Circuit Patterns Research Articles

Total saponins from Trillium tschonoskii Maxim promote neurological recovery in model rats with post-stroke cognitive impairment.

Total saponins from Trillium tschonoskii Maxim (TSTT), a bioactive component of local natural herbs in the Enshi area, China, have been demonstrated to have functions of restoring cognitive capacity and promoting axonal regeneration post-stroke, but the mechanism of this process remains unclear. The hippocampus is a critical tissue for controlling learning and memory capacity, and the sonic hedgehog (Shh) signaling pathway plays a major role in the patterning and synaptic plasticity of hippocampal neural circuits. Therefore, we aimed to investigate whether TSTT could restore learning and cognitive functions by modulating the Shh pathway in rats with post-stroke cognitive impairment (PSCI). The ischemia model was established by permanent middle cerebral artery occlusion (MCAO) in 100 Sprague-Dawley (SD) rats, and the model rats were administered using TSTT (100mg/kg) or donepezil hydrochloride as the positive control (daily 0.45mg/kg, DON) for 4weeks after the operation. As assessed by the Morris water maze test, the cognitive function of PSCI rats was significantly improved upon TSTT treatment. Meanwhile, the cerebral infarct volume reduced with TSTT, as shown by HE and TTC staining, and the number of Nissl bodies and dendritic spine density were significantly increased, as shown by Nissl and Golgi staining. In addition, TSTT upregulated PSD-95, SYN, and GAP-43, and inhibited neuronal apoptosis, as evidenced by increased Bcl-2 levels along with decreased Bax and caspase-3 expression. TSTT could also significantly upregulate Shh, Ptch1, Smo, and Gli1 proteins, indicating the activation of the Shh signaling pathway. Therefore, TSTT can protect PSCI rats by inhibiting apoptosis and promoting neuronal synaptic remodeling. The Shh pathway is also involved.

Reanalysis of primate brain circadian transcriptomics reveals connectivity-related oscillations

Research shows that brain circuits controlling vital physiological processes are closely linked with endogenous time-keeping systems. In this study, we aimed to examine oscillatory gene expression patterns of well-characterized neuronal circuits by reanalyzing publicly available transcriptomic data from a spatiotemporal gene expression atlas of a non-human primate. Unexpectedly, brain structures known for regulating circadian processes (e.g., hypothalamic nuclei) did not exhibit robust cycling expression. In contrast, basal ganglia nuclei, not typically associated with circadian physiology, displayed the most dynamic cycling behavior of its genes marked by sharp temporally defined expression peaks. Intriguingly, the mammillary bodies, considered hypothalamic nuclei, exhibited gene expression patterns resembling the basal ganglia, prompting reevaluation of their classification. Our results emphasize the potential for high throughput circadian gene expression analysis to deepen our understanding of the functional synchronization across brain structures that influence physiological processes and resulting complex behaviors.

Environmentally-Friendly Electroplating Process Using Solid Electrolyte Membranes

The automobile is a very broad industry, and consists of tens of thousands of parts. Many parts of automobile employ surface treatment to provide several functions such as electronic and anti-corrosion properties. Among several surface treatment process, plating is an important elemental technology for automobile industry. For the industrial perspective, interest in SDGs significantly increases, and efforts to reduce environmental impact are highly urgent. Recently, we have developed novel electroplating process, solid electrodeposition (SED), which is based on ion transfer through solid electrolyte membrane1). This process has unique deposition characteristics that the metal film can be deposited only on the contact area between cathode and the membrane, in a fashion similar to stamping deposition. The SED process has an advantage for reducing amounts of waste effluent and CO2 gas. Moreover, this process has a potential of high deposition rate due to utilization of thin electrolyte membrane, providing lower electrical resistance between electrodes1), 2). Therefore, in the environmental and economical perspective, we believe that SED is promising process to metallize the substrate surface as an alternative to the conventional electroplating, especially in the field of electronics manufacturing. In this study, we report on SED system in details and characterization of deposited copper and nickel films. We also introduce copper fine patterning technique combined with SED using hard mask. Figure 1 shows schematic of the present SED system. The head part composed of anode plate, electrolyte solution and membrane are placed on substrate under controlled temperature and pressure. The membrane mainly plays a role of selective cation transfer from electrolyte solution to the substrate, although a small amounts of electrolyte solution can also be transferred due to pressure difference between internal head part and atmosphere. This solution uniformly spread to the interface between membrane and substrate so that uniform metal deposition is continuously proceeded without adhering the membrane with the substrate. Additionally, the SED system allows one to shorten the distance between electrodes because membrane can act as a diaphragm. Therefore, the power consumption is smaller than that of conventional electroplating, owing to decrease in an internal electrical resistance, providing the decrease of exhaust CO2 gas. The deposited film has relatively uniform thickness as shown in Figure 2, the result of which is due to the short distance between electrodes as well as uniform current feeding to deposit metal films through the back side of the cathode. The deposited copper and nickel films are crystalline and highly conductive, the quality of which are being enough for application of the SED process in the current electronics device manufacturing. By combining the SED process with the conventional screen printing technique, copper circuit patterns with line width of below 50 μm could also be successfully fabricated.1) Akamatsu, S. Nakano, K. Kimura, Y Takashima, T. Tsuruoka, H. Nawafune, Y. Sato, J. Murai, H. Yanagimoto, ACS Appl. Mater. Interfaces, 13, 13896-13906 (2021)2) Narui, Y. Hoshi, I. Shitanda, M. Itagaki, H. Yanagimoto, M. Hiraoka and H. Iisaka, E01-920, 232nd ECS Meeting. Figure 1

Photoemission spectroscopy on photoresist materials: A protocol for analysis of radiation sensitive materials

The continued downscaling, following the so-called Moore's law, has motivated the development and use of extreme ultraviolet (EUV) lithography scanners with specialized photoresists. Since the quality and precision of the transferred circuit pattern are determined by the EUV-induced chemical changes in the photoresist, having a deep understanding of these chemical changes is of pivotal importance. For this purpose, several spectroscopic and material characterization techniques have already been employed. Among them, photoemission can be essential as it not only allows direct probing of chemical bonds in a quantitative way but also provides useful information regarding the generation and distribution of primary and secondary electrons. However, since high energy photons are being employed for characterization of a photosensitive material, modification of the sample during the measurement is possible, and this must be considered when investigating the chemical changes in the photoresist before and after exposure to EUV light. In this paper, we investigate the chemical changes occurring during the photoemission measurements of an unexposed, model chemically amplified resist based on the well-known environmentally stable chemically amplified photoresist as a function of a number of measurement parameters, using both an x ray (AlKα, 1486.6 eV) and a UV source (HeII, 40.8 eV). We will show that these chemical changes can be simulated through theoretical modeling of the photoemission spectra. Based on these results, we propose a measurement protocol allowing to minimize or eliminate this modification which will help to guide (or enable) photoemission measurements on radiation-sensitive materials (e.g., photoresists).

Synthesis of Ni Nanosheets by Template-Free Method and Their Application in Conductive and Magnetic Flexible Electrons.

Two-dimensional Ni nanosheets are synthesized by the template-free method using Na3CA as an orientation agent in liquid phase, and then the conductive Ni nanosheet ink is prepared for conductive circuits on flexible electronics. The thickness of the Ni nanosheets is about 800 nm, and the diameter is about 100 μm. Na3CA plays a structural guiding role to form Ni nanocrystals, promoting the self-assembly of Ni nanocrystals into Ni nanosheets effectively. The laminar stackable patterns of the Ni nanosheet circuits increase the contact area of the Ni nanosheets and improve the stability of the conductors under stress. Ni nanosheets can bend with the folding of the structure, while the mutual constraints between their layers promote the circuit to remain stable during the bending state. Therefore, the Ni nanosheet circuits display excellent conductive performance during the tiled and bent stages. In addition, Ni nanosheet/Ag nanowire composites are prepared to enhance conductivity to meet higher demands. Moreover, the experimental results of its application in magnetic guided switch closure circuits show that Ni nanosheet/Ag nanowire composites have the potential to participate in both conductive and magnetic field applications simultaneously.

Exploring weak spots in cutting-edge lithography for microchip manufacturing

Integrated circuit pattern anomalies may stem from the same stochastic phenomenon

LTK and ALK promote neuronal polarity and cortical migration by inhibiting IGF1R activity

The establishment of axon‐dendrite polarity is fundamental for radial migration of neurons, cortical patterning, and formation of neuronal circuits. Here, we show that the receptor tyrosine kinases, Ltk and Alk, are required for proper neuronal polarization. In isolated primary mouse embryonic neurons, the loss of Ltk and/or Alk causes a multiple axon phenotype. In mouse embryos and newborn pups, the absence of Ltk and Alk delays neuronal migration and subsequent cortical patterning. In adult cortices, neurons with aberrant neuronal projections are evident and axon tracts in the corpus callosum are disrupted. Mechanistically, we show that the loss of Alk and Ltk increases the cell‐surface expression and activity of the insulin‐like growth factor 1 receptor (Igf‐1r), which activates downstream PI3 kinase signaling to drive the excess axon phenotype. Our data reveal Ltk and Alk as new regulators of neuronal polarity and migration whose disruption results in behavioral abnormalities.

Nonlinear compression block codes: Exact and random search strategy

The nonlinear block codes have significantly better testing abilities than the linear ones used in Built-In Self Test Equipment or test pattern decompressors. Unfortunately, no sufficiently effective deterministic code creation strategy has been discovered till now. This paper deals with a deterministic nonlinear code search strategy and a strategy based on extending linear compression codes by nonlinear check bits that improve the usability of decompressed patterns for testing circuits with more inputs. The earlier works used a purely or partially random search of the nonlinear check-bits truth tables to construct the first nonlinear structures. Here, we derive deterministic rules that can be used for the iterative process of code generation with no necessity of any random search for codes with the number of specified bits equal to three. We compare the code parameters of codes based on linear code extension, direct deterministic code search methods, and previously published results. The most extensive codes still need to be constructed with a partial random search strategy, but keeping the restrictions introduced in the paper causes the search to be substantially more efficient.

Multimaterial Printing of Liquid Crystal Elastomers with Integrated Stretchable Electronics.

Liquid crystal elastomers (LCEs) have grown in popularity in recent years as a stimuli-responsive material for soft actuators and shape reconfigurable structures. To make these material systems electrically responsive, they must be integrated with soft conductive materials that match the compliance and deformability of the LCE. This study introduces a design and manufacturing methodology for combining direct ink write (DIW) 3D printing of soft, stretchable conductive inks with DIW-based "4D printing" of LCE to create fully integrated, electrically responsive, shape programmable matter. The conductive ink is composed of a soft thermoplastic elastomer, a liquid metal alloy (eutectic gallium indium, EGaIn), and silver flakes, exhibiting both high stretchability and conductivity (order of 105 S m-1). Empirical tuning of the LCE printing parameters gives rise to a smooth surface (<10 μm) for patterning the conductive ink with controlled trace dimensions. This multimaterial printing method is used to create shape reconfigurable LCE devices with on-demand circuit patterning that could otherwise not be easily fabricated through traditional means, such as an LCE bending actuator able to blink a Morse code signal and an LCE crawler with an on/off photoresistor controller. In contrast to existing fabrication methodologies, the inclusion of the conductive ink allows for stable power delivery to surface mount devices and Joule heating traces in a highly dynamic LCE system. This digital fabrication approach can be leveraged to push LCE actuators closer to becoming functional devices, such as shape programmable antennas and actuators with integrated sensing.

Investigation of electroless copper plating with high plating coverage in small BVH for next generation fine pattern SAP

Printed wiring board (PWB) used for package substrates are required to have higher circuit densities. We anticipate that PWB circuit patterns and blind via hole (BVH) will continue to be miniaturized due to higher density requirements. The electroless copper plating solution generally used has less chemical material supply to the inside of the BVH than the surface of the substrate. As a result, the copper thickness at the bottom of the BVH tends to be thinner than that on the surface of the substrate. It is difficult to uniformly deposit the electroless copper plating in the BVH on the package substrate by the semi-additive process (SAP), especially when the BVH are becoming smaller. Therefore, we investigated additives that suppress the electroless copper plating deposition on the surface of the substrate and additives that improve the permeability of the plating solution into the BVH. Two additives have been discovered that dramatically improve the plating uniformity in the small BVH compared to the conventional bath. In addition, we used this plating solution with the new additives to evaluate the internal stress and peel strength of the electroless copper plating film. As a result, it was confirmed that both internal stress and peel strength were improved compared to the conventional bath.

E-Textile by Printing an All-through Penetrating Copper Complex Ink.

Wearable electronics is an emerging field in academics and industry, in which electronic devices, such as smartwatches and sensors, are printed or embedded within textiles. The electrical circuits in electronics textile (e-textile) should withstand many cycles of bending and stretching. Direct printing of conductive inks enables the patterning of electrical circuits; however, while using conventional nanoparticle-based inks, printing onto the fabric results in a thin layer of a conductor, which is not sufficiently robust and impairs the reliability required for practical applications. Here, we present a new process for fabricating robust stretchable e-textile using a thermodynamically stable, solution-based copper complex ink, which is capable of full penetrating the fabric. After printing on knitted stretchable fabrics, they were heated, and the complex underwent an intermolecular self-reduction reaction. The continuously formed metallic copper was used as a seed layer for electroless plating (EP) to form highly conductive circuits. It was found that the stretching direction has a significant role in resistivity. This new approach enables fabricating e-textiles with high stretchability and durability, as demonstrated for wearable gloves, toward printing functional e-textile.

Curves intersecting in a circuit pattern

We show that the cycle relation between Dehn twists about curves in a circuit detects whether the circuit bounds an embedded disc. This is done by determining the isomorphism type of the group generated by said Dehn twists for various surfaces.

Quantification of three-dimensional pattern-shape variation with CD-SEM top-down image

The shrinkage of circuit patterns for improvement of the semiconductor device performance has reduced the tolerances in production. To fit in the tolerances, technologies for improving the uniformity of three-dimensional (3D) shapes of circuit patterns inter- or intra- wafers has been developed. Then, we developed a method for quantifying variations in 3D shapes by critical-dimension scanning electron microscopy (CD-SEM), which can measure widths of circuit patterns with high sensitivity. Since variations in the SEM-image signal are caused by 3D-shape variations, in the method, multiple feature values representing the signal detect shape variations. To compare the effect of the variation in each feature value on the shape variation, the amount of variation in the feature values was normalized by local variations in a reference image. Evaluation on etched wafers showed that several features exhibited independent variation trends that were larger than the local fluctuation. Cross-sectional verification confirmed that one of the feature values correlated with the width at the middle height that cannot be seen in top-view, and variations of 0.24 nm can be detected. It is expected that adjusting processing conditions based on this variation trend will efficiently improve the uniformity of the 3D shape.

Overlay and CD uniformity variation due to wafer thermal deformation caused by EUV exposure

The extreme ultraviolet lithography (EUVL) process allows for the manufacturing of better-performance chips. However, the EUVL exposure process might contribute to significant variations in the patterns of circuits, which can cause serious image placement and flatness change. Especially during the exposure, the EUV absorption might cause local wafer thermal deformation that might cause overlay and local critical dimension (CD) variation. In this study, we investigated wafer thermal deformation with different CDs and pitches with EUV exposure and thermo-mechanical behavior of the photoresist using the finite element method simulation. It is found that the thermal deformation caused during EUV exposure is different inside a die. In the direction along the scan, thermal deformation increases as it is near the center of the slit. The deformation in the perpendicular direction increases as it approaches the edges and deforms in the opposite direction relative to the center of the slit. In both directions, the thermal deformation increases gradually as the scan progresses, and it could be as large as ∼1.5 nm in a die. There was no difference in thermal deformation by CD change, but it changed with pitch.

Super-resolution method for SEM images based on pixelwise weighted loss function.

Scanning electron microscopy (SEM) has realized high-throughput defect monitoring of semiconductor devices. As miniaturization and complexification of semiconductor circuit patterns increase in recent years, so has the number of defects. There is thus a great need to further increase the throughput of SEM defect monitoring. Toward this end, we propose a deep learning-based super-resolution method that reproduces high-resolution (HR) images from corresponding low-resolution images. Image quality factors such as pattern contrast and sharpness are important in SEM HR images in order to evaluate the quality of printed circuit patterns. Our proposed method meets various image quality requirements by changing the loss calculation method pixelwise based on the pattern in the image. It realizes super-resolved images that compare favorably with actual HR images and can improve SEM throughput by 100% or more.

A comprehensive review of various non-cyanide electroplating baths for the production of silver and gold coatings

ABSTRACT Cyanide-based baths are generally used industrially to produce silver and gold coatings via electroplating. Baths containing ([Au(CN)2]−) and ([Ag(CN)2]−) are used for the deposition of gold and silver coatings, respectively. However, due to the severe toxicity, the technical personnel involved in work are at risk. Additionally, the disposal of cyanide-containing wastes poses a significant threat to the environment as they pollute various natural resources. The coatings produced from alkaline cyanide-based baths cause embrittlement of electronic circuit patterns. Due to these reasons, many cyanide-free baths have started to replace the existing cyanide-based baths. In the cyanide-free baths, the primary cyanide complexing agent is replaced with eco-friendly alternative compounds like sulphite, thiosulphate, thiourea, DMH, EDTA, and ionic liquids (ILs). This review article provides an overview of the various cyanide-free electroplating baths available for electroplating silver and gold that are either used for commercial practice or are developed for laboratory-scale use.

Grazing-Incidence Soft-X-ray Scattering for the Chemical Structure Size Distribution Analysis in EUV Resist

In extreme ultraviolet lithography (EUVL), it is required to develop EUV resist which has low line width roughness (LWR) for the further miniaturization of circuit pattern. In order to reduce LWR, it is necessary to analyze and control the chemical-components spatial distribution in the resist thin film. We have reported that the measurement of chemical-components spatial distribution in the resist thin film coated on the Si3N4 membrane using the method of the transmission-mode resonant soft X-ray scattering (RSoXS). In this study, in order to analyze the chemical-structure-size distribution in the resist thin film on a Si wafer under similar condition adapted to the resist-coating actual process, we examined the grazing-incidence RSoXS (GI-RSoXS). A chemically amplified resist (CAR) and a non-CAR were spin-coated on silicon wafers, which had varied film thickness of 20, 50, and 100 nm. The scattering profile of each sample was measured at the incident photon energy of 280 and 296 eV. As a result, it is suggested that the chemical-structure-size distribution in the resist thin films depends on the resist film thickness. It is confirmed that the GI-RSoXS method is very effective to evaluate the chemical-structure-size distribution of resist thin films.

COMPARISONS OF TOURIST CIRCUIT PATTERN AT SELECTED TOURISM DESTINATION IN SABAH, MALAYSIA

The tourist circuit pattern is one of the factors that are influenced by tourists' willingness to pay for a vacation at a tourist destination. As such, this article will examine the relationship between tourist space and willingness to pay in Kundasang - Ranau and Kota Belud, Sabah. The assessment and case study methods were used in the research. The study used quantitative methodologies, including a questionnaire survey of 150 respondents who visited selected tourist locations in Kundasang-Ranau and 93 respondents who visited Kota Belud. The survey's findings indicated that the majority of respondents (87.3% - Kundasang, Ranau) and (61.3%- Kota Belud) who visited the two study locations traveled privately and prioritized destinations they had never visited while selecting tourist destinations. The majority of respondents (70%) in Kundasang - Ranau agreed that the fee rate charged has an effect on the direction of their journey. In Kundasang - Ranau, the respondent's roaming space is dictated by the tourism package, and the tourist attraction visited by the respondent is nearby, whereas in Kota Belud, the opposite is true. Following that, the bulk of respondents who arrived at Kota Belud were determined by their roaming space in accordance with the institution or organization's determination. The study's findings also revealed that the majority of respondents who visited the two study areas did so on their own and that the tourist destinations visited were relatively near together.

Multi-field coupling parameter regulation model of flexible circuit pattern using near-field electrohydrodynamic direct-writing method

Multi-field coupling parameter regulation model of flexible circuit pattern using near-field electrohydrodynamic direct-writing method

Creation of Neuronal Ensembles and Cell-Specific Homeostatic Plasticity through Chronic Sparse Optogenetic Stimulation.

Cortical computations emerge from the dynamics of neurons embedded in complex cortical circuits. Within these circuits, neuronal ensembles, which represent subnetworks with shared functional connectivity, emerge in an experience-dependent manner. Here we induced ensembles in ex vivo cortical circuits from mice of either sex by differentially activating subpopulations through chronic optogenetic stimulation. We observed a decrease in voltage correlation, and importantly a synaptic decoupling between the stimulated and nonstimulated populations. We also observed a decrease in firing rate during Up-states in the stimulated population. These ensemble-specific changes were accompanied by decreases in intrinsic excitability in the stimulated population, and a decrease in connectivity between stimulated and nonstimulated pyramidal neurons. By incorporating the empirically observed changes in intrinsic excitability and connectivity into a spiking neural network model, we were able to demonstrate that changes in both intrinsic excitability and connectivity accounted for the decreased firing rate, but only changes in connectivity accounted for the observed decorrelation. Our findings help ascertain the mechanisms underlying the ability of chronic patterned stimulation to create ensembles within cortical circuits and, importantly, show that while Up-states are a global network-wide phenomenon, functionally distinct ensembles can preserve their identity during Up-states through differential firing rates and correlations.SIGNIFICANCE STATEMENT The connectivity and activity patterns of local cortical circuits are shaped by experience. This experience-dependent reorganization of cortical circuits is driven by complex interactions between different local learning rules, external input, and reciprocal feedback between many distinct brain areas. Here we used an ex vivo approach to demonstrate how simple forms of chronic external stimulation can shape local cortical circuits in terms of their correlated activity and functional connectivity. The absence of feedback between different brain areas and full control of external input allowed for a tractable system to study the underlying mechanisms and development of a computational model. Results show that differential stimulation of subpopulations of neurons significantly reshapes cortical circuits and forms subnetworks referred to as neuronal ensembles.