Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies

Abstract

The designs of integrated systems are increasingly compact while the requirements of application, especially in the automotive sector, remain demanding. One main challenge is posed by the environmental conditions. In the present study, their impact on mmWave 5G PCB assemblies is evaluated with respect to both mechanical and highfrequency properties. To that end, material samples were stored at three temperatures for various durations in order to accelerate the ageing effects. Afterwards, the samples were tested by use of mechanical, dielectric and high-frequency test methods. Thermo-oxidative ageing processes were observed and lead to significant changes in mechanical and dielectric properties, with simultaneous changes of sample color. The combined approach of mechanical and high-frequency analysis allows for three innovative advantages: First, a correlation of the degradation in performance with other parameters, e.g. sample change of color, which is much easier to detect. Second, the definition of a Safe Area of Operation and a methodology to estimate the behaviour of a mmWave 5G PCB assembly over its lifetime. Finally, the study opens the pathway to a design for robustness of mmWave communication system in automotive applications.