Ultra-wide Bandgap Semiconductor Research Articles

Ultrawide-Bandgap Semiconductors for High-Frequency Devices

Ultrawide-Bandgap Semiconductors for High-Frequency Devices

High responsivity and detectivity β-Ga2O3 solar-blind photodetectors optimized by oxygen vacancy engineering

Solar-blind photodetectors (SBPDs) are core essential components for many critical applications such as precision guidance, fire warning, and space communications. Ultra-wide bandgap semiconductor β-Ga2O3 is considered to be an ideal material for the fabrication of SBPDs. However, synthetizing β-Ga2O3 with high quality factor while simultaneously in situ modulation of electronic and optoelectronic properties to enhance performance has been challenging. Here, pulsed laser deposition (PLD) technology is used to synthesize high-quality β-Ga2O3 thin films on a sapphire substrate. The oxygen vacancy engineered β-Ga2O3 films can achieve in situ precise control of their surface morphology, optical parameters, and optoelectronic properties by simply adjusting the oxygen pressure. Meanwhile, the optimal thickness of the β-Ga2O3 film for the developing high-performance SBPD is ∼221 nm, determined by fitting and analyzing the optical parameters measured by the ellipsometry. Subsequently, the influence of oxygen pressure on the performance of β-Ga2O3 SBPD is thoroughly explored, considering the optimization of electrode size and deposition time. When the oxygen pressure is set to 15 Pa, the β-Ga2O3-based SBPD achieves highly competitive responsivity (R) and detectivity (D*) at 250 nm, with values of 1080 A·W−1 and 1.4 × 1016 cm·W−1·Hz1/2, respectively. Additionally, the noise component of the β-Ga2O3 SBPD is further studied to calibrated the traditional device performance results. This work introduces a simple and straightforward approach to in situ tuning of the optoelectronic properties of β-Ga2O3, which is important for advancing β-Ga2O3 film growth technology and fabricating high-performance photodetectors.

Structural design and electronic performance at MOx/diamond (M = Hf, Zr, Ti, Al, Sc, Y) interfaces for MOS device applications

The ultra-wide bandgap semiconductor diamond represents a promising potential for advancement and innovation in the field of electronic device development. Utilizing first-principles calculations, a thorough investigation has been performed on the structural and electronic characteristics of MOx/diamond (MOx = HfO2, ZrO2, TiO2, Al2O3, Sc2O3, Y2O3) heterostructures. The concentration of charge transfer at the high-κ oxide/diamond interfaces leads to obvious interface polarity localization characteristics. The studied MOx/diamond heterojunctions feature insulating interfaces without any gap states. The MOx/diamond supercells exhibit the ability to effectively confine holes on the diamond surface owing to the large band offsets (>1 eV), showing typical electronic properties of “type II” staggered energy band configurations. These findings demonstrate that the high-κ oxide MOx/diamond can serve as highly promising diamond gate dielectrics, and provide theoretical insights into the interfacial engineering of diamond MOS devices.

Lateral NiO/AlN Heterojunction Rectifiers with Breakdown Voltage >11 kV

Lateral NiO/AIN heterojunction diodes (HJDs) with breakdown voltage up to 11.6 kV and Ni/Au/AlN Schottky barrier diodes (SBDs) with VB of 8.6 kV were fabricated on layers grown on sapphire substrates by metalorganic chemical vapor phase deposition. The power figure-of-merits VB 2/RON where RON is the on-resistance were 0.31 MW·cm−2 for HJD and 0.16 MW·cm−2 for SBD. The lowest turn-on voltages were ∼2.03 and 1.91 V for HJDs and SBDs, respectively, with ON/OFF ratios up to 102. The maximum field before breakdown was 0.45 MV·cm−1 in HJDs and 0.31 MV·cm−1 in SBDs. These correspond to <3% of the critical field in AlN of ∼15 MV·cm−1. This work demonstrates there is still significant optimization to be done in the overall quality of the AlN, including purity, crystal perfection, and defect density to realize the potential of this material as an ultra-wide bandgap semiconductor for efficient multi-kV power switching applications. Our results also demonstrate the promise of NiO as a p-type conducting oxide for forming heterojunctions with AlN.

High Field Transport in (Ultra) Wide Bandgap Semiconductors: Diamond Versus Cubic GaN

High Field Transport in (Ultra) Wide Bandgap Semiconductors: Diamond Versus Cubic GaN

Probing room temperature indirect and minimum direct band gaps of h-BN

Hexagonal boron nitride (h-BN) has attracted considerable interest as an ultrawide bandgap (UWBG) semiconductor. Experimental studies focused on the detailed near band-edge structure of h-BN at room temperature are still lacking. We report a direct experimental measurement of the near band-edge structure performed on h-BN quasi-bulk wafers via photocurrent excitation spectroscopy (PES). PES resolved the band-to-band transitions near M- and K-points in the Brillion zone (BZ), from which the room temperature indirect band gap of EgMK ∼6.02 eV, minimum direct bandgap at M-point of EgM=6.36eV and next lowest direct energy bandgap at K-point of EgK=6.56eV, have been simultaneously determined for the first time experimentally. The measured energy differences between K- and M-points in the conduction band minimum (CBM) and valence band maximum (VBM) are Δ ECMK=0.54eV and Δ EVMK = 0.34 eV, respectively, in good agreement with the calculation results. Significantly differing from its III-nitride wurtzite counterparts, in which only electrons and holes in the conduction and valence band extremes at the Γ-point are predominantly involved in the optical and transport processes, the results highlighted that charge carriers associated with both M- and K-valleys control to the optical excitation, recombination and charge transport processes in h-BN.

Epitaxial Growth of Ga2O3: A Review.

Beta-phase gallium oxide (β-Ga2O3) is a cutting-edge ultrawide bandgap (UWBG) semiconductor, featuring a bandgap energy of around 4.8 eV and a highly critical electric field strength of about 8 MV/cm. These properties make it highly suitable for next-generation power electronics and deep ultraviolet optoelectronics. Key advantages of β-Ga2O3 include the availability of large-size single-crystal bulk native substrates produced from melt and the precise control of n-type doping during both bulk growth and thin-film epitaxy. A comprehensive understanding of the fundamental growth processes, control parameters, and underlying mechanisms is essential to enable scalable manufacturing of high-performance epitaxial structures. This review highlights recent advancements in the epitaxial growth of β-Ga2O3 through various techniques, including Molecular Beam Epitaxy (MBE), Metal-Organic Chemical Vapor Deposition (MOCVD), Hydride Vapor Phase Epitaxy (HVPE), Mist Chemical Vapor Deposition (Mist CVD), Pulsed Laser Deposition (PLD), and Low-Pressure Chemical Vapor Deposition (LPCVD). This review concentrates on the progress of Ga2O3 growth in achieving high growth rates, low defect densities, excellent crystalline quality, and high carrier mobilities through different approaches. It aims to advance the development of device-grade epitaxial Ga2O3 thin films and serves as a crucial resource for researchers and engineers focused on UWBG semiconductors and the future of power electronics.

Crystal Lattice Recovery and Optical Activation of Yb Implanted into β-Ga2O3.

β-Ga2O3 is an ultra-wide bandgap semiconductor (Eg~4.8 eV) of interest for many applications, including optoelectronics. Undoped Ga2O3 emits light in the UV range that can be tuned to the visible region of the spectrum by rare earth dopants. In this work, we investigate the crystal lattice recovery of (2¯01)-oriented β-Ga2O3 crystals implanted with Yb ions to the fluence of 1 ×1014 at/cm2. Post-implantation annealing at a range of temperature and different atmospheres was used to investigate the β-Ga2O3 crystal structure recovery and optical activation of Yb ions. Ion implantation is a renowned technique used for material doping, but in spite of its many advantages such as the controlled introduction of dopants in concentrations exceeding the solubility limits, it also causes damage to the crystal lattice, which strongly influences the optical response from the material. In this work, post-implantation defects in β-Ga2O3:Yb crystals, their transformation, and the recovery of the crystal lattice after thermal treatment have been investigated by channeling Rutherford backscattering spectrometry (RBS/c) supported by McChasy simulations, and the optical response was tested. It has been shown that post-implantation annealing at temperatures of 700-900 °C results in partial crystal lattice recovery, but it is accompanied by the out-diffusion of Yb ions toward the surface if the annealing temperature and time exceed 800 °C and 10 min, respectively. High-temperature implantation at 500-900 °C strongly limits post-implantation damage to the crystal lattice, but it does not cause the intense luminescence of Yb ions. This suggests that the recovery of the crystal lattice is not a sufficient condition for strong rare-earth photoluminescence at room temperature and that oxygen annealing is beneficial for intense infrared luminescence compared to other tested environments.

Low Frequency Electronic Noise Characterization of Au-W/β-Ga2O3 Schottky Diodes

Ultra-wide bandgap (UWBG) semiconductors have attracted tremendous amount of interest for applications in high-power electronics and solar-blind UV photodetectors. In particular, β-Ga2O3 has attracted significant research attention in recent years due to its promising electrical and optical characteristics including a large bandgap, high breakdown electrical field, and large Baliga’s figure of merit compared to well-established wide-bandgap technologies such as GaN and SiC [1].Low frequency electronic noise, which is present in all electronic devices, can be used as a diagnostic tool for semiconductor material and device characterization. By studying the low frequency noise in semiconductor materials and devices, the physics associated with the noise properties of bulk and interface defects and traps can be investigated [2]. Measurement of low frequency noise is also crucial for evaluating material quality and device reliability.In this work, we investigate the forward-bias diode parameters and low-frequency electronic noise in Au-W/β-Ga2O3 Schottky barrier diodes. The Schottky contact is formed by depositing 20 nm of Tungsten (W) using dc sputtering followed by 340 nm of Gold (Au) using e-beam evaporation, and subsequent annealing [3].We first measure the I-V characteristics and extract important diode parameters, such as the Schottky barrier height, ideality factor, and series resistance from room temperature forward-bias current-voltage characteristics. The extracted Schottky barrier height for these devices is in the range 0.7-0.8 eV and the ideality factor is approximately 1.2.We next measure the low-frequency electronic noise in Au-W/β-Ga2O3 Schottky diodes at different forward bias voltages at room temperature. We find that the current noise spectral density exhibits 1/f-type behavior for all forward bias voltages at low frequency with an exponent ranging from 0.75 to 1.15, indicating that the low frequency noise of these devices is dominated by excess (flicker) noise. No Lorentzian-shaped generation-recombination (G-R) noise is observed. At low frequencies, the shot noise contribution is found to be negligible for the values of the current in our devices, and the total noise is 1/f-limited.We also investigate the dependence of the current noise spectral density on forward bias current, revealing different relationships in different current regimes. At low currents, the noise spectral density is found to scale approximately as the square of current, whereas at high currents, the noise spectral density begins to saturate. Such noise behavior can be attributed to different noise sources dominating in different current regimes. Furthermore, using the noise figure of merit adapted for ultra-wide bandgap semiconductor devices [4], we find that the Au-W/β-Ga2O3 devices have lower noise levels compared to other emerging UWBG materials and similar noise levels as well-established technologies such as GaN.These results provide important insights into the electronic noise properties of Au-W/β-Ga2O3 Schottky diodes and show that low frequency noise characterization is an important diagnostic tool for assessing the quality and reliability of gallium oxide based wide-bandgap materials and device technologies.

(Invited) Ga2O3 Semiconductor Devices for High-Temperature Operation

Beta phase of gallium oxide (Ga2O3) has attracted a lot of attention as an ultra-wide band gap semiconductor for applications in high-power electronic devices. High power operation often comes with increased temperatures of the devices due to joule heating, especially in semiconductors like Ga2O3with low thermal conductivity. However, electrical performance and reliability of the Ga2O3based diodes and transistors at very high temperature, above 400C, is not well established.In this talk, I will present our recent experimental results on fabrication of Ga2O3semiconductor devices for applications as high-temperature diodes and hydrogen gas sensors. The fabricated Ga2O3/NiO p-n heterojunctions allow for device operation with >100-1000 rectification ratio up to 400-600C [1]. Despite the stable ultrathin Ohmic contact [2], the device performance degrades over tens of temperature cycles and hundreds of hours at these elevated temperatures, likely due to instability of the rectifying contact. We propose and implement alternative interfacial rectifying contact layers, that enable both high performance and long reliability of these high temperature Ga2O3 semiconductor devices.[1] Sohel, Zakutayev et al Physica Status Solidi (a) 220 2300535 (2023)[2] Callahan, Zakutayev et al J. Vac. Sci. Technol. A 41, 043211 (2023)

(Electronics and Photonics Division Poster Award Winner) A High Breakdown Voltage Silicon Carbide (SiC)/Gallium Oxide (Ga2O3) Heterojunction Diode for High Power Applications

Wide and ultrawide bandgap semiconductors demonstrate exceptional performance due to their elevated energy bandgap. This characteristic results in breakdown electric fields surpassing those found in conventional silicon electronics by more than an order of magnitude. Furthermore, the high energy bandgap offers distinctive advantages, including enhanced efficiency, drift velocity, increased voltage blocking, and high-frequency switching, making these semiconductors crucial in pushing the boundaries of electronic technology. Gallium Oxide and Silicon Carbide, distinguished by their unique properties, contribute significantly to the advancement of power electronics. Gallium Oxide, with its wide bandgap of 4.6 – 4.9 eV and excellent thermal stability, stands out for its ability to handle high electric fields and temperatures. Silicon Carbide, on the other hand, boasts a robust combination of high thermal conductivity and a wide bandgap of 3.26 eV, making it well-suited for high-power and high-temperature applications. The combination of these two materials in a heterojunction holds promise for the development of high-performance power devices. In this study, we propose a novel high breakdown voltage Silicon Carbide (SiC)/ Gallium Oxide(Ga2O3) heterojunction diode through TCAD Sentaurus. We present a comparative study of the breakdown voltage and electric field across different heterojunction lengths and under various doping concentrations. The investigated heterojunction showcases a high breakdown voltage of 1899V, making it a promising candidate for advanced power electronics applications. Furthermore, simulation results revealed a significant increase in the breakdown voltage of the SiC/Ga2O3 heterojunction, escalating from 1899 V to 4864 V when extending the heterojunction length. Improved specific ON resistance (RON, sp) and Baliga figure-of-merit (BFOM) will also be presented.

(Invited) Development of Single Crystal Nbn Superconductor on Wide Bandgap GaN By Sputtering and Thermal Annealing

The field of quantum computing is rapidly evolving, and Niobium Nitride (NbN) superconductors have emerged as a pivotal component in the field of quantum computing due to their unique properties. NbN possesses relatively higher superconducting transition temperature (Tc = 15-17 K) as compared to traditional superconductors, making it a promising material for various applications, including superconductor quantum computers, single photon detectors, and hot electron bolometers [1]. The investigation of NbN's superconductivity has been a subject of extensive research over the past few decades. Given that the properties of NbN are intricately linked to its crystal structure, lattice constant, and nitrogen content, precise control of the structural and electrical characteristics of NbN films is essential for the realization of NbN based quantum devices. The (111) planes of δ-NbN exhibit relatively small lattice mismatches with group-III nitride semiconductors (~0.2% for AlN and ~2.7% for GaN) [2], suggesting the potential for integrating crystalline NbN superconductors with nitride semiconductors on a single wafer. Notably, N-polar AlGaN/GaN high electron mobility transistors have been successfully fabricated on NbN films, operating under Tc with a negative differential resistance [3], indicating that the integration of nitride semiconductors and superconductors can be harnessed to create Josephson junctions. To achieve high-quality all-nitride NbN/group-III nitride/NbN Josephson junctions, a comprehensive understanding of the NbN/GaN heterointerfaces is crucial. Despite limited reports on the epitaxial growth of NbN films on nitride semiconductors, little is known about the structural and transport properties of such NbN films. Previously, MBE growth of NbN films have been demonstrated on GaN substrate, showing superconducting critical temperatures exceeding 10 K [4]. In this presentation, our efforts on the development of single crystal NbN thin films on wide bandgap GaN substrate using cost efficient sputtering technique followed by a subsequent high-temperature annealing will be presented. Commercially available single-crystalline GaN (0001)/sapphire templates as well as differently oriented (c and a-planes) sapphire substrates are used as the substrates for the sputtered deposition of NbN films at 20 °C. After the deposition, a high temperature annealing was performed separately at 950 °C for 30 mins under Ar as well as N2 atmosphere. While the as-deposited NbN film on GaN did not exhibit a discernible peak in the high-resolution XRD measurement, a high-intensity, single crystal (111)-oriented NbN film emerged prominently after annealing in both N2 and Ar environments. This suggests a notable enhancement in the crystalline quality of the superconducting material attributable to the thermal annealing process. Although the crystallinity of the NbN layer improves post-annealing, there is an associated increase in grain size and surface roughness. Preliminary findings indicate a reduction in the critical temperature of the NbN film from 12.82 K to 8.69 K after high-temperature annealing, potentially linked to the incorporation of impurities and crystallographic defects during this process. Further investigations using atomic resolution transmission electron microscopy, secondary ion mass spectrometry and X-ray photoelectron spectroscopy will be performed to investigate the influence of annealing duration, temperature, and conditions on the critical temperature, impurity incorporation and defect formation in NbN films deposited with different thickness.In continuation of our recent exploration into depositing crystalline superconducting NbN films on III-nitride semiconductors, this presentation will also focus on our recent advancement of ultrawide bandgap semiconductor materials such as the growth of high-quality quality β-Ga2O3 films and its ternary (AlxGa1-x)2O3 alloys, using metalorganic (MOCVD) and low-pressure (LPCVD) chemical vapor deposition growth techniques. Ga2O3 and (AlxGa1-x)2O3 have emerged as a promising semiconductor material platform for applications in high-power electronics and ultraviolet optoelectronics due to their excellent chemical and thermal stability, as well as high breakdown field strengths. The structural and electrical characteristics of Si-doped β-Ga2O3 and (AlxGa1-x)2O3 thin films will be presented. Additionally, we will present recent findings on achieving phase-pure β-(AlxGa1-x)2O3 films with a record-high Al composition (< 99%) [5]. Our research efforts into understanding the orientation-dependent Al incorporation in β-(AlxGa1-x)2O3 thin films and the determination of band offsets at β-(AlxGa1-x)2O3/β-Ga2O3 heterostructures will be presented. Furthermore, the presentation will touch upon the heteroepitaxial development of other phases of Ga2O3 and (AlxGa1-x)2O3, including α, γ, and κ. Acknowledgment: Dr. Bhuiyan acknowledges the support and guidance of his PhD advisor- Dr. Hongping Zhao at The Ohio State University for the MOCVD growth and characterization of β-Ga2O3 and (AlxGa1-x)2O3 films conducted in Zhao's group. Reference: Yamashita et al., Phys. Rev. Appl. 8, 054028 (2017).Kobayashi et al., Appl. Phys. Express 13, 061006 (2020).Yan et al., Nature 555, 183 (2018).G. Wright et al., APL Mater. 10, 051103 (2022).Bhuiyan et. al, Phys. Status Solidi RRL 17, 2300224 (2023). Figure 1

Alpha particle detection based on low leakage and high-barrier vertical PtOx/β-Ga2O3 Schottky barrier diode

High-performance radiation detectors are essential in many sectors spanning medical diagnostics, nuclear control, and particle physics. Ultrawide bandgap semiconductor materials have become one of the most promising candidates due to their excellent performance. Here, based on β-Ga2O3, a Schottky diode-type alpha particle detector was demonstrated. In order to reduce the reverse leakage current of the large-area device, the metal-oxide electrode PtOx was introduced to form high-barrier contacts (1.83 eV) with Ga2O3. The device exhibits a low leakage current density of 63 pA/cm2 at −100 V and apparent energy spectra of 241Am generated alpha particles with an energy of 5.486 MeV at various reverse voltages from −40 to −120 V. The charge collection efficiency (CCE) and energy resolution of the device (at −120 V) are 31.7% and 15.3%, respectively. Meanwhile, the mechanism of interaction between alpha particles and β-Ga2O3 was analyzed, and a 45° oblique incidence was adopted to increase the deposited energy of alpha particles in the depletion region. Furthermore, the differences between actual CCE and theoretical CCE are investigated as guidance for further improving detector performance. This work reveals the great potential and good prospects of Ga2O3 as an economical, efficient, and radiation-resistant ionizing radiation detector.

Gallium oxide (Ga2O3) energy dependent scintillation response to fast neutrons and flash gamma-rays.

Gallium oxide is a newly emerged ultrawide bandgap (4.9eV) semiconductor that is suitable as a combined electronics and radiation detection platform. We have experimentally demonstrated fast neutron and gamma-ray scintillation from Czochralski-grown β-Ga2O3 in a recent series (October 2023) of experiments at the unmoderated pulsed neutron spallation source located at the Los Alamos Neutron Science Center. Using the neutron time-of-flight (TOF) technique and a fast-gated intensified CCD camera, we observed energy-dependent neutron scintillation for neutron energies ranging from 1 to 400MeV, including the 14.1MeV neutron energy relevant to D-T fusion. Neutron flux is quantified and calibrated by cascading the scintillator after the fission chamber, enabling a detailed analysis of temporal and energy-dependent characteristics of the scintillation events. A pronounced scintillation signal from the spallation gamma flash with a temporal full width of half maximum of ∼4ns is indicative of the material's rapid response. Neutron energy dependent scintillation is observed using the TOF method at a 22.6-m distance from the neutron source. These results highlight the possibility of developing a Ga2O3 based fusion neutron diagnostic platform integrated with both scintillation and electronics functions on the integrated chip scale.

Atomic Scale Investigation Between the Heterointerfaces in BaTiO3 and Ultrawide Band-Gap Semiconductors

Atomic Scale Investigation Between the Heterointerfaces in BaTiO3 and Ultrawide Band-Gap Semiconductors

Correlating the electronic structures of β-Ga2O3 to its crystal tilts induced defects at nanoscale

Crosslinking structural transformation mechanism at nanoscale to the corresponding anisotropically electronic properties is essential to both the atomic-level controlled synthesis and extreme-conditional applications of the ultrawide bandgap semiconductors. Here, we report the first direct observation of bandgap variation at certain microstructural flaws in monoclinic crystal β-Ga2O3 via scanning transmission electron microscopy-electron energy loss spectrum (STEM-EELS) technology with both high energy and spatial resolution. Atomic-scale tilt of the Mosaic blocks relative to [010] zone axis is demonstrated to cause specific point defects accumulation at block boundaries, resulting in the formation of vacancy lines (or clusters) and then the crystal deformation induced flaws. These as-formed tiny Mosaic tilts observed from both in-plane and out-of-plane geometry are correlated to the corresponding electronic structure obtained by density functional calculations, indicating the carrier mobility limits transferred from intrinsic polar optical phonon scattering to the ionized oxygen atoms scattering in the defective monoclinic crystal. These findings provide a new insight on these anisotropic defect formation induced electronic structural variation, paving the way for precise synthesis and development of high-performance ultra-wide bandgap materials.

Microstructure Evolution and Electrical Behaviors for High-Performance Cu2O/Zr-Doped β-Ga2O3 Heterojunction Diodes.

Beta-gallium oxide (β-Ga2O3) is emerging as a promising ultrawide band gap (UWBG) semiconductor, which is vital for high-power, high-frequency electronics and deep-UV optoelectronics. It is especially significant for flexible wearable electronics, enabling the fabrication of high-performance Ga2O3-based devices at low temperatures. However, the limited crystallinity and pronounced structural defects arising from the low-temperature deposition of Ga2O3 films significantly restrict the heterojunction interface quality and the relevant electrical performance of Ga2O3-based devices. In this work, cuprous oxide (Cu2O)/Zr-doped β-Ga2O3 heterojunction diodes are fabricated by magnetron sputtering without intentional substrate heating, followed by an investigation into their microstructure and electrical behaviors. Zr doping can markedly enhance the Ga2O3 crystallinity at low substrate temperatures, transforming the amorphous structure of pristine Ga2O3 films into the crystallized β phase. Moreover, crystalline β-Ga2O3 facilitates the epitaxial growth of the Cu2O phase, suppressing the formation of detrimental secondary phase CuO at the heterojunction interface. Benefiting from the high-quality heterojunction interface, the Cu2O/Zr-doped β-Ga2O3 heterojunction diode exhibits a near-ideal electrical behavior with a low ideality factor of 1.6. The consistent electrical parameters extracted from current-voltage (J-V) and capacitance-voltage (C-V) measurements also confirm the high quality of β-Ga2O3. This work highlights the potential for the low-temperature production of high-quality β-Ga2O3-based heterojunction devices through Zr doping.

Wafer-scale bonded GaN–AlN with high interface thermal conductance

Wide and ultrawide bandgap semiconductors, such as GaN, play a crucial role in high-power applications, yet their performance is often constrained by thermal management challenges. In this work, we introduce a high-quality interface between GaN and AlN, prepared through wafer-scale bonding and verified via high-resolution transmission electron microscopy and transport experiments. We experimentally measured the thermal boundary conductance of the GaN–AlN interface, achieving up to 320 MW/m2K at room temperature using an ultrafast optical technique and sensitivity examinations. Non-equilibrium atomistic Green's functions and density functional theory simulations were conducted to model the interface phonon modes and their contributions to thermal transport, demonstrating good agreement with the experimental results from 80 to 300 K. Additionally, we observed a size-dependent effect on the thermal boundary conductance related to the GaN film thickness from 180 to 450 nm, which we attributed to quasi-ballistic thermal transport through molecular dynamics simulations. Our study has demonstrated a scalable processing route for wafer-sized chip packaging and provides fundamental insights to mitigate near-junction thermal resistance. Further exploration of interface engineering could facilitate co-design strategies to advanced thermal management technologies.

Covalent Heteroepitaxy of Large‐Area Vertical Hexagonal Boron Nitride for High‐Temperature VUV Photodetectors

AbstractHexagonal boron nitride (h‐BN) is a van der Waals (vdW) ultrawide bandgap semiconductor with high band‐edge absorption coefficient and chemical/thermal resistance, demonstrating great potential for vacuum ultraviolet (VUV) and UV‐C detection. Hitherto, most of their prevailing applications have exploited epitaxial films and multilayers either grown on substrates or transferred, which tend to form energy‐favorable noncovalent vdW epitaxy. Here, an alternative heteroepitaxy of 2‐inch h‐BN is reported with desirable thickness and vertically aligned vdW layers covalently bonded to sapphire, enabled by activating the inert substrate surface using ion impingement during deposition and the dislocation‐mediated epitaxial transition. The fabricated photodetectors allow efficient photon absorption and carrier collection using a simple planar device design, showing excellent VUV/UV‐C detection performance with ultrafast response of 270 ns/60 µs (rise/decay) and remarkable operating stability until 500 °C. This covalent heteroepitaxy of wafer‐scale h‐BN opens new avenues for optoelectronics and electronics significant to harsh environment applications.

Heated-H3PO4 etching of (001) β-Ga2O3

β-Ga2O3 is a promising ultra-wide bandgap semiconductor with melt-grown substrates that are scalable, particularly in the (001) orientation. In this study, we report on the heated-phosphoric acid etching of (001) β-Ga2O3. A wagon wheel pattern with spokes aligned to a range of specific crystallographic directions was fabricated on (001) β-Ga2O3. At 160 °C, the (001) etch rate was 1.47 μm/h, which is comparable to etch rates obtained via dry etch techniques. The etched (001) surface had a morphology that was smoother than an inductively coupled plasma etched surface. All spokes possessed relatively smooth sidewalls. Spokes oriented along the [100] direction exhibited minimal SiO2 mask undercut rates at lower etch temperatures and symmetric trapezoidal profiles with near vertical (010)-like sidewalls, which are ideal for device structures with a trench geometry. Spokes oriented along the [010] direction exhibited significant SiO2 mask undercut rates and asymmetric trapezoidal profiles with different sidewall angles. These spokes also possessed reduced sidewall angles, which is favorable for field management at device corners and edges. The etch process was used to realize a dense array of [100]-oriented trenches with a height of 1.5 μm, a base width of 2.0 μm, and a mask width of 0.8 μm. The work highlights the potential for ion damage-free, standalone heated-H3PO4 etching as a viable alternative to the dry etching of (001) β-Ga2O3 for high-performance device applications.