Addition Of Indium Research Articles

Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces

Although there are studies devoted to lower Indium (In) addition, Sn-Bi alloys containing 10 wt.% In or more have been barely investigated so far. Higher In contents may offer the potential for improved joint production, better control over the growth of interfacial layers, and enhanced mechanical strength. The present article focuses on the solidification, wettability, adhesion strength, and interfacial intermetallic growth in the Sn-40%Bi-10%In alloy soldered on Cu and Ni pads. SEM-EDS, wettability tests, and tensile tests were performed. The contact angles were measured in Cu and Ni as 24° and 26°, respectively. Indium addition promoted coarsening of the as-solidified microstructure due to an increase in the alloy solidification range. The Bi spacing was increased at least three times, with a strong segregation of Bi towards the interface. The formation and growth of alloy/Cu reaction layers were also evaluated under the different aging conditions of the as-soldered joints, simulating real service. A growth kinetics model of the reaction layer showed that In increases the activation energy, thereby reducing the layer growth. The adhesions of the formed intermetallics films in Cu and Ni were analyzed using tensile tests. It was observed that the alloy/Ni couple exhibited better adhesion. Premature fracturing appears to happen in the alloy/Cu joint due to the higher intermetallic compound’s (IMC) thickness, rough morphology, and coarser microstructure. Both ductile fracture features with dimples and cleavage zones associated with Bi, Cu6(Sn,In)5, and Ni3Sn4 intermetallics were observed.

Physical Vapor Deposition of Indium-Doped GeTe: Analyzing the Evaporation Process and Kinetics

Chalcogenide glasses have broad applications in the mid-infrared optoelectronics field and as phase-change materials (PCMs) due to their unique properties. Chalcogenide glasses can have crystalline and amorphous phases, making them suitable as PCMs for reversible optical or electrical recording. This study provides an in-depth analysis of the evaporation kinetics of indium-doped chalcogenides, GeTe4 and GeTe5, using the physical vapor deposition technique on glass substrates. Our approach involved a detailed examination of the evaporation process under controlled temperature conditions, allowing precise measurement of rate changes and energy dynamics. This study revealed a significant and exponential increase in the evaporation rate of GeTe4 and GeTe5 with the introduction of indium, which was particularly noticeable at higher temperatures. This increase in evaporation rate with indium doping suggests a more complex interplay of materials at the molecular level than previously understood. Furthermore, our findings indicate that the addition of indium affects the evaporation rate and elevates the energy requirements for the evaporation process, providing new insights into the thermal dynamics of these materials. This study’s outcomes contribute significantly to understanding deposition processes, paving the way for optimized manufacturing techniques that could lead to more efficient and higher-performing optoelectronic devices and memory storage solutions.

Evolution of the Microstructure, Phase Composition and Thermomechanical Properties of the CuZnIn Alloys, Achieved by Thermally Controlled Phase Transitions

Ternary alloys with CuZnIn compositions based on the binary CuZn diagram and the modeled ternary system solidus projection were investigated. The as-cast alloys, hot-rolled sheets, and samples annealed at low temperature were examined. It was found that the α-CuZn solution phase, with minor indium additions (1–2% at.), was the primary phase crystallizing during casting and remained stable at low temperatures. The ternary phase with an approximate composition of Cu8(In,Zn)4.5 and a structure analogous to the high-temperature γ-Cu9In4 phase crystallized from the liquid state and remained stable at low temperatures. This behavior results from the stabilization against peritectoidal decomposition by the Zn atoms when substituting In in the structure. A new phase γ*-Cu9(In,Zn)4 with a modified structure was identified, characterized by a reduced unit cell and an altered electronic structure. The hot-rolling process preserves the phase composition and forms a composite-like structure, with the matrix composition of γ* and large ellipsoidal α-CuZn solution particles. On a microscale, the γ* matrix exhibited a specific structure resulting from segregation processes and was composed of micrometer-sized α-CuZn(In) solution particles and nano-sized β-CuZn phase precipitates. Low-temperature annealing intensifies the γ* matrix decomposition through binary phase precipitation.

Influence of 0.25% Indium Addition to Ni/CeO2 Catalysts for Dry Reforming of Methane

In this study, the surface and textural properties as well as the catalytic performance of Ni/CeO2 and NiIn/CeO2 catalysts prepared by wet impregnation (WI) and deposition–precipitation (DP) are investigated. The addition of Ni (3.0 wt.%) resulted in a decrease in the specific surface area and pore volume in the case of the WI method, possibly due to a blockage of mesopores. A minimal addition of In (0.25 wt.%) caused a further decrease in the surface area in both cases. XRD analysis showed that Ni deposited on CeO2 by DP resulted in some lattice incorporation, affecting the crystallinity of the support. The H2-TPR profiles altered depending on the different ways of Ni and In introduction. STEM-EDS-derived elemental maps indicated that the Ni and NiIn particles deposited on CeO2 using the DP method were somewhat smaller than in the WI synthesis. A comprehensive CO-DRIFTS analysis proved a direct Ni-In interaction in bimetallic samples, leading to the formation of a surface NiIn alloy. Ni/CeO2 catalysts showed a higher activity in the process of dry reforming of methane (DRM) than the bimetallic counterparts at 650 °C, with the Ni_DP sample performing slightly better. However, the Ni_DP catalyst showed significant coking, which was drastically reduced by the addition of In. The agglomeration of Ni and/or NiIn particles during the 6 h DRM reaction somewhat impaired the catalyst performance. Overall, this study highlights the intricate relationship between the catalyst preparation, surface properties and catalytic performance in the DRM reaction and emphasizes the beneficial role of In addition in reducing the coking of the monometallic catalyst and the critical location and surface morphology of nickel nanoparticles decorated with indium and in contact with ceria.

Effect of alloying elements on microstructural and electrical property in Sn–Cu–Bi lead-free solder alloys

Sn–0.7Cu eutectic alloy is a low-cost alloy with moderate melting point and wetting that appears to be adequate for some applications. Lead-free Sn–0.7Cu joint solders on copper substrate were investigated in this study. To enhance the performance of the alloy, many previous studies verified the importance of adding bismuth to the eutectic alloy. (84.3Sn–0.7Cu–15Bi) ternary alloy is regarded as a potential substitute for hazardous Sn–Pb solders, possessing a melting point of 206 °C. The effects of incorporating selenium, zinc, or indium on the electrical characteristics, crystal structure and microstructure of the tin copper-bismuth alloy were examined. Phase identification of the base solder and various newly developed alloys was performed by X-ray diffraction tests and an LCR meter was used to measure the electrical resistance of the prepared samples. The unit cell volume, and lattice parameters of the tetragonal Sn base were altered, along with the electrical characteristics of the base solder alloy. According to the test results, the best addition was by indium since it reduced the grain size of the base solder alloy. Smaller grain size improves the mechanical properties of the solder. Furthermore, indium addition increased the electrical conductivity of the base solder alloy compared to other alloying additions.

The Effects of Indium Additions on Tribological Behavior of Spark Plasma Sintering-Produced Graphene-Doped Alumina Matrix Composites for Self-Lubricating Applications

Alumina (Al2O3) ceramics are interesting for low-weight and mid-high temperature applications. The addition of indium (In) and graphene nanoplatelets (GNPs) can be used to reduce the density and modify the functional properties and mechanical performance of the ceramic matrix. GNP and In-reinforced Al2O3 matrix composites were prepared by the spark plasma sintering (SPS) technique. Monolithic Al2O3 and Al2O3 matrix composites with either 5 or 10 wt.% of In and 2 wt.% of GNPs (Al2O3-5In-2GNPs and Al2O3-10In-2GNPs) were compacted into disc-shaped samples. The microstructure was studied and characterized with light-optical microscopy (LOM) and scanning electron microscopy (SEM). Hardness was determined using the Vickers technique and tribological properties were studied by the ball-on-disk method. The coefficient of friction (COF) and specific wear rates were evaluated from tribological tests. Worn surfaces were studied by SEM and confocal microscopy. Interdiffusion transition regions were formed among individual microstructural constituents (Al2O3, In, GNPs) under high sintering temperatures, which were responsible for the balanced hardness and low porosity of the produced composites. The addition of In and graphene nanoplatelets resulted in smaller COF and wear rates indicating good improvement in the tribological behavior. The prepared Al2O3-5In-2GNP and Al2O3-10In-2GNP composites represent promising nanocomposites for self-lubricating applications.

Effect of indium addition on the electrocatalytic performance of Zn–Al–Inx hydroxide for CO2 reduction to CO

The addition level of indium has a significant impact on the electrocatalytic performance of the catalysts. The Zn–Al–In0.2 hydroxide electrocatalyst CO FE prepared by hydrothermal synthesis can reach 97.56% at −1.1 V vs. RHE.

Thermodynamic and Microstructural Analysis of Lead-Free Machining Aluminium Alloys with Indium and Bismuth Additions.

The present study comprises an investigation involving thermodynamic analysis, microstructural characterisation, and a comparative examination of the solidification sequence in two different aluminium alloys: EN AW 6026 and EN AW 1370. These alloys were modified through the addition of pure indium and a master alloy consisting of indium and bismuth. The aim of this experiment was to evaluate the potential suitability of indium, either alone or in combination with bismuth, as a substitute for toxic lead in free-machining aluminium alloys. Thermodynamic analysis was carried out using Thermo-Calc TCAL-6 software, supplemented by differential scanning calorimetry (DSC) experiments. The microstructure of these modified alloys was characterised using SEM-EDS analysis. The results provide valuable insights into the formation of different phases and eutectics within the alloys studied. The results represent an important contribution to the development of innovative, lead-free aluminium alloys suitable for machining processes, especially for use in automatic CNC cutting machines. One of the most important findings of this research is the promising suitability of indium as a viable alternative to lead. This potential stems from indium's ability to avoid interactions with other alloying elements and its tendency to solidify as homogeneously distributed particles with a low melting point. In contrast, the addition of bismuth does not improve the machinability of magnesium-containing aluminium alloys. This is primarily due to their interaction, which leads to the formation of the Mg3Bi2 phase, which solidifies as a eutectic with a high melting point. Consequently, the presence of bismuth appears to have a detrimental effect on the machining properties of the alloy when magnesium is present in the composition.

Improved quality and inhibited aggregation of Ag–In alloy films

Ag atoms agglomeration at environmental conditions limits its applications. Here, the influences of indium addition on the microstructure and performance of Ag films were investigated. The results show that the particle size, pore size, and roughness of Ag–In alloy films are greatly reduced compared with those of the Ag film. A small amount of indium can efficiently inhibit the agglomeration/migration of Ag atoms and thus significantly improve the reflective performance at damp heat environment. These results show that alloying is an effective method to inhibit Ag atoms migration/agglomeration at environmental conditions.

Influence of Indium addition on microstructural and mechanical behavior of Sn solder alloys: Experiments and first principles calculations

Influence of Indium addition on microstructural and mechanical behavior of Sn solder alloys: Experiments and first principles calculations

Robust effects of In, Fe, and Co additions on microstructures, thermal, and mechanical properties of hypoeutectic Sn–Zn-based lead-free solder alloy

This study examines the influence of separate and dual minor alloying additions of indium (In) and ferrous/cobalt (Fe/Co) on the microstructure, thermal, and mechanical properties of hypoeutectic Sn–7wt.% Zn lead-free solder alloy. The results showed that the addition of In resulted in significant refinement in the microstructure and formation of new intermetallic compounds (IMCs) such as In–Sn phases which capable of extensively removing the unfavorable needle-like α-Zn phase. However, the additions of Fe/Co resulted in the creation of new coarsening flower-shaped IMCs identified as Zn–Co, Fe–Sn, and Co–Sn–Zn distributed uniformly which may have a marked effect on the mechanical and thermal properties of Sn–Zn solder alloy. Thermal analysis by a differential scanning calorimeter indicates slightly reduction in the onset temperature, melting temperature, and undercooling of the Sn–7wt.% Zn by the addition of In, while the pasty range enlarged as compared to Fe/Co additions. The tensile tests indicate that the Sn-Zn-In solder alloy exhibited a superior balance of ultimate tensile strength, yield strength, Young’s modulus, and elongation of 51.5 MPa, 44.4 MPa, 22.2GPa, and 44.5%, respectively, which are better than both those of the Sn–Zn and Sn–Zn–Fe/Co solder alloys. This can be attributed to the synergistic strengthening mechanism of refinement in the microstructure and precipitation of fine secondary particles.

Selective catalytic reduction of NOx with NH3 and tolerance to H2O & SO2 at high temperature over zeolite supported indium-copper bimetallic catalysts for gas turbine

An indium and copper-doped mordenite catalyst (InCu/MOR) was prepared and tested as a potential catalyst for high temperature NH3 selective catalytic reduction (NH3-SCR) of NOx in the gas turbine. The InCu/MOR catalyst exhibited excellent catalytic activity (over 83 % NOx conversion) in the presence of 5 % H2O and 100 ppm SO2 above 550 °C. A series of characterization (XRD, Py-TR, XPS, NH3-TPD, H2-TPR and in-situ DRIFTS) were applied to analyze the catalyst. The obtained results showed that the addition of indium promoted the formation of isolated Cu2+ and more Brønsted acid sites, which could improve the tolerance to sulfur dioxide and inhibit the occurrence of high temperature ammonia oxidation side reactions. Meanwhile, the ammonia on InO+/In2O3 sites was activated and reacted with the nitrate/nitrite species on the catalyst surface to form nitroammonium (NH4NO3/NH4NO2), which was a short lived intermediate for NH3-SCR. The superior catalytic performance of InCu/MOR could attribute to these comprehensive effects.

Effect of Sb and In additives on thermal and electrical properties of Sn–9Zn–4Bi alternative lead-free solder alloy

Due to the threats of lead to human and environmental health with Tin (Sn)- lead (Pb) solder alloys, efforts to develop lead-free solders continue. To adapt to different soldering areas, especially electronics, the search for alloys that can replace Sn–Pb has increased. The better the solders are in terms of thermal and electrical properties at the junctions, the better the performance of the circuit. In this study, changes in thermal conductivity, electrical conductivity, and melting behavior of 0.5–2 mass percent (wt.%) antimony (Sb) and 0.5–1.5 mass percent (wt.%) indium (In) addition to Sn–9Zn–4Bi alloy were investigated. Measurements of thermal and electrical conductivity with temperature were made by linear heat flow and four-point probe methods, respectively. The melting temperatures (peak temperature) of the alloys produced vary between 477.70 and 484 K (K). When the transition temperature, which is important in solders, is compared to Sn–9Zn–4Bi-[x]Sb (x = 0.5–2 wt%) and Sn–9Zn–4Bi-yIn (y = 0.5–1.5 wt%) alloys, it is the alloy with the lowest value with 13.80 K and the addition of 1 wt% Sb. The thermal and electrical conductivity values increased with the contribution of Sb and In. In addition, temperature coefficients for thermal and electrical conductivity were calculated. Electron and phonon contributions to the thermal conductivity were determined from the Wiedemann-Franz law. It was determined that electron contribution was higher for each alloy.

Effect of indium on the microstructure and corrosion resistance of the galvanising coating

The addition of alloying elements to a zinc bath is an effective method to inhibit silicon reactivity while galvanising silicon-containing steel. In this work, the effect of indium on the microstructure and corrosion resistance of galvanising coating on the Q235 steel was investigated. The results show that indium can promote the dense Γ phase to form, 0.79 wt-% Si can be dissolved in the ζ phase with the addition of indium into the zinc bath, which decreased the segregation of silicon at ζ phase boundaries and reduced the liquid phase channel, and inhibited the rapid growth of the ζ phase. Indium can improve the corrosion resistance of the coating. Compared with pure zinc coating, the self-corrosion current of Zn-0.4In coating decreased by 9.59 µA/cm2.

Anodic behaviour of indium doped zinc alloy TsAMSv4-1-2,5 in NaCl Electrolyte

Zinc-aluminium alloys find a wide application in different industries. Approximately half of the produced zinc is used as corrosion protection coatings for steel structures. Corrosion resistance is one of the essential properties of zinc alloys as well. Zinc alloys are highly resistant to atmospheric and marine corrosion, as well as basic and acidic solutions. They have low density and are easily workable by cutting. As is well-known, lead serves as the main concomitant metal for metallic zinc, and its concentration may reach 2.5 wt. % (for TsZ grade of zinc). This research is aimed at designing a new alloy on the basis of zinc alloy TsAM 4-1, which is obtained from a low zinc grade TsZ labelled as TsAMSv4-1-2,5. The alloys were analyzed following potentiostatic technique in a potentiodynamic mode at the potential sweep rate of 2 mV/s in NaCl electrolyte on the pulse potentiostat PI-50-1.1. The TsAMSv4-1-2,5 alloy was doped with 0.05–1.0 wt. % of metallic indium. It was found that as the chloride ion concentration in NaCl electrolyte rises, the free corrosion, pitting and repassivation potentials tend to shift in the negative region while the corrosion rate increases by 28%. It is shown that indium additions cause a 10% drop in the corrosion rate while the alloys’ electrochemical potentials tend to shift in the positive region. Due to increased corrosion resistance of the zinc alloy TsAMSv4-1-2,5 doped with indium, one can save 10% of metal and thus achieve a more cost-effective production of zinc alloy items.

Effect of Indium Addition on the Low-Temperature Selective Catalytic Reduction of NO x by NH3 over MnCeO x Catalysts: The Promotion Effect and Mechanism.

A MnCeInOx catalyst was prepared by a coprecipitation method for denitrification of NH3-SCR (selective catalytic reduction). The catalysts were characterized by Fourier transform infrared spectroscopy (FTIR), X-ray diffractometry, scanning electron microscopy, X-ray photoelectron spectroscopy, Brunauer–Emmett–Teller analysis, H2 temperature-programmed reduction, and NH3 temperature-programmed desorption. The NH3-SCR activity and H2O and SO2 resistance of the catalysts were evaluated. The test results showed that the SCR and water resistance and sulfur resistance were good in the range of 125–225 °C. The calcination temperature of the Mn6Ce0.3In0.7Ox catalyst preparation was studied. The crystallization of the Mn6Ce0.3In0.7Ox catalyst was poor when calcined at 300 °C; however, the crystallization is excessive at a 500 °C calcination temperature. The influence of space velocity on the performance of the catalyst is great at 100–225 °C. FTIR test results showed that indium distribution on the surface of the catalyst reduced the content of sulfate on the surface, protected the acidic site of MnCe, and improved the sulfur resistance of the catalyst. The excellent performance of the Mn6Ce0.3In0.7Ox catalyst may be due to its high content of Mn4+, surface adsorbed oxygen species, high specific surface area, redox sites and acid sites on the surface, high turnover frequency, and low apparent activation energy.

The Effect Of Indium Addition on The Corrosion Kinetics of Sn–3Ag–0.5Cu Alloy In HCl Acid Solution

The aim of this study is to investigate the corrosion behavior of potentiodynamic polarization indium added Sn-3Ag-0.5Cu alloy in 1M HCl solution. SEM and EDX analyses were examined the properties of the alloy samples. Polarization analyses showed by the addition of 0.5, 1, and 2 wt.% indium to the SAC305 solder alloy does not lead to notably different corrosion potentials. The pseudo-passivation region is observed instead of a true passivation region that currents are nearly constant. By the scanning interval, this pseudo-passive region does not have a reactivation point. On the other hand, corrosion rates follow a pattern in which 0.5% wt of indium substitution of silver causes the corrosion rate to decrease. However, with further silver replacement by indium, the rate of corrosion increases. According to the results of microstructure analysis, the formation of corrosion products and the existence of voids and porous structures limit their stability.

The Influence of Indium, In on Microstructure Evolution During Isothermal Aging of Sn-0.7Cu

This paper reports influence of isothermal aging on bulk solder and the microstructure evolution of commercial Sn-0.7Cu (Sn-0.7Cu-0.05Ni+Ge) Pb-free solder alloy with addition of bismuth (Bi) and indium (In). Sn-0.7Cu, Sn-0.7Cu-1.0Bi, Sn-0.7Cu-1.0Bi-1.0In, Sn-0.7Cu-1.0Bi-4.0In, Sn-0.7Cu-1.0Bi-7.0 In solder alloys were prepared via casting process. The solder alloys were aged isothermally at 180°C for 500 hours and microstructure was compared with that of as-cast solder. Microstructure of bulk solder and melting temperatures were analysed via scanning electron microscopy, SEM and differential scanning calorimetry, DSC. The addition of In up to 7 wt% reduced the melting temperature from 231.1 to 218.5°C, and crystallisation temperature from 205.8 to 194.7°C with decreasing degree of undercooling which indicates that the In-added solder alloy had faster nucleation rate. Microstructure evaluation showed that as the amount of indium added increased to 7.0 wt%, the ß-Sn grains became smaller suggesting a refinement effect with In addition. Indium addition also encouraged the formation of Sn-In and Bi-In IMC which increased as the amount of In increased. These IMCs could potentially act as blocking mechanism for deformation leading to higher strength.

On the two-dimensional prismatic platelet in the aged In-microalloyed Mg–Nd alloys

With an addition of trace indium (In) into Mg-Nd system, the microstructure and precipitates of aged Mg-In-Nd alloys are investigated by high-angle annular dark-field scanning transmission electron microscopy. We confirm that a category of prismatic platelet with a two-dimensional (2D) planar structure and a ternary composition is formed extensively in the microstructure. Although the 2D structure is coherent with α-Mg matrix, it is elongated along 112-0α and shortened along 0001α owing to the substitution of In and Nd for Mg, which is a result of the stress relaxation.

Electrochemical corrosion evaluation of new Zn-Sn-In coatings electrodeposited in a eutectic mixture containing choline chloride and ethylene glycol

Ternary Zn-Sn-In coatings were successfully electrodeposited for the first time on 1020 carbon steel substrates from a choline chloride and ethylene glycol base bath to improve the corrosion resistance of Zn-Sn alloys. The micrographs of the coatings revealed that increasing the concentration of indium (In) in the alloy reduced the grain size, and the electrodeposition performed at –1.3 V produced denser and more compact coatings rich in Zn. The diffractograms showed the deposition of metallic Zn, Sn, and In, as well as the presence of an In-Sn4 intermetallic phase. The electrochemical corrosion tests in 3.5% NaCl solution showed that the addition of indium in the Zn-Sn coatings increased the corrosion resistance of the protective layer, with the Zn64Sn23In13 coating, electrodeposited at –1.3 V, showing corrosion resistance superior to the other investigated coatings.