Abstract
Waste heat is generated during the operation of electronic devices and systems, which is to be dissipated to the ambient in a timely manner to avoid overheating of the package. In this chapter, the thermal analysis and design fundamentals are briefed first. Then, the package-level thermal analysis and submodeling techniques are introduced for various package elements such as TSVs, bumps, substrate layers and vias on the substrate. In addition, package-level thermal enhancements are analyzed, modeled and tested for packages including 2.5D package and 3D packages. The respective thermal analysis, modeling and design techniques for vapor chamber based air cooling, microchannel based liquid cooling and thermoelectric cooling are also presented and discussed. Available analytical solutions for liquid cooling and thermoelectric cooling are presented and discussed in detail.
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