Breakdown Voltage Vbr Research Articles

Vertical GaN Schottky barrier diodes with ohmic contact on N-polar by the atomic layer deposition of aluminum oxide interfacial layer

In this paper, high-performance vertical GaN on GaN Schottky Barrier Diodes (SBDs) on 2-inch free-standing (FS)-GaN is presented with the specific on-state resistance (Ron) of 1.34 mΩ·cm2, breakdown voltage (Vbr) of 1150 V and figure of merit (FOM) of 0.98 GW/cm2. He-implanted edge termination (ET) structure is introduced to alleviate the peak electric field concentration effect at the anode edge of GaN SBDs. Furthermore, A new ohmic contact structure is explored by atomic layer deposition (ALD)-grown AlOx interfacial layer. Based on the self-cleaning effect of ALD and Ultra-thin AlOx interfacial layer, the Fermi-level Pinning (FLP) effect is alleviated effectively, the specific contact resistivity (ρc) on N-polar GaN was reduced from 1.63 × 10−3 to 7.14 × 10−5 Ω·cm2.The temperature variation test demonstrate the devices has potential of temperature sensors under high voltage and high temperature.

Gate mesa terminal with drain-field-plated β-Ga2O3 MOSFET with ultra-high power figure of merit

In this article, a novel gate mesa terminal (GMT) device structure incorporating a drain field plate is proposed. This design features mesa terminals with varying bevel angles positioned atop the gate. The objective is to enhance the breakdown voltage (Vbr) and reduce the on-resistance (Ron) of the lateral β-Ga2O3 metal-oxide-semiconductor field-effect transistor (MOSFET). Through the implementation of the GMT structure, the peak electric field within the β-Ga2O3 MOSFET is redirected towards the passivation layer. This effectively mitigates the electric field in the epitaxial layer, thereby increasing Vbr. The optimal values for Vbr, specific on-resistance (Ron,sp) and maximum transconductance (gm) across various GMT structures are 4827 V, 9.9 mΩ·cm2 and 15.32 mS/mm, respectively. These metrics represent a 2.63-fold, 0.88-fold, and 1.25-fold improvement compared to the non-GMT structure. Additionally, when the doping concentration of epitaxial layer is 1 × 1016 cm−3, the GMT achieves an enhanced threshold voltage of +0.26 V. By simulating different bevel angles, field plate parameters, epitaxial layer doping concentrations, and mesa thicknesses, an optimal power figure of merit (PFOM) of 1.914 GW cm−2 is attained. This innovative design introduces a fresh concept for the development of the next generation of high voltage and high-power devices rated above 4 KV.

A 1.6 kV Ga2O3 Schottky Barrier Diode with a Low Reverse Current of 1.2 × 10-5 A/cm2 Enabled by Field Plates and N Ion-Implantation Edge Termination.

In this work, by employing field plate (FP) and N ion-implantation edge termination (NIET) structure, the electrical performance of the β-Ga2O3 Schottky barrier diode (SBD) was greatly improved. Ten samples of vertical SBDs were fabricated to investigate the influence of the relative positions of field plates (FPs) and ion implantation on the device performance. The device with the FP of 15 μm and the ion implantation at the edge of the Schottky electrode exhibited a breakdown voltage (Vbr) of 1616 V, a specific on-resistance (Ron,sp) of 5.11 mΩ·cm2, a power figure of merit (PFOM) of 0.511 GW/cm2, and a reverse current density of 1.2 × 10-5 A/cm2 @ -1000 V. Compared to the control device, although the Ron,sp increased by 1 mΩ·cm2, the Vbr of the device increased by 183% and the PFOM increased by 546.8%. Moreover, the reverse leakage current of the device with the FP and NIET structure decreased by three orders of magnitude. The TCAD simulation revealed that the peak electric field at the interface decreased from 7 MV/cm @ -500 V to 4.18 MV/cm @ -1000 V. These results demonstrate the great potential for the β-Ga2O3 SBD with a FP and NIET structure in power electronic applications.

First-principles investigations and MOCVD growth of Si-doped β-Ga2O3 thin films on sapphire substrates for enhancing Schottky barrier diode characteristics

In the realm of high-power electronics, the potential of gallium oxide (β-Ga2O3) as a front-runner material has garnered significant attention due to its wide bandgap and the capacity to withstand high critical electric fields. To push the boundaries of performance for β-Ga2O3 devices, a meticulous exploration into the effects of silicon (Si) doping on β-Ga2O3 films was carried out using the metalorganic chemical vapor deposition (MOCVD) technique with various tetraethoxysilane (TEOS) flow rates (0–30 sccm). The Si-doped β-Ga2O3 films were systematically studied and characterized using XRD, SEM, and XPS techniques. XRD patterns demonstrated the preservation of the β-Ga2O3 monoclinic structure in the Si-doped β-Ga2O3 films, without any evidence of secondary phases. In addition to this, first-principles calculations were performed to explore the incorporation of Si atoms in Ga2O3 supercells, which revealed the preference of Si atoms to occupy substitutional Ga tetrahedral sites within the Ga2O3 lattice. Through the utilization of Si-doped β-Ga2O3 films, a unique design of donut-shaped Schottky barrier diode (SBD) was successfully engineered. Remarkably, the Si-doped β-Ga2O3 SBD (employed with 20 sccm TEOS flow rate) exhibited the breakdown voltage (Vbr) of 497 V and Baliga's Figure of Merit (BFOM) value of 1.16 kW/cm2, which is five-order higher BFOM compared to undoped β-Ga2O3 SBD. This substantial improvement in BFOM underscores the significant potential of Si-doped β-Ga2O3 films for high-power electronics, opening avenues for enhanced device efficiency and capabilities.

Device engineering of p-CuAlO2/β-Ga2O3 interface: A staggered-gap band-alignment

In this work, by controlling the oxygen flow rate (OFR) (from 0% to 30%), we suggest using a p-type copper aluminum oxide (p-CuAlO2) interlayer to enhance the high breakdown and low leakage current for β-Ga2O3-based power device applications. Results of AFM measurements on p-CuAlO2 films performed using various OFRs demonstrate that greater OFRs result in an increase in film roughness payable to the unavoidable leading of defects/oxygen vacancy (VO). We used XPS and TEM analysis to validate the surface elemental compositions, chemical states, band offsets and microstructural properties of p-CuAlO2/β-Ga2O3 heterojunction (HJ) with different OFRs. With increasing OFR from 0% to 17.6%, the VBO and CBO values of HJ were decreased from 1.73 eV to 1.23 eV and from 0.53 eV to 0.38 eV respectively. Then, with increasing OFR from 17.6% to 30%, VBO was decreased from 1.23 eV to 1.13 eV while CBO increased from 0.38 eV to 0.58 eV. The staggered-gap (type-II) across the p-CuAlO2/β-Ga2O3 HJ is identified the entire OFRs. The rising tendency of optical bandgap (Eg) of p-CuAlO2 with range of OFRs, a maximum Eg of 4.35 eV was obtained with OFR of 30%. Furthermore, the electrical and carrier transport properties of p-CuAlO2/β-Ga2O3 HJ were studied using I–V and C–V techniques. The reverse breakdown voltage (Vbr) of HJ is strongly dependent on OFRs. With increasing OFRs, Vbr was decreased from 937 V to 924 V, and then to 1000 V with increasing OFR from 0% to 17.6% and then to 30%. In addition, a decrease in the interface state density (NSS) with increasing OFRs was observed which indicates that oxygen may be an effective surface passivation. Analysis confirmed that Poole-Frenkel emission dominates the reverse leakage current of all the HJ samples. The type-II p-CuAlO2/β-Ga2O3 HJ may facilitate the design and manufacture of high-performance β-Ga2O3-based heterojunctions and advance optoelectronic devices.

Highly Efficient Floating Field Rings for SiC Power Electronic Devices - A Systematic Experimental Study

A systematic experimental study is conducted on floating field rings (FFR) incorporated into 4H-SiC junction barrier Schottky (JBS) diodes across four voltage ratings 650, 1200, 1700 and 3300V, in pursuit of highly efficient FFR designs. 30 designs of FFR in 3 categories are studied for each voltage rating, and the measured breakdown voltage (Vbr) of JBS divided by ring system width (W) is taken as the figure of merit (FOM) of each design. The influence of ring spacing, ring width and number of rings on Vbr is studied in detail. It is found that the initial ring spacing (S1) is critical in determining the highest Vbr achievable by a certain design, and its optimum value increases as voltage rating increases. TCAD simulation verifies the importance of S1. For designs with a small ring system width, subsequent ring spacing can also become important. Ring width does not have a definitive effect, and Vbr saturates beyond a certain ring number. The design with the highest Vbr may not render the highest FOM. Even style designs with appropriate ring spacings can be advantageous likely due to less susceptibility to variation of field oxide charge, and more tolerance to fabrication error, as well as ease of design.

Electrical performance study of Schottky barrier diodes using ion implanted β-Ga2O3 epilayers grown on sapphire substrates

β-Ga2O3 epilayers with a 210 nm thickness were successfully grown on c-plane sapphire substrate by metalorganic chemical vapor deposition (MOCVD). Highly resistive unintentionally doped (UID) epilayers are studied, as are Si ion-implantated samples with doses of 1✕1014, 6✕1014 and 1✕1015 cm−2 at 30 keV to improve β-Ga2O3 epilayer conductivity. Schottky barrier diodes (SBDs) were fabricated using optimized growth parameters and electrical measurements performed for both UID and Si-implanted β-Ga2O3 material. The forward current density (J) of an UID SBD at 2 V was 62 nA/cm2 with breakdown voltage (Vbr) of 1.03 kV and leakage J of 10 μA/cm2. The forward J improved by eight orders of magnitude after Si implantation. In this case, Vbr reduced to 680 V combined with a high leakage J of ∼A/cm2 for doses of 1✕1015cm−2. A hard breakdown of 553 V was achieved with a Si-ion dose of 1✕1014 cm−2 with comparatively less leakage than samples with higher dose amounts.

Improved electrical performance of lateral β-Ga2O3 MOSFETs utilizing slanted fin channel structure

In this Letter, lateral slanted-fin-channel β-Ga2O3 metal-oxide-semiconductor field effect transistors (MOSFETs) are demonstrated. A 600-nm thick n-type doped channel layer is adopted to improve output characteristics. The tri-gate structure enhances gate control in the proposed β-Ga2O3 MOSFETs, showing an on/off ratio as high as 109. In particular, the slanted-fin-channel structure, mainly located in the gate region, reduces the peak electric field in the Ga2O3 channel due to the gradual regulation of a threshold voltage. The slanted-fin-channel β-Ga2O3 MOSFETs show a breakdown voltage (Vbr) of 2400 V and a power figure-of-merit of 193 MW/cm2, which are almost 2 and 5.5 times larger, respectively, than those of conventional straight-fin-channel devices. These results imply that the slanted-fin channel structure provides a viable way of fabricating high-performance β-Ga2O3 MOSFET power devices.

Avalanche photodiodes with multiple multiplication layers for coherent detection

We demonstrate a novel avalanche photodiode (APD) design which fundamentally relaxes the trade-off between responsivity and saturation-current performance at receiver end in coherent system. Our triple In0.52Al0.48As based multiplication (M-) layers with a stepped electric (E-) field inside has more pronounced avalanche process with significantly less effective critical-field than the dual M-layer. Reduced E-field in active M-layers ensures stronger E-field allocation to the thick absorption-layer with a smaller breakdown voltage (Vbr) resulting in less serious space-charge screening effect, less device heating at high output photocurrent. Compared to the dual M-layer reference sample, the demonstrated APD exhibits lower punch-through (− 9 vs. − 24 V)/breakdown voltages (− 43 vs. − 51 V), higher responsivity (19.6 vs. 13.5 A/W), higher maximum gain (230 vs. 130), and higher 1-dB saturation-current (> 5.6 vs. 2.5 mA) under 0.95 Vbr operation. Extremely high saturation-current (> 14.6 mA), high responsivity (7.3 A/W), and decent O-E bandwidth (1.4 GHz) can be simultaneously achieved using the demonstrated APD with a 200 µm active window diameter. In coherent FMCW LiDAR test bed, this novel APD exhibits a larger signal-to-noise ratio and high-quality 3-D images than the reference dual M-layer and high-performance commercial p-i-n PD modules, while requiring significantly less optical local-oscillator (LO) power (0.5 vs 4 mW).

Comprehensive characterization of vertical GaN-on-GaN Schottky barrier diodes

This paper reports comprehensive characterization of vertical GaN-on-GaN Schottky barrier diodes (SBDs) fabricated on free-standing GaN substrates. The GaN active layer properties are evaluated by atomic force microscopy (AFM), secondary-ion mass spectrometry (SIMS), micro-Raman spectroscopy, cathodoluminescence (CL), and deep-level transient Fourier spectroscopy (DLTFS). The GaN SBDs exhibit near-unity ideality factor (n = 1.1), promising Schottky barrier height (SBH) of ΦB = 0.82 eV, low turn-on voltage ∼0.56 V, leakage current density of JR < 5.5 × 10−6 Acm−2 at −100 V, breakdown voltage VBR < −200 V, and less interface state density (NSS < 5 × 1012 eV−1 cm−2) at the Ni/GaN Schottky contact. The forward and reverse current transport mechanisms of the SBD are identified by fitting analysis of measured J-V. Weak temperature dependence of ΦB and n is detected from I–V-T measurements. Similar traps at EC - 0.18 eV and EC - 0.56 are identified in the various SBDs from DLTFS, signifying that these traps are omnipresent defects in the epilayer.

(Invited, Digital Presentation) Exploring the Potential and Limits of Gallium Oxide Electronics: In-Situ Dielectrics, Heterointegration and High-k Field Plates

The intrinsic properties of beta phase Gallium Oxide such as the high breakdown field strength makes it a very attractive material for next generation electronics. Rapid progress has been made over the last few years in pushing the performance of Gallium Oxide-based vertical Schottky diodes and lateral field effect transistors and impressive figure of merit has been reported. However, the device performance is farther from the expected performance based on intrinsic properties. Exploration of the intrinsic potential is rather limited by several factors such as the quality of dielectrics and dielectric/semiconductor interfaces, electric field management challenges due to the lack of p-type material, to name a few. In this work, we will highlight a few approaches to tackle some of these challenges.(1) In-situ dielectrics: High quality dielectric-semiconductor interfaces are critical for reliable high-performance transistors. We report in situ metal–organic chemical vapor deposition of Al2O3 on β-Ga2O3 as a potentially better alternative to the most commonly used atomic layer deposition (ALD) [1]. The growth of Al2O3 is performed in the same reactor as Ga2O3 using trimethylaluminum and O2 as precursors without breaking the vacuum at a growth temperature of 600 °C. The fast and slow near interface traps at the Al2O3/β-Ga2O3 interface are identified and quantified using stressed capacitance–voltage (CV) measurements on metal oxide semiconductor capacitor (MOSCAP) structures. The density of shallow and deep level initially filled traps (Dit) are measured using ultraviolet-assisted CV technique. The average Dit for the MOSCAP is determined to be 6.4 × 1011 cm−2eV−1. The conduction band offset of the Al2O3/ Ga2O3 interface is also determined from CV measurements and found out to be 1.7 eV which is in close agreement with the existing literature reports of ALD Al2O3/Ga2O3 interface. The current–voltage characteristics are also analyzed and the average breakdown field is extracted to be approximately 5.8 MV cm−1.(2) Field management using High-K field Plate: We report a vertical (001) β-Ga2O3 field-plated (FP) Schottky barrier diode (SBD) with a novel extreme permittivity dielectric field oxide [2] . A thin drift layer of 1.7μm was used to enable a punch-through (PT) field profile and very low differential specific on-resistance (Ron-sp) of 0.32 mΩ-cm2. The extreme permittivity field plate oxide facilitated the lateral spread of the electric field profile beyond the field plate edge and enabled a breakdown voltage (Vbr) of 687 V. The edge termination efficiency increases from 13.2%for non-field plated structure to 61% for high permittivity field plate structure. The high permittivity field plated SBD demonstrated a record high Baliga's figure of merit (BFOM) of 1.47 GW/cm2 showing the potential of Ga2O3 power devices for multi-kilovolt class applications.(3) p-type III-nitride/Ga2O3 integration for field management: This work presents the simulation and analysis of a novel Ga 2 O 3 vertical Schottky diode with three different guard ring (GR) configurations to reduce the peak electric field at the metal edges [3]. Highly doped p-type GaN, p-type nonpolar AlGaN, and polarization-doped graded p-AlGaN are simulated and analyzed as the GR material, which forms a heterojunction with the Ga 2 O 3 drift layer. GR with nonpolar graded p-AlGaN with a bandgap larger than Ga 2 O 3 is found to show the best performance in terms of screening the electric field at the metal edges. The proposed GR configuration is also compared with a reported Ga 2 O 3 Schottky diode with no GR and a structure with high-resistive nitrogen-doped GR. The optimized design is predicted to have a breakdown voltage as high as 6.2 kV and a specific ON-resistance of 3.55 mΩ-cm 2, which leads to an excellent power figure of merit of 10.8 GW/cm 2.The approaches discussed here can offer a pathway towards understanding the true potential and limitations of Gallium Oxide for extreme electric field devices. We acknowledge funding support from NSF (DMR-1931652) and the AFOSR MURI program (FA9550-18-1-0507).

Lateral separate absorption charge multiplication Ge-on-Si avalanche photodiode with low dark current in linear mode

To suppress the dark current and improve the detection sensitivity of the Germanium-on-silicon (Ge-on-Si) avalanche photodiode (APD), we report an integrated waveguide-based Ge-on-Si APD with a lateral separate absorption charge multiplication (SACM) structure, which works at low bias voltage. The breakdown voltage (Vbr) of the lateral SACM APD in linear mode is about 5.81 V, and the device demonstrates very low dark current of 0.157 nA and 40.7 nA at unity gain voltage (VGain=1=3.5 V) and 0.95Vbr (∼5.5 V), at room temperature. We also study the single photon detection performance of the device in Geiger mode. The practical dark count rate (DCR) at 300 K is with the same order of magnitude as the vertical SACM Ge-on-Si APD operating at 200 K. With the wavelength and average photon number of weak coherent pulse are 1550 nm and 0.1, respectively, the theoretical single photon detection efficiency (SPDE) of the device can achieve 0.4% at 300 K, which will reduce the dependence of the weak light detection system on the low-temperature working environment.

Germanium-on-silicon avalanche photodiode for 1550 nm weak light signal detection at room temperature

To optimize the dark current characteristic and detection efficiency of the 1550 nm weak light signal at room temperature, this work proposes a Ge-on-Si avalanche photodiode (APD) in Geiger mode, which could operate at 300 K. This lateral separate absorption charge multiplication APD shows a low breakdown voltage (Vbr) in Geiger mode of -7.42 V and low dark current of 0.096 nA at unity gain voltage (VGain=1 = -7.03 V). Combined with an RF amplifier module and counter, the detection system demonstrates a low dark count rate (DCR) of 1.1×106 counts per second and high detection efficiency η of 7.8% for 1550 nm weak coherent pulse detection at 300 K. The APD reported in this work weakens the dependence of the weak optical signal recognition on the low environment temperature and makes single-chip integration of the single-photon level detection system possible.

Mushroom mesa structure for InAlAs-InGaAs avalanche photodiodes

Mushroom mesa structure for InAlAs/InGaAs avalanche photodiodes (APD) was proposed and investigated. APD heterostructrures were grown by molecular-beam epitaxy. Fabricated APDs with the sensitive area diameter of about 30 micron were passivated by SiN deposition and demonstrated avalanche breakdown voltage Vbr 70-80 V. At the applied bias of 0.9 Vbr, the dark current was 75-200 nA. The single-mode coupled APDs demonstrated responsivity at a gain of unity higher than 0.5A/W at 1550 nm. Keywords: avalanche photodiode, InAlAs/InGaAs, mesa structure, dark current.

(Invited) Developments of Wbg GaN-on-GaN Vertical Power Devices & Uwbg Ga2O3, Algao, and Heterostructures

In this talk, metalorganic chemical vapor deposition (MOCVD) development of GaN-on-GaN targeting for vertical power devices will be presented. To achieve vertical GaN PN diodes with high breakdown voltage (Vbr) and low on resistance (Ron), it is critical to develop thick GaN drift layer with low controllable doping (Nd-Na) and high electron mobility. Key impurities in MOCVD GaN serving as charge compensation centers were identified. For example, mechanisms of Fe incorporation in MOCVD GaN were identified and addressed [1]. Source of C incorporation is mainly from metalorganic precursor (TMGa), and the C concentration in GaN is highly dependent on MOCVD growth condition, particularly the growth rate. Typically, as GaN growth rate increases, C incorporation increases undesirably. To address this key challenge for achieving high quality thick GaN drift layer, we developed a laser-assisted MOCVD (LA-MOCVD) growth technique to enable fast GaN epitaxy while suppressing C incorporation. The effects of LA-MOCVD GaN growth parameters on GaN growth rate, impurity incorporation and charge transport properties will be discussed. GaN PN diodes with breakdown voltage ~ 3kV are demonstrated.This talk will also discuss our recent developments of ultrawide bandgap (UWBG) Ga2O3, (AlxGa1-x)2O3, and heterostructures [2-5]. Challenges and opportunities for developing (AlxGa1-x)2O3 on Ga2O3 substrates with different crystal orientations ((010), (100), (-201)) be discussed. Band offsets between AlGaO/GaO heterostructures were determined based on high quality epitaxy of AlGaO/GaO heterostructures. Experimental results agree very well with the values predicted from theoretical density functional theory (DFT). Growth techniques based on MOCVD and low pressure chemical vapor deposition (LPCVD) will be compared and discussed. Acknowledgement: The authors acknowledge the funding support from Advanced Research Projects Agency-Energy (ARPA-E) DE-AR0001036, U.S. Department of Energy's Office of Energy Efficiency and Renewable Energy (EERE) under the Advanced Manufacturing Office, FY18/FY19 Lab Call, the Air Force Office of Scientific Research FA9550-18-1-0479 (AFOSR, Dr. Ali Sayir) and the National Science Foundation (1810041, 1755479, 2019753). [1] Y. Zhang, Z. Chen, W. Li, H.-S. Lee, M. R. Karim, A. R. Arehart, S. A. Ringel, S. Rajan, H. Zhao, J. Appl. Phys., 127, 215707, 2020.[2] Z. Feng, A F M A. U. Bhuiyan, M. R. Karim, H. Zhao, Appl. Phys. Letts., 114, 250601, 2019.[3] A F M A. U. Bhuiyan, Z. Feng, J. M. Johnson, Z. Chen, H. -L. Huang, J. Hwang, H. Zhao, Appl. Phys. Lett., 115, 120602, 2019.[4] A F M A. U. Bhuiyan, Z. Feng, J. M. Johnson, H.-L. Huang, J. Sarker, M. Zhu, M. R. Karim, B. Mazumder, J. Hwang, and H. Zhao, APL Materials, 8, 031104, 2020.[5] A F M A. U. Bhuiyan, Z. Feng, J. M. Johnson, H.-L. Huang, J. Hwang, and H. Zhao, Appl. Phys. Letts, 117, 252105, 2020.

High-k Oxide Field-Plated Vertical (001) β-Ga2O3Schottky Barrier Diode With Baliga’s Figure of Merit Over 1 GW/cm2

We report a vertical (001)β-Ga2O3 field-plated(FP) Schottky barrier diode (SBD) with a novel extreme permittivity dielectric field oxide. A thin drift layer of 1.7μm was used to enable a punch-through (PT) field profile and very low differential specific on-resistance (Ron-sp)of 0.32 mΩ-cm2. The extreme permittivity field plate oxide facilitated the lateral spread of the electric field profile beyond the field plate edge and enabled a breakdown voltage (Vbr) of 687 V. The edge termination efficiency increasesfrom 13.2%for non-field plated structure to 61%for high permittivity field plate structure. The surface breakdown electric field was extracted to be 5.45 MV/cm at the center of the anode region using TCAD simulations. The high permittivity field plated SBD demonstrated a record high Baliga's figure of merit (BFOM) of 1.47 GW/cm2 showing the potential of Ga2O3 power devices for multi-kilovolt class applications.

β-Ga2O3 epitaxial growth on Fe-GaN template by non-vacuum mist CVD and its application in Schottky barrier diodes

In this work, we report on demonstrating lateral β-Ga2O3 Schottky barrier diodes (SBDs) fabricated on Fe-GaN/sapphire (0001) substrates by using the non-vacuum, low-cost mist chemical vapor deposition (mist CVD) method for the first time. The x-ray diffraction scanning pattern identifies that β-Ga2O3 layers are grown with (−201) planes parallel to the (0001) plane of the GaN template, and the transmission electron microscopy shows that the β-Ga2O3 lattice is regularly and neatly arranged, indicating good crystal quality. β-Ga2O3 based SBDs with 4 and 20 µm anode–cathode lengths (LAC) exhibit the specific on-resistance (Ron,sp) of 1.58 and 39.8 Ω cm2 and breakdown voltage (Vbr) of 580 and 2400 V, respectively. The present results show the great potential of the non-vacuum and cost-effective mist CVD method as the epitaxial growth technique employed in β-Ga2O3 devices.

Implementation of Low Voltage MOSFET and Power LDMOS on InGaAs

In this paper, a new low voltage MOSFET (LV MOSFET) and high voltage dual-gate MOSFET (HV DG MOSFET) have been proposed with concept of integration based on trench technology on InGaAs material. Junction isolation technique is used for the implementation of a low voltage MOSFET and a high power dual gate MOSFET in same InGaAs epitaxial layer side by side. The HV DG MOSFET consists of dual gate that are placed in drift region under the oxide-filled trenches. The proposed structure minimize on-resistance (Ron) along with increased breakdown voltage (Vbr) due to enhanced RESURF effect, the creation of dual channels, and due to folding technique of drift region in vertical direction. In the HV DG MOSFET, the drain current (ID) increases leading to enhanced transconductance (gm) by simultaneous conduction of channels with improved maximum oscillation frequency (fmax) and cut-off frequency (ft). On the other side, the low voltage MOSFET consists of a gate placed in a centre of the structure within an oxide trench to create two n-channels in the p-base. The two channels are conducting in parallel and give substantial enhancement in peak gm, ID, fmax and ft with more control over the short channel parameters. The design and performance analysis of low voltage MOSFET (LV MOSFET) and high voltage dual-gate MOSFET (HV DG MOSFET) are carried out on 2-D ATLAS device simulator.

Passivation-layer thickness and field-plate optimization to obtain high breakdown voltage in AlGaN/GaN HEMTs with short gate-to-drain distance

A two-dimensional analysis of the off-state breakdown characteristics in field-plate AlGaN/GaN HEMTs is performed. The gate-to-drain distance is 1.5 μm, and the parameters are the SiN passivation-layer thickness d and the field-plate length LFP. For a moderate d of 0.1 μm, the breakdown voltage Vbr increases with LFP, and takes an maximum value (~400 V) around LFP = 0.3 μm, and decreases when LFP becomes even longer. This decrease is attributed to the fact that the drain voltage is almost applied along the region between the field plate and the drain. For thin d ≤ 0.03 μm, Vbr becomes relatively low (≤150 V) when LFP becomes long (≥ 0.6 μm). This is attributed to the fact that when d is very thin, the field plate acts like a gate electrode. When d is relatively thick (≥0.3 μm), Vbr decreases at LFP = 0.3 μm as compared to the case of d = 0.1 μm, and it decreases to 250 V at d = 0.5 μm. This is because the field-plate effects become weak for thick d. The optimum thickness of the SiN passivation layer is approximately 0.1–0.2 μm and Vbr peaks at approximately 400 V when LFP = 0.3 μm. The novelty of this paper is to show the dependence of Vbr on the passivation-layer thickness d and the field-plate length LFP when the gate-drain distance is short.

Грибовидная меза-структура для лавинных фотодиодов на гетероструктурах InAlAs/InGaAs

Mushroom mesa structure for InAlAs/InGaAs avalanche photodiodes (APD) was proposed and investigated. APD heterostructrures were grown by molecular-beam epitaxy. Fabricated APDs with sensitive area diameter of about 30 micron were passivated by SiN deposition and demonstrate avalanche breakdown voltage Vbr ~ 70-80 V. At applied bias of 0.9 Vbr the dark current was ~ 75-200 nA. The single-mode coupled APDs demonstrate responsivity at a gain of unity is high than 0.5A/W at 1550 nm.