Abstract
The typical IC failure modes are reviewed for the packaging technologies developed. The hygro-thermal-mechanical modelling can be applied to predict the hygro-thermal-mechanical stresses without delamination as a function of temperature and relative humidity in plastic IC packages. The methodologies of stress intensity factor (SIF) and strain energy release rate (Gt) based on linear elastic fracture mechanics are then introduced in detail considering very small voids or defects present at the material interface. The interfacial fracture toughness is found to decrease with temperature and relative humidity. The crack propagation with combined effects of hygro-thermal-mechanical loading and mode mixity are discussed in detail.
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