Hybrid Integration Research Articles

Efficient 0/1-Multiple-Knapsack Problem Solving by Hybrid DP Transformation and Robust Unbiased Filtering

The multiple knapsack problem (0/1-mKP) is a valuable NP-hard problem involved in many science-and-engineering applications. In current research, there exist two main approaches: 1. the exact algorithms for the optimal solutions (i.e., branch-and-bound, dynamic programming (DP), etc.) and 2. the approximate algorithms in polynomial time (i.e., Genetic algorithm, swarm optimization, etc.). In the past, the exact-DP could find the optimal solutions of the 0/1-KP (one knapsack, n objects) in O(nC). For large n and massive C, the unbiased filtering was incorporated with the exact-DP to solve the 0/1-KP in O(n + C′) with 95% optimal solutions. For the complex 0/1-mKP (m knapsacks) in this study, we propose a novel research track with hybrid integration of DP-transformation (DPT), exact-fit (best) knapsack order (m!-to-m2 reduction), and robust unbiased filtering. First, the efficient DPT algorithm is proposed to find the optimal solutions for each knapsack in O([n2,nC]). Next, all knapsacks are fulfilled by the exact-fit (best) knapsack order in O(m2[n2,nC]) over O(m![n2,nC]) while retaining at least 99% optimal solutions as m! orders. Finally, robust unbiased filtering is incorporated to solve the 0/1-mKP in O(m2n). In experiments, our efficient 0/1-mKP reduction confirmed 99% optimal solutions on random and benchmark datasets (n δ 10,000, m δ 100).

A multimode photodetector with polarization-dependent near-infrared responsivity using the tunable split-dual gates control

SummaryAs the limited carrier densities in atomic thin materials can be well controlled by electrostatic gates, p-n junctions based on two-dimensional materials in the coplanar split-gate configuration can work as photodetectors or light-emitting diodes. These coplanar gates can be fabricated in a simple one-step lithography process and are frequently used in hybrid integration with on-chip optical structures. However, the polarization-dependent responsivity of such a configuration is less explored in the near-infrared band, and a clear understanding is still missing. Here we fabricate near-infrared tunable multiple modes twisted bilayer graphene photodetector enabled by the coplanar split-gate control and confirm that the photothermoelectric effect governs the photovoltage mechanism of the p-n junction mode. Our study also elucidates that the discrepancy of the responsivities under different linear polarizations is owing to the different cavity modes and provides a valuable example for designing chip-integrated optoelectronic devices.

Energy management of Plug-In Hybrid Electric Vehicles in renewable-based energy hubs

Proliferation of Plug-in Hybrid Electric Vehicles (PHEVs) and integration of various distributed generation (DG) technologies have been recognized to play an undeniable role in modern power systems of the future. In order to effectively model the interactions of these two technologies, this paper develops a multi-criteria framework to coordinate the charging behaviors of PHEVs within an energy hub platform. In this regard, the desirable charging profiles from the viewpoint of both PHEV owners and hub manager are first captured and reported to the PHEVs Coordinator Entity (PCE). The PCE, then, runs an optimization framework in which several criteria including the PHEV owners’ convenience, energy hub’s profit, and the technical performance of the distribution grid are all taken into account as a multi-criteria optimization framework resulting in the PHEVs’ optimal charging patterns. The proposed strategy is applied to the modified IEEE 34-node test system and the results demonstrate the applicability and efficiency of the proposed framework.

Chance-constrained optimization of distributed power and heat storage in integrated energy networks

Energy storage is widely recognized as an effective alternative to match the instantaneous imbalance between distributed renewable energy sources and loads. However, suitable installation sites and capacities are necessarily determined in integrated energy networks. This paper constructs a two-layer optimization model of integrated power and heat networks to obtain the optimal installation nodes and capacities of electric energy storage (EES) and thermal energy storage (TES) units. In the optimization model, the interchange of power to heat with storage units is collaborated to unitize distributed renewable energy sources and decrease comprehensive costs, including investment cost of storage units and operation cost. A chance-constrained optimization model is proposed to transform the uncertain variables of electric and heat loads into a deterministic optimization problem. The impacts of confidence levels involved in load probability distributions on the optimal nodes and capacities are analyzed. The results demonstrate that the optimal installation nodes are determined by the distributions of distributed power sources and load ratios in networks. The increased confidence level globally raises the optimal installation capacities of EES and TES. When the confidence level increases from 0.50 to 0.99, the utilization rate of wind power increases by 3.91 %, whereas the comprehensive cost increases by 22.34 %. The hybrid integrations of EES and TES consume more uncertain renewable power and improve the economic performances by the interchange of power to heat.

Simulation of crumpled sheets via alternating quasistatic and dynamic representations

In this work, we present a method for simulating the large-scale deformation and crumpling of thin, elastoplastic sheets. Motivated by the physical behavior of thin sheets during crumpling, two different formulations of the governing equations of motion are used: (1) a quasistatic formulation that effectively describes smooth deformations, and (2) a fully dynamic formulation that captures large changes in the sheet's velocity. The former is a differential-algebraic system of equations integrated implicitly in time, while the latter is a set of ordinary differential equations (ODEs) integrated explicitly. We adopt a hybrid integration scheme to adaptively alternate between the quasistatic and dynamic representations as appropriate. We demonstrate the capacity of this method to effectively simulate a variety of crumpling phenomena. Finally, we show that statistical properties, notably the accumulation of creases under repeated loading, as well as the area distribution of facets, are consistent with experimental observations.

Stacking two superconducting nanowire single-photon detectors via membrane microchip transfer

Multilayer superconducting nanowire single-photon detectors (SNSPDs) have exhibited several advantages, such as increased detection efficiency, reduced polarization sensitivity, and scaling up to large arrays. However, monolithic fabrication of such multilayer devices is challenging. In this work, a hybrid integration method has been introduced by etching SNSPDs into the membrane microchips, followed by the pick and place transferring process. This method has been verified by stacking two SNSPDs orthogonally. Both detectors show near saturated detection efficiencies and low timing jitters. Furthermore, thermal coupling effects have been observed between the two SNSPDs. The photon detection pulses from either detector can trigger the other one almost deterministically with a latency of several nanoseconds. This method offers a flexible way to fabricate multilayer SNSPDs or integrate them with other heterogeneous devices.

A hybrid computing framework for risk‐oriented reliability analysis in dynamic PSA context: A case study

AbstractNowadays, the emerging digital technologies and digitalization trend in safety‐critical industrial process systems are bringing great opportunities for system performance improvements. However, new big challenges are also encountered in the reliability and safety evaluation of large complex industrial process systems due to its multi‐state, multi‐phase dynamic interactions, resilience on software and inter‐dependencies among digital components. The objectives of this study are i) to present an introductory overview of a hybrid computing framework as a supplementary to conventional fault tree analysis toolkit for risk‐oriented reliability analysis in dynamic probabilistic safety assessment context; ii) to illustrate how to combine the three methods of DDET, Markov/CCMT, and GO‐FLOW for integrated risk solutions by a case study of small‐break LOCA in nuclear power plants. Within the hybrid computing framework, the DDET model is implemented based on graph‐based search and sequence diagram refactoring by linking with Markov/CCMT and GO‐FLOW solver for branch probability estimation. The dynamic event tree model is adopted to represent the accident sequence of small‐break LOCA, where the heading events of system failure of digital RPS and phased‐mission ECCS in realization of safety‐critical functions of reactivity control and emergency core cooling are respectively modeled and analyzed by Markov chain and GO‐FLOW method. The demonstration results show that the failure analysis of complex dynamic process interactions together with time‐dependent mission reliability analysis of safety systems involved in accident prevention and mitigation can be easily implemented with accurate modeling and fast evaluation within the hybrid integration platform. The core algorithms and principles implemented for dynamic risk scenarios development by DDET, modeling, and analysis of dynamic process interactions by Markov/CCMT, time‐dependent and multi‐phase mission reliability analysis by GO‐FLOW as well as their integration to provide comprehensive solutions for the application of dynamic reliability in risk assessment are also discussed as open problems for future research.

Methods and applications of on-chip beam splitting: A review

The construction of large-scale integrated photonic circuit cannot be separated from the important role played by silicon-based optoelectronic devices. As a basic and important link in on-chip photon propagation, beam splitting is of great significance for the efficient utilization of sources and the compact integration of optoelectronic devices. It is widely used in power splitting, polarization separation, wavelength division multiplexing and other scenarios. This paper reviews the on-chip beam splitting methods in recent years, which are mainly divided into the following categories: y-branch, multimode interference coupling, directional coupling, and inverse design. This paper introduces their research status, including optimization design methods, functions and applications in large-scale quantum chips and optoelectronic hybrid integration, looking forward to providing a reference for the further research of beam splitting methods and the wide application of beam splitters in the frontier field in the future.

Solar Energy-Powered Battery Electric Vehicle charging stations: Current development and future prospect review

Solar energy offers the potential to support the battery electric vehicles (BEV) charging station, which promotes sustainability and low carbon emission. In view of the emerging needs of solar energy-powered BEV charging stations, this review intends to provide a critical technological viewpoint and perspective on the research gaps, current and future development of solar energy-powered BEV charging stations to fill the gap of the absence of review articles. The current technical limitations of solar energy-powered industrial BEV charging stations include the intermittency of solar energy with the needs of energy storage and the issues of carbon emission and maintenance of solar arrays. This review article also provides a detailed overview of recent implementations on solar energy-powered BEV charging stations, pointing out technological gaps and future prospects to serve as a guideline for academia and industry. The main observations from this review include the hybrid integration of other renewable energy such as wind or biogas can be a feasible solution to mitigate the intermittency of solar energy, battery swapping to mitigate the slow charging speed, utilising virtual inertia device to regulate frequency fluctuation that mitigate electricity blackout due to high penetration of solar or other renewable sources in power grid, and avoiding charging in the periods when the grid electricity has a high content of carbon emissions. The decentralised operations of energy management should be promoted to allow secured energy transactions and optimise charging/discharging operations. The optimal choosing criteria for the solar-enabled BEV are also provided as guidelines for industry or academia.

Coordinated Control of Hybrid DERs Enabled Grid-Interactive Residential PCM With Hybrid Bus Layout

This article proposes a multi-terminal grid interactive power conditioning module (PCM) for integration of hybrid distributed energy resources (DERs) within single phase residential premises, along with the Energy Storage Stacks (ESSs). The PCM also features hybrid bus layouts with medium-low voltage dc (MVdc) and low voltage dc (LVdc), for dc load integrations, and ac bus layout for single phase ac loads. The bi-directional MVdc and LVdc bus facilitate the effective power management and bus voltage support. It operates in all grid feeding, forming and supportive modes. The ESSs includes battery for system energy management and the supercapacitor for dc bus stabilization during transient conditions. The coordinated control of the PCM is capable of interfacing multiple DERs, dc/ac loads, and ESS. The controllers in the PCM are self-adaptive to the frequent islanding situations and ensure the system stability with minimum use of sensory feedbacks. The PCM has loop type dc bus feeder to make residential system operative during transient/faulty conditions. Simulation results verify the feasibility of the proposed system in all active and passive grid feeding; and grid forming modes and experimental setup is used to test the performance of the proposed PCM control through a single microcontroller.

Time-Interleaved Switched Emitter Followers to Extend Front-End Sampling Rates to up to 200 GS/s

Optical transceivers with more than 50 GBd are now being deployed, while the use of more than 100 GBd is currently under investigation. CMOS components, such as the analog-to-digital converter (ADC) in the receiver path, can be highly parallelized for higher sampling rates but are difficult to scale toward higher analog bandwidths. Thus, the hybrid integration of front-end circuits with the function of a bandwidth gearbox in other semiconductor technologies is an interesting research topic. In this article, we show an example of a time-interleaved analog demultiplexer (ADeMUX) with four track-and-hold (T/H) circuits based on switched emitter followers (SEFs) in a 90-nm silicon-germanium (SiGe)-Bipolar-CMOS (BiCMOS) technology for parallel operation of four CMOS ADCs. The 50% duty cycle of the clock signal facilitates its generation and can save power consumption in the clock path or enable higher sampling rates compared with the 25% duty-cycle clock of other ADeMUX architectures. We show that using switched preamplifiers in front of the SEFs can double the bandwidth of each T/H lane. Experimental verification shows up to 57-GHz input bandwidth while requiring only 16-GHz input bandwidth for each of the ADCs that can be connected to the four 32-GS/s output channels. The circuit achieves 3–6-bit accuracy and is suitable for 100-GBd signaling and beyond with pulse amplitude modulation. To demonstrate the capability of higher sampling rates, measurement results at 4 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\times $ </tex-math></inline-formula> 50 GS/s = 200 GS/s are provided as well although significant advancement of the measurement environment is needed for a complete evaluation.

Searching guidelines for scalable and controllable design of multifunctional materials and hybrid interfaces: Status and perspective

The urgent need to address the global sustainability issues that modern society is currently facing requires the development of micro and nanotechnologies, which rely largely on functional materials. Beyond studies focused solely on low-dimensional materials, broader research related to multifunctionality has shown that the major efforts to meet these criteria for new electronic, photonic, and optoelectronic concepts, particularly to achieve high-performance devices, are still challenging. By exploiting their unique properties, a comprehensive understanding of the implications of research for the synthesis and discovery of novel materials is obtained. The present article encompasses innovation research as an alternative optimization and design for sustainable energy development, bridging the scaling gap in atomically controlled growth in terms of surface heterogeneity and interfacial engineering. In addition, the corresponding research topics are widely regarded as a scientometric analysis and visualization for the evaluation of scientific contributions into the early 20 years of the 21st century. In this perspective, a brief overview of the global trends and current challenges toward high-throughput fabrication followed by a scenario-based future for hybrid integration and emerging structural standards of scalable control design and growth profiles are emphasized. Finally, these opportunities are unprecedented to overcome current limitations, creating numerous combinations and triggering new functionalities and unparalleled properties for disruptive innovations of Frontier technologies.

Gallium phosphide-on-insulator integrated photonic structures fabricated using micro-transfer printing

Gallium phosphide-on-insulator emerged recently as a promising platform for integrated nonlinear photonics due to its intrinsic material properties. However, current integration solutions, using direct die-to-wafer bonding, do not support spatially localized integration with CMOS circuits which induce a large and expensive footprint material need. Here we demonstrate the transfer of gallium phosphide layers to an oxidized silicon wafer using micro-transfer printing as a new approach for versatile future (hybrid) integration. Using this novel approach, we demonstrate as a proof of concept the fabrication of gallium phosphide-on-insulator ring resonators with Q-factors as high as 35,000.

Cost-based site and capacity optimization of multi-energy storage system in the regional integrated energy networks

The unbalance between the renewable energy sources and user loads reduces the performance improvement of regional integrated energy systems (RIES), in which the multi-energy storage system with battery and heat tank is necessarily integrated. This paper aims to optimize the sites and capacities of multi-energy storage systems in the RIES. A RIES model including renewable wind power, power distribution network, district heating network, multi-energy storage system, and heat pump to convert electricity to heat is constructed. An optimization method combining a mixed-integer nonlinear programming optimization model is proposed to minimize the comprehensive cost of RIES. The second-order cone relaxation method performs convex relaxation of the power flow constraints, and the district heat network is operated under a constant-flow-variable-temperature strategy. The original optimization model is transformed into a mixed-integer second-order cone programming problem to solve. Three solution methods, including enumeration method, improved enumeration method and genetic algorithm, are employed to determine the optimum installation locations, and they are compared in computation time and efficiency. The results demonstrate that the distributed hybrid integration of electricity and thermal energy storages improves the RIES economy by collaborating the power and heat balances and reducing the purchased electricity from the grid. By integrating the hybrid storage system, the curtailed wind is reduced by 53.9%, and the economy is improved by 13.4%.

High-adhesion PDMS/Ag conductive composites for flexible hybrid integration

The integration of silicon chips and other rigid components on soft polymeric substrate represents a viable option towards mass production of high-performance stretchable electronics, where bonding materials with high stretchability, high conductivity, and high adhesion strength become the key in the process. Polydimethylsiloxane/silver composites (PDMS/Ag) are promising candidates, but the adhesion of PDMS-based composites is usually too weak to be useful. Herein, we report a “netting and anchoring” strategy, in which a small amount of polyborosiloxane (PBS) prepolymer is added and the formed PBS networks not only net the PDMS networks with dense physical entanglements but also anchor PDMS networks to adherent surfaces with reversible bonds. The obtained composites have an adhesion strength of 2.87 MPa (8.2 times and 3.2 times higher than that of the untreated and conventional silane-treated composites) and maintain a high conductivity of 1.3 × 10−4 Ω·cm. The enhanced bonding originates from three aspects: good wettability, uniform interfacial bonding, and stress transfer from the interface to the bulk to elicit bulk energy dissipation. As an example, a stretchable temperature sensor system integrated with this strategy can resist up to 70% stretching, bending, and twisting.

Gate-free tunable 2D/2D heterojunction composed of MoTe2 and 2D electron gas at the surface of KTaO3

The hybrid integration of oxide two-dimensional electron gases (2DEGs) and 2D layered transition-metal dichalcogenides is expected to exhibit diverse physical phenomena, which cannot appear in either material alone. Here, we demonstrate a gate-free tunable 2D/2D heterojunction composed of MoTe2 and 2DEG at the surface of KTaO3. The combination of metallic MoTe2 and n-type 2DEG together forms a Schottky diode with a large on/off current ratio of 104 at room temperature. Moreover, the MoTe2/2DEG diode exhibits largely tunable electrical transport characteristics without gate voltages. By applying bias voltages, the diode shows tunable transport properties ranging from insulating to excellent rectifying behaviors. The bias-voltage-dependent modulation dominantly originates from the tunable Schottky barrier width controlled by the carrier density of the 2DEG. Our results pave a way for the development of 2D nanoelectronic devices such as multi-bit memories and bias sensors.

Dual Coding Concatenation for Burst-Error Correction in Probabilistic Amplitude Shaping

We propose the use of dual coding concatenation for mitigation of post-shaping burst errors in probabilistic amplitude shaping (PAS) architectures. The proposed dual coding concatenation for PAS is a hybrid integration of conventional reverse concatenation and forward concatenation, i.e., post-shaping forward error correction (FEC) layer and pre-shaping FEC layer, respectively. A low-complexity architecture based on parallel Bose–Chaudhuri–Hocquenghem (BCH) codes is introduced for the pre-shaping FEC layer. Proposed dual coding concatenation can relax bit error rate (BER) requirement after post-shaping soft-decision (SD) FEC codes by an order of magnitude, resulting in a gain of up to 0.25 dB depending on the complexity of post-shaping FEC. Also, combined shaping and coding performance was analyzed based on sphere shaping and the impact of shaping length on coding performance was demonstrated.

Fully On‐Chip Microwave Photonic Instantaneous Frequency Measurement System

AbstractMicrowave photonics (MWP) is an emerging field that studies the interaction between microwave and lightwave for myriad communication and information applications. Recently, new opportunity for MWP has emerged driven by the advances of integrated photonics. However, despite significant progress made in terms of integration level, a fully on‐chip MWP functional system comprising all the necessary photonic and electronic components, is yet to be demonstrated. Here, the status quo is broken and a complete on‐chip solution for MWP system is provided, by exploiting hybrid integration of indium phosphide, silicon photonics, and complementary metal‐oxide–semiconductor electronics platforms. Applying this hybrid integration methodology, a fully chip‐based MWP instantaneous frequency measurement (IFM) system is demonstrated. The unprecedented integration level brings great promotion to the compactness, reliability and performances of the MWP IFM system, including a wide frequency measurement range (2–34 GHz), ultralow estimation errors (10.85 MHz), and a fast response speed (≈0.3 ns). Furthermore, the chip‐scale MWP IFM system is deployed into realistic tasks, where diverse microwave signals with rapid‐varying frequencies at X‐band (8–12 GHz) are accurately identified in real‐time. This demonstration marks a milestone for the integrated MWP, by providing the technology basis for the miniaturization and massive implementations of various MWP systems.

Mechanical characterization of solder interconnections on functionalized, copper-containing polymer thick-film pastes for hybrid integration

In this work, on different substrate materials thermally cured polymer thick-film (PTF) pastes are connected to surface mount technology resistors using a SnBiAg solder alloy. The effect of substrate pre-treatment with atmospheric plasma and thermal cycling on the shear strength of these interconnections is investigated, and the shear forces obtained are graded using United States Defense Standard / Military Standard (MIL-STD) 883. In particular, the build-up of solder interconnections on conductive structures made of commercially available copper-containing PTF pastes and their mechanical characterization is novel. As well as the mechanical characterization of conductive structures, made of PTF pastes, on plasma-treated substrates and their grading using the MIL-STD 883. In addition, interconnections with silver-containing conductive structures are realized for comparison. Depending on the interconnection system, component mean shear forces of up to 31 N are achieved. While some systems meet the 1.25× criterion of MIL-STD 883, the majority of the systems investigated do not meet the 1.00× criterion. Hereby, the adhesion between the conductive structure and the substrate usually fails. Plasma pre-treatment shows an adhesion-increasing effect only for a proportion of substrate materials used, as does thermal aging. But thermal loads can also impair the adhesive strength.

High-Performance Non-Enzymatic Electrochemical Dopamine Sensors Based on Metal-Organic Framework Derived Co-C-Matrix Nanoplatforms

A facile electrochemical sensing nanoplatform for detection of ultralow dopamine (DA) concentrations is developed through modification of cobalt-benzene tricarboxylic acid (Co-BTC) derived cobalt-carbon-matrix (Co-C-matrix). To enhance surface reactions and enzyme-like activities involved in interaction with DA, the structural integration of hybrid Co-C-matrix into Co-BTC as metal-organic framework (MOF) is investigated, resulting in nanostructured transducing media with high sensitivity and selectivity as catalyst. The Co-C-matrix nanoplatform exhibited the improved performance based on electrocatalytic oxidation of DA with high sensitivity of 7176 μA mM−1 cm−2 and low detection limit of 10 nM. Furthermore, the linearity of an amperometry peak toward DA concentration over wide concentration range from 10 nM to 25 μM was observed under optimal conditions. Excellent selectivity in the presence of potential interferents and operational stability in ambient air for 30 days as well as under environmental conditions for the electrochemical oxidation of dopamine were achieved. The practical feasibility of these non-enzymatic biosensors is demonstrated on real samples, where DA is detected in human serum with outstanding recovery of up to 100%. The synergetic effect of Co atoms dispersed in the matrix of the carbon nanohybrid results in abundant active sites for DA oxidation and electron transfer pathways.