Abstract
Globalization has migrated Advanced Packaging to the Pacific Rim for decades. Current geopolitics is driving instability in the region and increasing the risk of access to leading edge microelectronics and packaging capabilities. This has created substantial risks to western countries as they strategically modernize. At the same time, Advanced Packaging is more critical in solutions as we transition to Heterogeneous Integrated (HI) architectures enabling processing to move to the sensor.
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