Thermal Contact Resistance Research Articles

Measurement of thermal contact resistance and the design of thermal contacts at cryogenic temperatures

The prevalence of technologies that operate at cryogenic temperatures requires that the cooling systems used to maintain these systems be carefully designed. This research focuses on understanding the thermal performance of the heat path between the heat source (the technology being cooled) and the cooling source (the cryocooler). Specifically, this work characterizes through measurement the thermal properties of common heat path materials, with a focus on bulk thermal conductivity and thermal contact resistance of pressed contacts. A framework for using these measurements to optimize a bolted contact is proposed and demonstrated.

Printed Lateral p–n Junction for Thermoelectric Generation

Printed thermoelectric generators (TEGs) show promising potential for converting waste heat into useful electricity at a low cost but fall short of exhibiting a conversion efficiency anticipated from materials’ properties. The output power of conventionally printed TEGs in the “π‐type” geometry suffers due to low thermal voltage and low current because of high thermal and electrical contact resistance, respectively. Herein, a type of printed p–n junction TEGs (PN‐TEGs) as a possible remedy is explored. Two printed PN‐TEGs with different thicknesses are fabricated using printed p‐type Bi0.5Sb1.5Te3 and n‐type Bi2Te2.7Se0.3 materials. The PN‐TEGs show a promising way to minimize the influence of thermal and electrical resistance in printed TEGs. In the experimental and simulation results, the significant impact of PN‐TEGs’ dimensions on their power outputs is revealed. Also, a conventional “π‐type” printed TEG is fabricated and its performance is studied. The optimized PN‐TEG with a single thermocouple yields ≈14 times higher power output density of 5.3 μW cm−2 at a ΔT of 25 K compared to “π‐type” printed TEGs.

“Stick–slip” fluctuations in local electrical conductivity maps on graphite surfaces: A revisit

Electrical conductivity images of graphite surfaces are routinely obtained using scanning probe microscopy. Although the acquired conductivity maps often display a trigonal pattern with smooth variations, a “stick–slip” type of fluctuation has also been reported, where the local conductivity inversely correlates with the friction force during probe scanning. In this work, we revisit the lattice-resolved variations in local conductivity on graphite surfaces and reveal a new series of behaviors. Unlike previous observations, we demonstrate that local conductivity can exhibit in-phase, out-of-phase, or mixed-mode correlations with “stick–slip” lateral force signals. These behaviors are attributed to the cross-talk effect between interface contact conductivity and lateral force, induced by the inhomogeneous conductivity of the tip apex. This mechanism is experimentally validated, showing that local conductivity variations can switch within a single scan due to spontaneous changes in the conductivity of the tip. Our findings enhance the understanding of lattice-resolved electrical conductivity data on graphite surfaces and suggest a novel approach to amplify small lateral forces using inhomogeneous probe tips.

Development of self-sensing cement composites by incorporating hybrid biochar and nano carbon black

The self-sensing cement composites (SSCC) containing traditional conductive carbon materials are of great significance but cause serious pollution. In this study, the green SSCC is innovatively developed utilizing the synergistic effects of nano carbon black and biochar from coconut shell. The SSCC mixtures are compared in terms of fluidity, mechanical properties, resistivity, microstructure and comprehensive properties. The results indicate that in SSCC containing nano carbon black, the addition of biochar can obtain comparable compressive strength for its internal curing, interlocking and bridging effects. Besides, 4.5 % carbon material prolongs the crack initiation stage during compression, and 9 % carbon material causes the multiple cracks. Moreover, the addition of 4.5 % biochar can reduce the 35-day resistivity of sample with 1.5 % biochar and 3 % nano carbon black by 35.6 % owing to the increasing tunneling effect and contact conduction. It is also found that in conductive SSCC, the slope Kc of the non-contact resistivity curve is dominated by the conductive additives rather than cement hydration. And the self-sensing cement composites exhibit excellent piezoresistivity. The rates of change in resistivity of samples after cycle loading are exponentially related to residual damages, with R2 values greater than 0.95. Finally, multi-indicator evaluation analyses show that the sample containing more biochar is more environmentally friendly. This study provides a new pathway for the sustainable development of SSCC.

Printable thermal interface materials with excellent heat dissipation capability

The rapid progression of electronic devices underscores the need for thermal interface materials (TIMs) with superior heat dissipation capabilities to address the overheating issues of high-power density electronic devices. However, the importance of excellent printability in practical automated production for TIMs has often been overlooked. This study introduces poly(2-[[(butylamino)carbonyl]oxy]ethyl acrylate)/liquid metal (Poly (BCOE)/LM) composites, which exhibit excellent printability and heat dissipation properties. The resulting materials, containing 80 wt% LM, display a low total thermal resistance of 0.69 cm2 kW−1, a low contact thermal resistance of 0.25 cm2 kW−1, a high thermal conductivity of 3.49 W m−1K−1, and effective printing capabilities through material jetting 3D printing onto chip surfaces. In thermal management applications, the composite material prepared in this work was able to reduce the temperature of the chip by a further 17 °C compared to a commercial product (Laird TFlex 300), thus highlighting its practical utility in automated production processes. This novel TIM offers a viable solution for addressing the thermal management needs of modern electronic devices.

A Mechanism of Resistance Switching in CNT Based Memory Devices

Carbon nanotubes (CNTs) show promise for high energy efficiency electronic devices due to their high electrical conductivity. One possible application is in the fabrication of resistance-change computer memory, where the application of an external electrical bias can use a CNT layer as the switching element in a RAM cell. Memory cells of this type have been extensively demonstrated, where the electrical resistance of a switching layer of CNTs can be reversibly controlled by the application of external bias [1].To better understand these devices, we have developed a nanoscale model of their electrical switching. Towards this end, first-principles calculations of the electrical conductivity of CNT-CNT junctions were performed using the Density Functional Tight Binding (DFTB) in combination with the Non-Equilibrium Greens functions (NEGF) approach, enabling an improved understanding of the tunnelling of electrons across a range of CNT junctions [2]. These results demonstrate that the conductivity of CNT contacts depends on the overlap area between nanotubes and exponentially on the distances between the carbon atoms of the interacting CNTs. Secondly, we employed coarse-grained molecular dynamics [3,4] to produce nanoscale dense CNT film models like those used in the devices. We devise a set of metrics for characterising the structural properties of CNT films, and apply them to a set of model films designed to mimic those used in microelectronics devices. In order to understand how the geometrical properties of CNTs affect the film structure, we analyse films with different CNT chirality and length distributions. Unlike previous studies that focused on relatively low-density systems below ∼0.4 g/cm3, we also consider films with density of ∼0.6 g/cm3, as employed in experimentally fabricated CNT-based NRAM devices. By adding amorphous carbon to the film models, in varying amounts, we are then able to assess its effects. Finally, these two elements were combined to produce electrical simulations of the conductivity of the CNT films connected to TiN electrodes. These electrodes are shown to be partially oxidized during the device fabrication. The electrical conductivity in a device is characterized by formation of conduction paths formed by CNTs between the electrodes and connected via the CNT junctions. The conductivity is modulated by charging of CNTs and amorphous carbon present in the film.Using these simulations, we propose a resistance switching mechanism in TiN/CNT/TiN devices based on the physical movement of CNTs. During the initial operation of the device, oxygen is released from the oxidized bottom electrode and this readily reacts with individual CNTs to form charge trapping sites. Once these sites have become charged, they enable controllable movement of CNTs at the bottom electrode under the application of electric field. By reversibly connecting and disconnecting such CNTs from the bottom electrode, the electrical conductivity through the CNT film as a whole can be controlled.

In-plane thermal conductivity measurement of microscale polymer films using a reusable micro-thermocouple

Polymers serve as encapsulating materials for electronic devices, making it crucial to investigate their thermophysical properties. In this work, a novel 2ω method for assessing the in-plane thermal conductivity of polymer films is proposed. A reusable micro-thermocouple, serving as both a heating wire and a sensor, is used with silver paste as the interstitial material in contact with the test film. By comparing the 2ω voltages under both contact and non-contact conditions, the thermal impedance is determined. The thermal conductivity is directly calculated by determining the slope of the real part of the thermal impedance against the logarithm of frequency. Theoretical analysis shows that the influences of contact thermal resistance and radiation heat loss are negligible. To validate the accuracy of the method, measurements were repeated on polyimide and polyester films under various contact conditions. The results demonstrate consistency and align with those obtained using the laser spot periodic heating technique.

Flexible-Center Hat Complete Electrode Model for EEG Forward Problem.

This study aims to develop a more realistic electrode model by incorporating the non-uniform distribution of electrode contact conductance (ECC) and the shunting effects, to accurately solve EEG forward problem (FP). Firstly, a hat function is introduced to construct a more realistic hat-shaped distribution (HD) for ECC. Secondly, this hat function is modified by applying two parameters - offset ratio and offset direction - to account for the variability in ECC's center and to develop the flexible-center HD (FCHD). Finally, by integrating this FCHD into the complete electrode model (CEM) with the shunting effects, a novel flexible-center hat complete electrode model (FCH-CEM) is proposed and used to solve FP. Simulation experiments using a realistic head model demonstrate the necessity of FCH-CEM and its potential to improve the accuracy of the FP solution compared to current models, i.e., the point electrode model (PEM) and CEM. And compared to PEM, it has better performance under coarse mesh conditions (2 mm). Further experiments indicate the significance of considering shunting effects, as ignoring them results in larger errors than coarse mesh when the average contact conductance is large (101S/m2). The proposed FCH-CEM has better accuracy and performance than PEM and complements CEM in finer meshes, making it necessary for coarse meshes. This study proposes a novel model that enhances electrode modeling and FP accuracy, and provides new ideas and methods for future research.

Flexible hexagonal boron nitride@liquid metal/polydimethylsiloxane composites with excellent thermal conductivity and superior mechanical properties

AbstractHexagonal boron nitride (h‐BN) has a layered lattice structure, high intrinsic thermal conductivity, and good chemical stability, and it has a promising applications in thermal management materials. However, poor interfacial compatibility and dispersion of BN flakes in the polymer matrix cause thermal contact resistance and gaps, directly impairing the performance of the composites and limiting their thermal conduction applications. Herein, the P‐BN@LM/PDMS thermally conductive composites with superior mechanical properties were fabricated by incorporating dopamine and liquid metal (LM) into BN flakes. The dopamine self‐polymerizes to form polydopamine (PDA) on the BN surface, denoted as P‐BN, which effectively improves interface compatibility and dispersion. The LM attaches to the functionalized P‐BN surface by mechanical grinding, acting as a bridge between adjacent BN flakes to enhance the integrity of the thermal conductive network within the composites. The coordination between P‐BN and LM increases interface strength, effectively improving mechanical performance. Hence, the P‐BN@LM/PDMS composites exhibit excellent thermal conductivity (4.0 W/mK) and an enhancement factor of 1373%, which is 2.22 times that of BN/PDMS composites with the same 30 wt% loading. Additionally, the composite shows superior tensile strength (2.11 MPa) and elongation at break (121%), representing 441% and 203% improvements compared with pure polydimethylsiloxane (PDMS). The P‐BN@LM/PDMS composites, with significant advantages in thermal conductivity and mechanical properties, are promising for future applications as flexible thermal interface materials in thermal management.Highlights The P‐BN@LM/PDMS composites exhibit excellent thermal conductivity (4.0 W/mK) and an enhancement factor of 1373%, making them promising for future applications as flexible thermal interface materials in thermal management. The P‐BN@LM/PDMS composites present a superior tensile strength (2.11 MPa) and elongation at break (121%). PDA formed by the self‐polymerization of dopamine on the BN surface effectively enhances interfacial compatibility and dispersion. LM attaches to the functionalized BN surface through mechanical grinding, acting as a bridge between adjacent BN flakes, thus enhancing the integrity of the thermal conductive network within the composites.

A numerical study on heat transfer for serpentine-type cooling channels in a PEM fuel cell stack

The aim of this work is to analyse numerically the heat transfer for serpentine-type cooling channels in a PEM fuel cell stack. The effect of the coolant type, the flow rate, the inlet temperature, the presence of the thermal contact resistance and the gas diffusion layer, the bipolar plate material and the cooling channels design was studied with CFD simulations in a 100 cm2 active area cell with serpentine cooling channels to analyse the refrigeration capability of a PEMFC stack. A novel correlation for the Nusselt number is presented. The originality of the proposed correlation lies in the fact that it can be used for a comprehensive range of operating conditions, coolant fluids and bipolar plate materials, assessing the influence of those variables on the temperature distributions within the cell. Results of this study determined that mass flow and the bipolar plate thermal conductivity presented a higher effect on the refrigeration capability of a PEMFC stack. Results obtained in terms of the Uniform Temperature Index showed that values above 3.65 % lead to temperature differences in the membrane higher than 5 K, which could cause degradation problems.

Dual conductive network enables mechanically robust polymer composites with highly electrical and thermal conductivities

Thermally and electrically conductive polymer composites (CPCs) have been widely used in smart and flexible electronics; however, huge challenges remain in simultaneously improving the electrical and thermal conductivity of CPCs while maintaining the satisfactory mechanical properties including sufficient strength and toughness. In this study, we propose an effective interfacial regulation approach to fabricate CPCs with a dual conductive network through decoration of Ag nanoparticles (AgNPs) onto the polyurethane (PU) nanofibers containing graphite nanoplatelets (GNPs), followed by hot-pressing. Rigid GNPs expand the PU nanofiber network, facilitating Ag precursor adsorption, while subsequent hot-pressing eliminates the big channels and pores inside nanofiber composite membranes and hence greatly enhance their mechanical properties. After hot-pressing, the synergistic dual conductive network with greatly reduced thermal and electrical contact resistance leads to significant improvements in both thermal and electrical conductivity (up to 27.71 W (m K)−1 and 1.87 × 106 S/m, respectively). Moreover, the mechanically robust CPCs with exceptional durability possess superior Joule heating performance at low voltages and heat dissipation capability. This study provides inspiration for designing highly thermally and electrically conductive CPCs with potential applications as flexible thermal interface materials.

Melting of PCM-graphite foam composites with contact thermal resistance: Pore-scale simulation

Latent heat energy storage systems have emerged as a solution to intermittency and instability in renewable energy sources, the phase transition of phase change materials (PCMs) within these systems is hindered by their poor thermal conductivity. Graphite foam, renowned for its superior thermal properties, stands as an ideal choice to improve the melting efficiency of PCMs. In the current study, the melting behavior of PCM-graphite foam composites is simulated by the pore-scale numerical simulation (PNS) by employing cubic idealized cells with spherical pores and cylindrical channels. The computed results demonstrate that the porosity and contact thermal resistance of graphite foam are key factors affecting the melting efficiency of PCMs. The full melting time (FMT) of PCMs increases with porosity, achieving a 53.1 % improvement as porosity decreases from 0.90 to 0.75. In addition, the absence of natural convection markedly diminishes the maximum melting rate of PCM, reducing it by 33.5 % to 50.3 % for porosity from 0.75 to 0.90. Notably, it needs to be emphasized that the melting rate of PCM is significantly reduced when the contact thermal resistance surpasses 1.0 × 10–4 m2·K·W−1. Compared to the idealized condition without contact thermal resistance, the dimensionless FMTs for porosities of 0.75, 0.80, 0.85, and 0.90 extend by 27.3 %, 27.1 %, 22.2 % and 23.9 % for a contact thermal resistance of 5.0 × 10–4 m2·K·W−1, respectively.

Measuring thermal contact resistance across solid and liquid interface mediums by thermal imaging technique: Applications on bearing steel

This study introduces a versatile method for measuring thermal contact resistance in bearing steel with solid–solid and liquid–solid interfaces using lock-in thermography (LIT) technique. The method relies on analyzing the lock-in thermal response across the layers of the bearing structure induced by periodic surface-laser heating. Thermal contact resistance is determined from the discontinuous behavior analysis of the thermal response at the solid–solid or liquid–solid contact interface, based on the resolved heat equation for the multilayered structure. The usability of the method is demonstrated through measurements conducted on a conventional bearing steel configuration, using air and lubricating oil as the interface mediums. Furthermore, the versatility of the method allows for investigating the impact of mechanical load on thermal contact resistance. This proposed approach represents an advanced tool for analyzing thermal contact resistance with applications beyond bearing steel to various multilayered materials. It has the potential to assist in enhancing thermal analysis, improving reliability, extending the lifetime, and reducing maintenance costs of different thermal engineering applications including bearings.

A novel contact thermal resistance model for heat transfer in granular systems: Leveraging the force-heat analogy

A novel particle-to-particle contact thermal resistance model is proposed in this study, based on the concept of analogy between force and heat transfer. The distribution of heat flux on the contact surface is assumed to resemble the distribution of stress, eliminating the issue of temperature singularity at the contact edge. The model is validated against existing theories and experiments, showing good agreement. The combined use of the model and the thermal discrete element method is applied to analyze temperature and effective thermal conductivity distributions in a pebble bed within a high-temperature test unit. The average effective thermal conductivity obtained from thermal conduction is found to be 2.99 and 2.61 W/(m·K) for power inputs of 20 kW and 82 kW, respectively. An increase in the outer wall temperature from 200 °C to 1000 °C results in an approximate 20 % increase in the effective thermal diffusivity.

Self-healing, adaptive and shape memory polymer-based thermal interface phase change materials via boron ester cross-linking

Addressing the thermal resistance between rough interfaces without applying pressure to the interfacial sandwich has been a challenge. Herein, a thermal interface phase change material (TIPCM) is designed to realize a 3D support skeleton with a dynamic crosslinking network by introducing a boron ester crosslinking backbone into paraffin wax (PW) and ethylene-octene copolymer (EOC), thus enabling the TIPCM to ensure mechanical integrity without leakage even above the melting temperature of EOC. The chemical cross-linking between the organic solid–liquid phase change material (PCM) and the polymer realizes thermally triggered self-healing and adaptive shape memory properties. The phase transition of PW leads to a decrease in the modulus of TIPCM and activates the ester exchange of the dynamic covalent bonding of boron esters, which allows TIPCM to self-heal and self-adapt to a variety of object surfaces. These enabled the TIPCM to fill the interface gaps through small stress deformations, forming an interlocking structure that reduces contact thermal resistance and promotes heat transfer. The obtained TIPCM achieves excellent chip thermal management performance, cooling the analog CPU temperature by 67 °C at 5 V. In conclusion, this study provides a potential strategy for redesigning TIPCMs with high latent heat and special physical properties for thermal management.

Development and Experimental Validation of a Two-stage Thermoelectric Heat Pump Computational Model for Heating Applications

The utilisation of thermoelectric technology as a heat pump in heating applications necessitates comprehensive investigation. The scalable nature of thermoelectric technology enables its operation at elevated temperatures without the requirement of refrigerants. In this work, an accurate computational model that can simulate one- and two-stage thermoelectric heat pumps is developed. This model uses the electric-thermal analogy and the finite difference method, including the thermoelectric effects, temperature dependent properties, thermal contact resistances and all heat exchangers, even the intermediate heat exchanger in the case of a two-stage configuration. Moreover, the model has been experimentally validated by built and tested prototypes, being the first time that a two-stage thermoelectric heat pump model is experimentally validated.The discrepancy between the simulated and experimental results is below the ± 10 % for COP, ± 8 % for generated heat and temperature lift in the airflow, and less than the ± 6 % for consumed power. Additonally, the model simulates real tendencies under different operating conditions, proving the reliability of the developed thermoelectric heat pump model.Finally, the model is used to optimise a thermoelectric system combining one- and two-stage thermoelectric heat pumps, and hybridising them with electric resistances. An airflow of 16.5 m3/h is heated from 25 °C to 160 °C, achieving a maximum COPtot of 1.21. Lastly, the importance of considering the thermal resistances of the heat exchangers is computationally modelled and demonstrated. Not taking them into account would overestimate the performance of the TEHP system by more than the 7 %.

Heat Transfer Management of Thermal and Electronics Systems using Convective-Radiative Porous Fins with Thermal Contact Resistance and Diabatic Tip

The miniaturization of electronics, electrical, thermal, mechanical and optical devices and systems calls for increasing demand for efficient cooling systems with higher thermal efficiency. The use of passive mode of cooling using fins has provided unprecedented results. However, the previous transient analyses of the extended surfaces have been done without proper considerations of the imperfect contact between the fin base and the prime surface. Also, the tip of the passive device has been assumed to be adiabatic. However, the present article explores the significances of thermal contact resistance and diabatic tip on the transient thermal response of straight fin with temperature-dependent thermal conductivity and magnetic field under radiative-convective conditions. The nonlinear model is analyzed numerically using generalized Integral Transform Techniques and the numerical results are verified by the exact solution for the linear thermal model. The parametric explorations reveal that the adimensional local temperature in the conductive-radiative fin increases when the conductive-convective, conductive-radiative and magnetic field parameters increase. However, under the assumption of perfect thermal contact between the prime surface and the base of the fin, the adimensional temperature in the fin will decrease as the conductive-convective, conductive-radiative and magnetic field parameters increase. The fin temperature is significantly affected by the Biot numbers under the comparably low values of the conductive-convective, conductive-radiative, magnetic field and thermal conductivity parameters. The effects of the fin thermal conductivity parameter along the fin length depend on the respective values of thermal contact Biot number at the base of the fin and the end cooling Biot number at the tip of the fin. When the thermal conductivity parameter is amplified, the fin adimensional temperature increases when thermal contact Biot number at the base of the fin is zero and the end cooling Biot number at the tip of the fin is very large. This study will help in accurate analysis and design of heat sinks and passive devices for heat transfer enhancement for thermal and electronic systems.

Scalable Compliant Graphene Fiber-Based Thermal Interface Material with Metal-Level Thermal Conductivity via Dual-Field Synergistic Alignment Engineering.

High-performance thermal interface materials (TIMs) are highly desired for high-power electronic devices to accelerate heat dissipation. However, the inherent trade-off conflict between achieving high thermal conductivity and excellent compliance of filler-enhanced TIMs results in the unsatisfactory interfacial heat transfer efficiency of existing TIM solutions. Here, we report the graphene fiber (GF)-based elastic TIM with metal-level thermal conductivity via mechanical-electric dual-field synergistic alignment engineering. Compared with state-of-the-art carbon fiber (CF), GF features both superb high thermal conductivity of ∼1200 W m-1 K-1 and outstanding flexibility. Under dual-field synergistic alignment regulation, GFs are vertically aligned with excellent orientation (0.88) and high array density (33.5 mg cm-2), forming continuous thermally conductive pathways. Even at a low filler content of ∼17 wt %, GF-based TIM demonstrates extraordinarily high through-plane thermal conductivity of up to 82.4 W m-1 K-1, exceeding most CF-based TIMs and even comparable to commonly used soft indium foil. Benefiting from the low stiffness of GF, GF-based TIM shows a lower compressive modulus down to 0.57 MPa, an excellent resilience rate of 95% after compressive cycles, and diminished contact thermal resistance as low as 7.4 K mm2 W-1. Our results provide a superb paradigm for the directed assembly of thermally conductive and flexible GFs to achieve scalable and high-performance TIMs, overcoming the long-standing bottleneck of mechanical-thermal mismatch in TIM design.

Simultaneous Measurement of Thermal Conductivity and Volumetric Heat Capacity of Thermal Interface Materials Using Thermoreflectance.

Thermal interface materials are crucial to minimize the thermal resistance between a semiconductor device and a heat sink, especially for high-power electronic devices, which are susceptible to self-heating-induced failures. The effectiveness of these interface materials depends on their low thermal contact resistance coupled with high thermal conductivity. Various characterization techniques are used to determine the thermal properties of the thermal interface materials. However, their bulk or free-standing thermal properties are typically assessed rather than their thermal performance when applied as a thin layer in real application. In this study, we introduce a low-frequency range frequency domain thermoreflectance method that can measure the effective thermal conductivity and volumetric heat capacity of thermal interface materials simultaneously in situ, illustrated on silver-filled thermal interface material samples, offering a distinct advantage over traditional techniques such as ASTM D5470. Monte Carlo fitting is used to quantify the thermal conductivities and heat capacities and their uncertainties, which are compared to a more efficient least-squares method.

Determination of Contact Resistance of Thermal Interface Materials Used in Thermal Monitoring Systems of Electric Vehicle Charging Inlets.

The rapid growth of the electric vehicle (EV) market is observed. This is challenging from a materials point of view when it comes to the thermal monitoring systems of charging inlets, for which requirements are very restrictive. Because the thermal conductivity of the thermal interface material is usually measured, there is a significant research gap on the contact thermal resistance of novel materials used in the electric vehicle industry. Moreover, researchers mainly focus on electrically conductive materials, while for thermal monitoring systems, the most important requirement is a high dielectric breakdown voltage. In this paper, the thermal contact resistance of materials for EV applications was thoroughly analyzed. This study consisted of experimental measurements with the Laser Flash Analysis (LFA) method, as well as a theoretical analysis of thermal contact resistance. The main focus was on the extraction of contact and material thermal resistance. The obtained results have great potential to be used as input data for further numerical modeling of solutions that meet strict thermal accuracy requirements. Additionally, the chemical composition and internal structure were analyzed using scanning electron microscopy, to better describe the material.