Environmentally-Friendly Electroplating Process Using Solid Electrolyte Membranes

Abstract

The automobile is a very broad industry, and consists of tens of thousands of parts. Many parts of automobile employ surface treatment to provide several functions such as electronic and anti-corrosion properties. Among several surface treatment process, plating is an important elemental technology for automobile industry. For the industrial perspective, interest in SDGs significantly increases, and efforts to reduce environmental impact are highly urgent. Recently, we have developed novel electroplating process, solid electrodeposition (SED), which is based on ion transfer through solid electrolyte membrane1). This process has unique deposition characteristics that the metal film can be deposited only on the contact area between cathode and the membrane, in a fashion similar to stamping deposition. The SED process has an advantage for reducing amounts of waste effluent and CO2 gas. Moreover, this process has a potential of high deposition rate due to utilization of thin electrolyte membrane, providing lower electrical resistance between electrodes1), 2). Therefore, in the environmental and economical perspective, we believe that SED is promising process to metallize the substrate surface as an alternative to the conventional electroplating, especially in the field of electronics manufacturing. In this study, we report on SED system in details and characterization of deposited copper and nickel films. We also introduce copper fine patterning technique combined with SED using hard mask. Figure 1 shows schematic of the present SED system. The head part composed of anode plate, electrolyte solution and membrane are placed on substrate under controlled temperature and pressure. The membrane mainly plays a role of selective cation transfer from electrolyte solution to the substrate, although a small amounts of electrolyte solution can also be transferred due to pressure difference between internal head part and atmosphere. This solution uniformly spread to the interface between membrane and substrate so that uniform metal deposition is continuously proceeded without adhering the membrane with the substrate. Additionally, the SED system allows one to shorten the distance between electrodes because membrane can act as a diaphragm. Therefore, the power consumption is smaller than that of conventional electroplating, owing to decrease in an internal electrical resistance, providing the decrease of exhaust CO2 gas. The deposited film has relatively uniform thickness as shown in Figure 2, the result of which is due to the short distance between electrodes as well as uniform current feeding to deposit metal films through the back side of the cathode. The deposited copper and nickel films are crystalline and highly conductive, the quality of which are being enough for application of the SED process in the current electronics device manufacturing. By combining the SED process with the conventional screen printing technique, copper circuit patterns with line width of below 50 μm could also be successfully fabricated.1) Akamatsu, S. Nakano, K. Kimura, Y Takashima, T. Tsuruoka, H. Nawafune, Y. Sato, J. Murai, H. Yanagimoto, ACS Appl. Mater. Interfaces, 13, 13896-13906 (2021)2) Narui, Y. Hoshi, I. Shitanda, M. Itagaki, H. Yanagimoto, M. Hiraoka and H. Iisaka, E01-920, 232nd ECS Meeting. Figure 1