In the past two years, the field of glass-based mini LED backlight has developed rapidly. In this article, experimental research on the design of the LED pad is conducted, including the Cu thickness, stack-up structure and pad size. The experimental results show that after the LED is solidified, the copper at the bonding pad is consumed and intermetallic compounds (IMC) are formed. The IMC has a granular morphology, dispersed in the solder layer. The main components of IMC are Cu6Sn5 and Ag3Sn. When the copper thickness on the pad increases from 0.6um to 3.6um in turn, the proportion of IMC in the solder layer increases significantly. The formation of IMC can improve the connection strength, but too much IMC will reduce the mechanical strength and the rework times. The fundamental method is to suppress the reaction rate of the Cu layer and the SnAgCu solder. The Electroless Nickel Immersion Gold (ENIG) process is a feasible method, because the Ni layer can effectively reduce the formation rate of IMC, and Au layer can effectively prevent the Cu of the LED pad from being oxidized. In addition, when the expansion of the BP pad relative to the LED bump increases, the die bonding yield is also significantly improved. These verification results could provide reference for future mini LED product design and production.