Abstract
In this chapter, the system level modeling, analysis and design are presented with multi-physics interaction in mind. In the first part, Section 7.1, the thermal modeling and analysis are presented for the electronic parts ranging from the rack-level electronic system to the silicon micro cooler system with a remote heat exchanger. For the rack model with multiple trays and electronic boards, each mounted with various components, simplification of the model is necessary to reduce the modeling complexity. For the micro cooler system including the silicon microchannel heat sink with distributed layers, the heat generating chip, and the heat exchanger located at the peripheral of the cooler, the individual analysis are conducted for each thermal component to understand the respective thermal performance. The detailed performance analysis is conducted based on numerical simulation tools with experimental validation.
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