high-molecular-weight PS, the dopant remained drastically confined into the contact areas, which was reflected by an enhanced long-term device stability.

Lateral WSe2 Homojunction through Metal Contact Doping: Excellent Self‐powered Photovoltaic Photodetector

AbstractHere an IR‐heating chemical vapor deposition (CVD) approach enabling fast 2D‐growth of WSe2 thin films is reported, and the great potential of metal contact doping in building CVD‐grown WSe2‐based lateral homojunction is demonstrated by contacting with TiN/Ni metals in favor of holes/electrons injection. Shortening nanosheet channel to ≈2 µm leads to pronounced enhancement in the performance of diode. The fabricated WSe2‐based diode exhibits high rectification ratios without the need of gate modulation and can work efficiently as photovoltaic cell, with maximum open circuit voltage reaching up to 620 mV and a high power conversion efficiency over 15%, empowering it as superb self‐powered photodetector for visible to near‐infrared lights, with photoresponsivity over 0.5 A W−1 and a fast photoresponse speed of 10 µs under 520 nm illumination. It is of practical significance to achieve well‐performed photovoltaic devices with CVD‐grown WSe2 using fab‐friendly metals and simple processing, which will help pave the way toward future mass production of optoelectronic chips.

Hysteresis-Free Contact Doping for High-Performance Two-Dimensional Electronics

Contact doping is considered crucial for reducing the contact resistance of two-dimensional (2D) transistors. However, a process for achieving robust contact doping for 2D electronics is lacking. Here, we developed a two-step doping method for effectively doping 2D materials through a defect-repairing process. The method achieves strong and hysteresis-free doping and is suitable for use with the most widely used transition-metal dichalcogenides. Through our method, we achieved a record-high sheet conductance (0.16 mS·sq-1 without gating) of monolayer MoS2 and a high mobility and carrier concentration (4.1 × 1013 cm-2). We employed our robust method for the successful contact doping of a monolayer MoS2 Au-contact device, obtaining a contact resistance as low as 1.2 kΩ·μm. Our method represents an effective means of fabricating high-performance 2D transistors.

Comprehensive Polarity Regulation of WSe2Field‐Effect Transistors Enabled by Combining Contact Engineering and Plasma Doping

Two‐dimensional semiconductors are considered as promising candidates in next‐generation nanoelectronics. The polarity regulation, however, has been a great obstacle to their applications. Herein, a strategy to comprehensively modulate the polarity of WSe2field‐effect transistors (FETs) by combining contact engineering and plasma doping is demonstrated. N‐type and ambipolar WSe2FETs are obtained by indium (In) and chromium (Cr) contact, respectively. Meanwhile Cr contact and mild oxygen plasma doping are employed simultaneously to realize p‐type WSe2FET. High on/off ratio of ≈107has been achieved for both n‐type and p‐type WSe2FETs. Subsequently, they are connected in series to construct a homogeneous complementary logic inverter and a lateral p–n diode. Anti‐ambipolar transfer characteristics, therefore, are accessed from the inverter. And the forward to backward rectifying ratio reaches 106for the p–n diode. The proposed strategy paves the way for practical applications of WSe2FETs in logic circuits and optoelectronics.