Abstract
Wafer to wafer and chip to wafer bonding technologies are a key enabling processes for the fabrication of microsystems. The presented paper focuses on the latest research results of Parylene adhesive bonding. Given the established wafer bonding processes based on Parylene C in vacuum, research on how the bonding process alters the Parylene material was performed using x-ray diffraction. Doing so, a significant increase of the crystalline fraction of Parylene was observed. In order to further develop the Parylene bonding beyond its state of the art, new process variants were successfully established with advanced features: Wafer bonding using Parylene C at increased pressure; Wafer bonding using Parylene N and Parylene F, respectively, to address a different bonding temperature range; as well as chip bonding using Parylene C in air.
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