6 - Thermal and mechanical tests for packages and materials

Abstract

In the package development stage, various tests are involved to qualify the package. The thermal and mechanical related tests include tests at both the materials and package levels. In the thermal testing in Section 6.1, the thermal test methods involve not only the standard tests for thermal metrics such as Theta JA and Theta JC but also the engineering tests during package manufacturing and qualification processes such as burn-in and system level tests. Material tests are introduced in Section 6.2 to obtain mechanical properties such as stress–strain relationship, Young’s modulus, yield stress, creep properties, fatigue behavior, viscoplastic and viscoelastic properties, and so on, which is the cornerstone for the finite element modeling of packaging mechanical behavior. Solder joint material and epoxy molding compound are selected as two typical advanced electronic packaging materials to demonstrate material test method and result analysis.