Abstract
Heterogeneous Integration (HI) is undeniably the vehicle to drive continued advances in Compute and Communications. Advanced Packaging Architectures today provide unprecedented levels of Heterogeneous Integration in Client, Server and Discrete Graphics. Intel committed to a vision of developing heterogeneously integrated leadership products using advanced packaging technologies to match the functionality of a monolithic SOC and more….. We continue to scale our Advanced Packaging Technologies Roadmap. Federal Engagements in multiple programs (e.g. SHIP) allowing Intel to drive design and prototype diverse configurations for U.S. Government / and Defense Industrial Base; USG/DIB partnering critical for HI advancements.
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