Single layers of Ti, Al, TiAl and Ti 3Al were sputter deposited on to 2″ oxidized Si 〈111〉 wafers and 7059 Corning Glass to study the effect of film thickness, temperature, and sputtering gas pressure on the mechanical and physical properties. In the present investigation, sputtering gas pressure was varied from 2 mT to 10 mT. The film thickness was varied from 1000 Å to 2 μm. The as-deposited Ti, Al and Ti 3Al films are well crystallized over the entire thickness range. Ti and Ti 3Al films show preferred orientation in the 〈0002〉 direction. On the other hand, Al films are random polycrystalline. TiAl films are nearly amorphous for all the thicknesses under consideration. TiAl films show formation of Ti (Al) solid solution phase with increasing Ar pressure. All the materials under consideration, show average film stress to be independent of thickness for thicker films. The nature of the stress (compressive or tensile) depends upon working gas pressure, sputtering power and the target material used. A definite trend is observed in the film stress as a function of Ar gas pressure. Both power and gas pressure influence the energetic bombardment of ions/atoms which in turn influence the average film stress. The nature of the intrinsic stress is explained by the atomic peening model. The Young's modulus of thin films is calculated by using the slope of the stress-temperature plots. The E values seem to change with deposition conditions, however, there is no obvious trend between the sputtering gas pressure and the Young's modulus of these thin films.