This research study investigates the hole metallisation processes of the microwave printed circuit board. During the study, the poly(tetrafluoroethylene) (PTFE) wall of the holes was modified by sodium naphthalene solution. Owing to the disruption of the C–F bond by the sodium atoms on the PTFE surface transforming C– dangling bonds, the surface energy of the PTFE increased from about 20 to 60–70 mN cm−1. The study employed XPS analysis to examine the modification mechanism. The results of the authors' study show peel strength of ∼2·03 N cm−1 between the copper layer and the sample treated with sodium naphthalene solution within the time range of 20–30 s.