Effects of annealing on the properties of B-implanted Si for n-type solar cells were investigated by comparing rapid thermal annealing (RTA) and furnace annealing (FA) conditions. Profiles of boron and residual damage were theoretically simulated by technology computer aided design based on boron diffusion kinetics mechanism of transient enhanced diffusion. Compared with the rapid thermally annealed samples, the furnace annealed one showed the lowest remnant damage spectra obtained by channeling Rutherford backscattering spectrometry. Furthermore, the electrical properties of boron implanted samples were characterized by Hall and QSSPC technique, revealing a trend that increasing annealing thermal budget would result in higher active carrier density and lower emitter saturation current density. Finally, passivated emitter solar cells were fabricated to verify the influence of annealing conditions on the performances at device level. The champion cell with efficiency of 18.85% received FA for 20 min, whereas those with lower thermal budgets exhibited significantly lower performance. From diode parameters obtained by fitting dark I–V curves and short wavelength responses of internal quantum efficiency spectrum, it was found that B-implanted samples required an annealing temperature of at least 1000 °C together with a sufficiently long time. Rather low thermal budget such as RTA for dozens of seconds was far enough to realize full activation of boron and removal of implantation damage.
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