We demonstrate that boron diffuses at high concentrations during low-temperature thermal annealing in amorphous silicon pre-amorphized by germanium ion implantation. For a typical boron ultrashallow junction doping profile, concentrations as high as 2×1020 cm−3 appear to be highly mobile at 500 and 600 °C in the amorphous silicon region before recrystallization. In crystalline silicon at the same temperatures the mobile boron concentration is at least two orders of magnitude lower. We also show that boron diffusivity in the amorphous region is similar with and without fluorine. The role of fluorine is not to enhance boron diffusivity, but to dramatically slow down the recrystallization rate, allowing the boron profile to be mobile up to the concentration of 2×1020 cm−3 for a longer time.