The catalytic activity at the surface of Pt based MIS field effect gas sensors is modified by the deposition of thin films of SnO 2, Al 2O 3 and SiO 2, grown by reactive sputtering. It is found that a very thin layer (<10 nm) of SiO 2 and SnO 2 changes the catalytic activity towards higher NH 3 selectivity, but with thicker films the sensor response vanishes. Since the response mechanism for these sensors is dependent on dissociation of molecules, it is likely that at low temperatures (140 °C), neither dissociation on nor transport/diffusion through the thicker films takes place. However, with Pt in conjunction with SiO 2 or SnO 2, the surface reactions will be altered, with enhanced NH 3 selectivity as a result. A thin film of Al 2O 3, on the other hand, has a much smaller influence on the gas response to the test gases used in this work. Furthermore the sputtering process is found to strongly influence the sensor responses, and specifically reduce the sensitivity of the sensor. A thin intermediate layer of evaporated Pt does not completely protect the underlying structure from sputter induced damage.
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