Evaluation Of Subsurface Damage Research Articles

Theoretical model and digital extraction of subsurface damage in ground fused silica.

Based on the fracture mechanics and grinding kinematics, a theoretical model is developed to determine various subsurface damage (SSD) parameters and roughness Rz of the ground brittle material with consideration of the material removal mode and spring back. Based on the image processing, a digital method is proposed to extract various SSD parameters from the cross-section micrograph of the ground sample. To verify the model and method, many fused silica samples are ground under different processing parameters, and their SSD depth and roughness Rz are measured. The research results show the average SSD depth (SSDa) can be expressed as SSDa = χ1Rz4/3 + χ2Rz (χ1 and χ2 are coefficients). The SSDa is closer to half of the maximum SSD depth (SSDm) as the wheel speed decreases or the grinding depth, feed speed, or abrasive diameter increases. The SSD length or density basically increases linearly with the increase of the SSDm. The digital method is reliable with a largest relative error of 6.65% in SSD depth, extraction speed of about 1.63s per micrograph, and good robustness to the micrograph size and small-scale residue interference. The research will contribute to the evaluation of SSDs and the optimization of the grinding process of fused silica.

Subsurface damage evaluation in the single abrasive scratching of BK7 glass by considering coupling effect of strain rate and temperature

BK7 glass has been extensively used in astronomical observation systems, laser fusion devices and precision optical measuring instruments. In order to improve the surface integrity during the high-speed grinding of BK7 glass, the underlying science in the single abrasive scratching of BK7 glass has been theoretically and experimentally explored. It is found that in the abrasive-workpiece contact zone the coupling effect of the strain rate and temperature plays an important role in affecting the material properties, the radius of the plastic deformation zone, the distribution of the elastic stress and the length of the median which in turn affect the subsurface damage in the single abrasive scratching process. The model for predicting the depth of subsurface damage by considering the coupling effect of the strain rate and temperature in the single abrasive scratching of BK7 glass has been theoretically developed and experimentally validated. It is also noted from experimental analysis that with an increase of the strain rate and temperature caused by the high scratching speed at the same cutting depth the radius of plastic deformation zone decreases, and the initiation and propagation of the median crack, lateral crack and radial crack are suppressed, which facilitate for shortening the crack length, reducing the brittle fracture, improving the surface integrity and decreasing the subsurface damage.

Three-dimensional evaluation of subsurface damage in optical glasses with ground and polished surfaces using FF-OCT

Subsurface damage (SSD) induced during conventional manufacturing of optics contributes mainly to a reduction in the performance and quality of optics. In this paper, we propose the application of full-field optical coherence tomography (FF-OCT) as a high-resolution and nondestructive method for evaluation of SSD in optical substrates. Both ground and polished surfaces can be successfully imaged, providing a path to control SSD throughout the entire optics manufacturing process chain. Full tomograms are acquired for qualitative and quantitative analyses of both surface and SSD. The main requirements for the detection of SSD are addressed. Data processing allows the removal of low-intensity image errors and the automatic evaluation of SSD depths. OCT scans are carried out on destructively referenced glass samples and compared to existing predictive models, validating the obtained results. Finally, intensity projection methods and depth maps are applied to characterize crack morphologies. The experiments highlight differences in crack characteristics between optical glasses SF6 and HPFS7980 and illustrate that wet etching can enhance three-dimensional imaging of SSD with FF-OCT.

Research of Subsurface Damage Depth of Lithium Niobate Crystal by Fixed-Abrasive Lapping

The subsurface damage depth of optical material introduced by lapping determines the efficiency of lapping and polishing process. In order to explore the subsurface damage (SSD) of fixed-abrasive lapping process, angle polishing method was employed to evaluate the SSD depth and damage form of soft-brittle material lithium niobate (LN) crystal. The influences of the grit size, the applied load and the hardness of pad matrix on SSD were investigated experimentally. The results show that: with the grit size decreasing form W28 to W14, the damage depth decreases by 70%. With the applied load decreasing form 15 kPa to 7 kPa, the SSD decreases by 40%. The dense and deep subsurface micro-cracks are caused by the hard matrix pad during lapping processing, while the matrix with low hardness causes plastic scratches on the surface/subsurface of the workpiece without obvious micro-cracks around the scratches. This study affords effective method for SSD evaluation and control of soft brittle materials such as LN crystal.

Quantitative Evaluation of Subsurface Damage by Improved Total Internal Reflection Microscopy

Subsurface damage (SSD), having a great impact on the laser-induced damage threshold (LIDT) of ultra-smooth optics applied in high-power laser systems, should be tightly controlled. An improved total internal reflection microscopy (TIRM), combined with digital image processing techniques, is proposed to quantitatively inspect SSD. With the characteristic that there is a relatively small depth of field (DOF) for a microscope at high magnification (50×), a series of SSD images are captured along with the microscope focusing at different depths under the surface by means of micro-focusing control. The definition of each image is calculated through wavelet transformation. By simulation, the relationship between the definition of TIRM images and the depth of the SSD has been established. According to the definition curve, the SSD depth is acquired. Fused silica glasses polished after fine grinding are measured non-destructively by our TIRM setup. The results show that the improved TIRM is a useful method to evaluate SSD. It is helpful to improve the efficiency of optical fabrication.

Cup wheel grinding-induced subsurface damage in optical glass BK7: An experimental, theoretical and numerical investigation

Subsurface damage (SSD) is a predominant type of damage in grinding process of optical materials with direct effect on the optical components performances. A series of cup wheel grinding trials were carried out on optical glass BK7 under different grinding parameters to evaluate their impacts on SSD and surface roughness. The SSD depths of ground specimens were measured by the wedge chemo-mechanical polishing (W-CMP) method. The modified model of Lambropoulos, proposed by Li, was applied considering the ductile regime effect. Besides, a three-dimensional model was established based on the coupled finite element method (FEM) and smoothed particle hydrodynamics (SPH) to simulate the grinding-induced SSD in optical glass BK7. The experimental results were compared with the theoretical model and simulations which showed a good agreement. Therefore, both the theoretical and simulation models could be used for fast and nondestructive evaluation of SSD. Also, a novel method was applied to calculate the crack length of a SEM micrograph through image processing technique.

Residual strain analysis with digital image correlation method for subsurface damage evaluation of hinoki (Chamaecyparis obtusa) finished by slow-speed orthogonal cutting

A digital image correlation (DIC) method was applied to measure strain which arose and remained beneath the finished surface in slow-speed orthogonal cutting of hinoki (Chamaecyparis obtusa), to evaluate the damage in the subsurface cell layers. While the quarter-sawn surface was cut parallel to the grain, the side surface, flat-sawn surface, was captured by a high-speed camera. The images were analyzed to calculate strain in a region of 0.67 × 0.22 mm allocated beneath the finished surface. Almost no strain normal to the cutting direction was detected for the depth of cut and cutting angles, 0.05 mm and smaller than 60°, respectively. For the depths of cut and cutting angles, larger than 0.1 mm and smaller than 60°, respectively, the fore-split induced tensile strain normal to the cutting direction, although it hardly remained after the cutting. The compression strain normal to the cutting direction clearly remained for the cutting angles larger than 70°, regardless of the depths of cut employed in this study. The subsurface damage assumed from the residual strain distribution corresponded to the appearance of the subsurface layer in the X-ray computed tomography (CT) images. It was also revealed, and the DIC program could not always measure excessively large strain correctly.

シリコンウェハ変形による加工変質層残留応力の評価

シリコンウェハ変形による加工変質層残留応力の評価

The Assessment of Subsurface Damage in Ground Optics by Chemical Etching

Optical subsurface damage (SSD), generated from traditional grinding and polishing process, is prone to lower the laser-induced damage threshold (LIDT) of optical elements. Due to the fact that SSD elimination is on the premise of SSD evaluation, numerous SSD characterizing techniques have been proposed in the past few decades. In this paper, various SSD evaluations based on chemical etching technique are described and compared.

Evaluation of Subsurface Damage in Concrete Deck Joints Using Impact Echo Method

Many factors can affect the overall performance and longevity of highway bridges, including the integrity of their deck joints. This study focuses on the evaluation of subsurface damage in deteriorated concrete deck joints, which includes the delamination and corrosion of the reinforcement. Impact echo and surface wave technology, mainly a portable seismic property analyzer (PSPA), were employed to evaluate the structural deficiency of concrete joints. Laboratory tests of core samples were conducted to verify the nondestructive test results. The primary advantage of the PSPA as a bridge assessment tool lies in its ability to assess the concrete’s modulus and to detect subsurface defects at a particular point simultaneously.

Wet-Etching Evaluation Method of Subsurface Damage after Grinding of Glass

Large-aperture lens used for single-lens reflex cameras is generally produced by both ultra-precision grinding and polishing because a mass-produced lens by molding process can hardly achieve the required form accuracy and surface quality. Recently, grinding process of an optical glass should make surface quality as high as possible in order to reduce removal amount in polishing process. Accordingly, evaluation of subsurface damage induced under various grinding conditions has been required because subsurface damage leads to crack initiation or deterioration of the performance. However, evaluation method of subsurface damage on the spherical glass lens after grinding has not yet been established.In this study, the quantitative evaluation method by applying wet-etching of hydrofluoric acid (HF) is proposed, then its validity is verified. From the experimental results, we clarify to evaluate the subsurface damage by examining the surface transition according to etching time.

Wet-Etching Evaluation Method of Subsurface Damage after Grinding of Glass

Large-aperture lens used for single-lens reflex cameras is generally produced by both ultra-precision grinding and polishing because a mass-produced lens by molding process can hardly achieve the required form accuracy and surface quality. Recently, grinding process of an optical glass should make surface quality as high as possible in order to reduce removal amount in polishing process. Accordingly, evaluation of subsurface damage induced under various grinding conditions has been required because subsurface damage leads to crack initiation or deterioration of the performance. However, evaluation method of subsurface damage on the spherical glass lens after grinding has not yet been established.In this study, the quantitative evaluation method by applying wet-etching of hydrofluoric acid (HF) is proposed, then its validity is verified. From the experimental results, we clarify to evaluate the subsurface damage by examining the surface transition according to etching time.

Evaluation of subsurface damage caused by ultra-precision turning in fabrication of CaF2 optical micro resonator

The optical micro-resonator, which stores light at a certain spot, is essential in next-generation optical signal processing. Single-crystal calcium fluoride (CaF2) is the most suitable material for this element. Ultra-precision turning is a feasible fabrication process for CaF2 optical micro-resonators. In this study, the influence of subsurface damage on the resonator's Q factor is investigated. TEM observation shows that the subsurface layer of up to several tens of nanometers thickness changed from single-crystal to polycrystalline morphology due to ultra-precision turning. A diamond tool with 0° rake angle results in lower damage than one with negative rake angle, which enhances the resonator's performance.

Evaluation of subsurface damage in GaN substrate induced by mechanical polishing with diamond abrasives

The relationship between the depth of the subsurface damage (SSD) and the size of the diamond abrasive used for mechanical polishing (MP) of GaN substrates was investigated in detail. GaN is categorized as a hard, brittle material, and material removal in MP proceeds principally to the fracture of GaN crystals. Atomic force microscopy and cathodoluminescence imaging revealed that the mechanical processing generated surface scratches and SSD. The SSD depth reduced as the diamond abrasive size reduced. A comparison of the relationship between the SSD depth and the diamond abrasive size used in the MP of GaN with the same relationship for typical brittle materials such as glass substrates suggests that the MP of GaN substrates proceeds via the same mechanism as glass.

Evaluation of subsurface damage by light scattering techniques

Subsurface damage (SSD) in optical components is almost unavoidably caused by mechanical forces involved during grinding and polishing and can be a limiting factor, in particular for applications that require high laser powers or an extreme material strength. In this paper, we report on the characterization of SSD in ground and polished optical surfaces, using different light scattering measurement techniques in the visible and extreme ultraviolet spectral ranges. The materials investigated include fused silica, borosilicate glass, and calcium fluoride. The scattering results are directly linked to classical destructive SSD characterization techniques, based on white light interferometry, optical microscopy, and atomic force microscopy of the substrate topography and cross sections obtained after etching in hydrofluoric acid and fracturing.

Evaluation of Subsurface Damage and Residual Stress of Glass Ceramic Under Grinding Process

Evaluation of Subsurface Damage and Residual Stress of Glass Ceramic Under Grinding Process

Evaluating subsurface damage in optical glasses

Hard brittle materials (e.g. glasses and ceramics) increasingly appeal to general interests because of their excellent physical, mechanical and chemical properties such as super hardness and strength at extreme temperature and chemical stability. The precision manufacturing of these materials is primarily achieved by grinding and polishing, which generally employs abrasives to wear the materials. With this manufacturing technology, the materials are removed due principally to the fracture of brittle materials, which will leave a cracked layer on the surface of manufactured components, namely subsurface damage (SSD). The subsurface damage affects the strength, performance and lifetime of components. As a result, investigation into the subsurface damage is needed. A host of characterizing techniques have been developed during the past several decades. These techniques based on different mechanisms provide researchers with invaluable information on the subsurface damage in various materials. In this article the typical SSD evaluation techniques are reviewed, which are regularly used in optical workshops or laboratories.

“SSD scattering signal extraction in LSCT”

Sub-Surface Damage (SSD) in optical element had became a shackle of research and manufacture in energy, advanced technology and so on, for its severe influence to the laser-induced damage threshold, the long term stability of large optical system. So the evaluation of SSD was a hot topic in optical engineering. The scattering caused by optical component SSD links the optical non-destructive evaluation and SSD itself. Laser scanning confocal technology (LSCT) is an effective way for SSD assessment and it is also based on the back scattering of SSD. The scattering signal extraction is the key point in SSD measurement using LSCT. The difficulty of SSD signal extraction is introduced firstly. The signal composition accepted by LSCT detector is analysed in detail. The different component part is successively and independently analysed, and the elimination or reduction way of each part is given. Lastly, the high SNR SSD scattering signal of one element tested by LSCT equipment is displayed in 2D figure.

Cathodoluminescence evaluation of subsurface damage in GaN substrate after polishing

AbstractThe surface of HVPE grown GaN substrates were treated with two different polishing procedures. Both procedures were successful in producing highly smooth and featureless surfaces. However, subsurface damage was observed in the sample treated by one of the procedures. The subsurface damage was revealed by cathodoluminescence (CL) spectroscopy imaging but was not visible by scanning electron microscopy (SEM) or Atomic force microscopy (AFM). Thermal annealing at 950 °C with different gases was performed in an attempt to remove subsurface damages. Annealing in gas mixtures containing H2 increased both the presence of surface scratches and overall surface roughness. On the other hand, annealing in mixtures of NH3 and N2 (with no H2) led to the surfaces with significantly reduced subsurface damage. The surface roughness and optical properties of the sample after the annealing with such gas mixtures were slightly sacrificed. In order to evaluate subsurface damage depth, CL images were taken from the annealed surface for different acceleration voltages. The results suggest that the observed subsurface damages were within 1.48 μm of the surface. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

Subsurface damage induced in dental resurfacing of a feldspar porcelain with coarse diamond burs

The primary cause for early failure of ceramic restorations is surface and subsurface damage induced in adjustment and resurfacing using dental handpieces/burs. This paper reports finite element analysis (FEA) modelling of dental resurfacing to predict the degrees of subsurface damage, in combination with experimental measurement using scanning electron microscopy (SEM). The FEA predictions of subsurface damage induced in a feldspar porcelain with coarse diamond burs were in agreement with the SEM experimental measurement. These findings provide dental clinicians a quantitative description of the response of dental resurfacing-induced subsurface damage. The implication of the results for non-destructive evaluation of subsurface damage by FEA modelling will be practically meaningful to clinical dental restorations for high-quality ceramic restorations.