Abstract
Temporary bonding film (TBF) is one of the key materials for assembly process of fan out wafer level package (FOWLP). In this paper, we have proposed a novel TBF and xenon flash lamp de-bonding system. The TBF was mainly composed of cross-linkable and low-polarity polymers to meet the various requirement for not only easy peeling-off after assembly but also stability against thermal and chemical environment exposed in FOWLP process. In order to evaluate applicability of the developed material, die-first/face up test wafer was assembled. As a result, it was found that the TBF has high stability and can be de-bonded by xenon light irradiation. In addition, the die shift through assembly process was within the estimated range. These results offer that the developed TBF is practically applicable for FOWLP assembly process.
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