Trench Isolation Oxide Research Articles

The Application of RHBD to n-MOSFETs Intended for Use in Cryogenic-Temperature Radiation Environments

<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> Proton and X-ray irradiation effects are investigated in 0.35 <formula formulatype="inline"><tex>$\mu$</tex></formula>m conventional, annular, and ringed-source radiation-hardening-by-design (RHBD) CMOS devices. Transistors were irradiated with protons at both 300 K and 77 K. Radiation-induced oxide trapped charges in the shallow trench isolation (STI) oxide deplete the p-substrate and effectively shunt the source and drain, inducing off-state leakage. Without the STI, RHBD nFETs exhibit no radiation-induced off-state shunt leakage currents for devices irradiated at both 300 K and 77 K . Conventional 0.35 <formula formulatype="inline"><tex>$\mu$</tex></formula>m pFETs were not degraded by proton irradiation, since the leakage path cannot be formed in the n-well. A simple CMOS logic inverter shows no degradation in output voltage after proton irradiation for all tested temperature and bias conditions. More advanced 130 nm node nFETs show less TID sensitivity to STI leakage due possibly to the smaller physical STI volume and/or additional doping located on the STI sidewall. </para>

Enhanced TID Susceptibility in Sub-100 nm Bulk CMOS I/O Transistors and Circuits

This paper evaluates the radiation responses of 2.5 V I/O transistors and regular-threshold MOSFETs from a 90 nm commercial bulk CMOS technology. The data obtained from Co ionizing radiation experiments indicate enhanced TID susceptibility in I/O devices and circuits, which is attributed to the p-type body doping. A quantitative model is used to analyze the effects of doping and oxide trapped charge buildup along the sidewall of the shallow trench isolation oxide. These effects are captured in the general electrostatic equation for surface potential, which can be correlated to off-state leakage current. Device simulations are used in concert with experimental measurements and the analytical model to provide physical insight into the radiation response of each device type.

A High-Speed and High-Responsivity Photodiode in Standard CMOS Technology

This work investigates a new silicon (Si) photodiode (PD) by standard complementary metal-oxide-semiconductor (CMOS) process. The basic structure of the proposed Si PD is formed by multiple p-n diodes with shallow trench isolation oxide in between p- and n-region from Taiwan Semiconductor Manufacturing Company 0.18-mum CMOS technology. The proposed PD demonstrates a responsivity of 0.37 A/W at zero bias (lambda=823nm). At reverse bias (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</sub> ) of 14.3 V, the fabricated PD exhibits a high responsivity of 0.74 A/W, a -3-dB electrical bandwidth of 1.6 GHz, and an eye diagram at 3.5 Gb/s

An Investigation of Dose Rate and Source Dependent Effects in 200 GHz SiGe HBTs

<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> We present an investigation of the observed variations in the total dose tolerance of the emitter-base spacer and shallow trench isolation oxides in a commercial 200 GHz SiGe HBT technology. Proton, gamma, and X-ray irradiations at varying dose rates are found to produce drastically different degradation signatures at the various oxide interfaces. Extraction and analysis of the radiation-induced excess base current, as well as low-frequency noise, are used to probe the underlying physical mechanisms. Two-dimensional calibrated device simulations are employed to correlate the observed results to the spatial distributions of carrier recombination in forward- and inverse-mode operation for both pre- and post-irradiation levels. Possible explanations of our observations are offered and the implications for hardness assurance testing are discussed. </para>

Temperature-Dependence of Off-State Drain Leakage in X-Ray Irradiated 130 nm CMOS Devices

The off-state drain current leakage characteristics of 130 nm CMOS technology are investigated using x-ray irradiation and operating temperature as variables. Radiation-induced interface traps in the gate oxide to gate-drain overlap region strongly enhance the off-state leakage as a function of gate bias. Due to the thin gate oxide in these 130 nm devices, we find that drain-edge direct tunneling is more plausible than conventional gate-induced-drain-leakage in explaining the observed increase in drain leakage. Radiation-induced traps in the shallow trench isolation oxide create parasitic channels in the p-well and produce another source of off-state drain leakage with increasing total dose. The drain current increase from both the gate overlap region and the shallow trench edge are enhanced with increasing total dose and suppressed by cooling

Two-dimensional methodology for modeling radiation-induced off-state leakage in CMOS technologies

A modeling approach using two-dimensional device simulations is presented, which enables the extraction of parameters for the radiation-induced parasitic MOSFET created at the edge of the shallow trench isolation (STI) oxide. With the model, one can estimate drain-to-source off-state leakage current (I/sub OFF/) resulting from build-up of oxide trapped charge (N/sub OT/). The impact of nonuniform N/sub OT/ build-up in the STI resulting from total ionizing dose (TID) exposure and external bias conditions is analyzed through volumetric simulations and compared to experimental data. Saturation for the off-state leakage current as a function of trapped charge is also investigated.

Dependence of Oxide Pattern Density Variation on Motor Current Endpoint Detection during Shallow Trench Isolation Chemical Mechanical Planarization

In this study, we evaluate the limitations associated with variable shallow trench isolation (STI) oxide pattern densities for accurate motor current endpoint detection during chemical mechanical planarization (CMP). Results indicate that repeatable motor current endpoint detection can be achieved for STI wafers with oxide pattern density variations of up to 17.4%. Furthermore, results show that a dependence exists between the STI oxide pattern density variation and motor current endpoint success during polishing. According to the findings of this study, a suitable motor current endpoint detection system could yield successful termination points for STI polishing, as well as reduce the need for polishing reworks.

Mechanisms of circular defects for shallow trench isolation oxide deposition

Shallow trench isolation (STI) is extensively used as the isolation method beyond 0.18 μm generation. This study explored the formation of circular defects in high-density plasma (HDP) STI deposition. Circular defects were caused by the burst flow of silane reactive gas. The defect maps were coincident with the silane flow field. Fourier transform infrared and secondary-ion-mass spectroscopy data exhibited that the silane-burst flow formed a silicon rich oxide (SRO) film. This SRO film existed between the STI oxide and liner oxide. The circular defects were easily found using optical microscopy (OM) for STI with SRO film. Scanning electron microscopy and transmission electron microscopy photographs show that these defects include bubbles and concavities. When SRO fully covers the liner oxide, bubbles easily form by delamination between SRO film and liner oxide. This correlates with the high tensile stress produced by the SRO film. Besides this, higher STI deposition temperatures yield more bubbles. When SRO discontinuously forms on the liner oxide, the concavities were induced by the variation of STI deposition rate on SRO film and liner oxide. The surface charge difference between the SRO film and the liner oxide is the driving force for the generation of concavities.

Radiation-enhanced short channel effects due to multi-dimensional influence from charge at trench isolation oxides

Radiation enhanced drain induced barrier lowering (DIBL) was experimentally observed and verified by 3D simulations for submicron devices with trench isolation oxides. Submicron MOSFETs with shallow trench isolation were exposed to total-ionizing-dose radiation. Prior to irradiation, the devices exhibited near-ideal current-voltage characteristics, with no significant short-channel effects for as-drawn gate lengths of 0.4 /spl mu/m. Following irradiation, the off-state leakage current increased significantly for total doses above about 650 krad(SiO/sub 2/). In addition, the irradiated devices exhibited DIBL that increased the drain current by 5-10/spl times/ for a gate length of 0.4 /spl mu/m (the nominal minimum gate length for this process) and much more for slightly shorter devices (0.35 /spl mu/m). The increase in the off-state leakage current and the accompanying DIBL are shown to be associated with a parasitic field-effect transistor that is present at the edge of the shallow trench. Three-dimensional simulations are used to illustrate the effect. Simulations show that trapped charge at the trench sidewalls enhances the DIBL by depleting the edges of the channel. Radiation-induced charge may decrease the effectiveness of short-channel engineering.

PLATOP: a novel planarized trench isolation and field oxide formation using poly-silicon

A novel isolation scheme named planarized trench isolation and field oxide formation using poly-silicon (PLATOP) Is described. PLATOP is applicable to high-performance submicron VLSI since it results in encroachment-free shallow trenches, and planarized field oxide. The process offers poly silicon-filled deep trenches. The process also relies on noncritical lithography and novel etch processes to planarize the deposited poly-silicon from the top of the active areas, and oxidation to consume the poly-silicon in the field regions. Electrical results are presented proving the viability of the isolation scheme.