Many studies have reported the interfacial reaction of Sn-Ag/ electroless nickel immersion gold (ENIG). Various analysis techniques, such as scanning electron microscopy, electron probe microanalyzer, and transmission electron microscopy (TEM), have been used to examine interfacial reaction. Among them, TEM equipped with analytical attachments offers the most complete tool for characterizing the formation of intermetallic compounds (IMCs) at the interface. However, solders are typically soft and ductile, while IMCs tend to be quite hard and brittle, which has limited the level of success in preparing TEM samples. We utilized ultramicrotomy since it might offer a reasonable and relatively quick alternative in this case. Ultramicrotomy has been used for the preparation of TEM specimens from biological materials and extending a range of materials including polymers, coating layer, particles, and even metals (Becker & Bange, 1993; Glanvill, 1995; Howell et al., 1995). TEM sample making to section hard materials by ultramicrotomy are not new. Besides, it has been traditionally considered that the mechanical damage during sectioning by diamond knife might hinder unambiguous specimen characterization. However, this technique also has many advantages such as no ion beam irradiation damage, no chemical mixing, no differential thinning rate and the ease of preparation of many serial sections with large, thin areas of uniform thickness in a relatively short time (Quintana, 1997). The increasing acceptability of ultramicrotomy in materials science is evidenced by a number of recent paper giving results for different hard materials (Hwang & Suganuma, 2003).
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