The effects of thermal process on the surface degradation of GaN were investigated. The GaN was grown on Si(111) substrate and thermally treated. When the temperature of thermal processes increased, the grain boundary expanded and pits generated as a result of the decomposition. The band-edge emission intensity in the photoluminescence spectra was increased by thermal processes. The deep-level emission centered at about 2.2 eV suppressed after thermal processes. We estimate that they were caused by the increase of band-edge emission intensity or the surface decomposition associated with impurity-related recombination in GaN. The full-width at half-maximum of (0002) X-ray rocking curve did not change significantly before and after the thermal processes. This indicated that the surface decomposition of our thermal processes did not affect the crystal quality. A side effect of decomposition owing to the high-temperature process should be considered in the fabrication of GaN-based electronic devices.