Abstract
We demonstrated here fascicle copper (Cu) metallization of poly(tetrafluoroethylene) [PTFE] surface through an atmospheric pressure plasma liquid deposition [APPLD] technique to design the interface for high frequency electronic devices. We found that exposing with atmospheric pressure helium plasma to the PTFE surface covered with thin liquid film, containing both poly(4-vinylpyridine) as a metal ion trapping polymer and copper acetate, simultaneously offered the plasma-induced direct graft polymerization and the reduction of Cu2+. The modified surface was characterized by using several analytical techniques, including water contact angle measurement, X-ray photoelectron spectroscopy, and atomic force microscopy.
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