Abstract
The state-of-the-art and outlooks for 2.3D IC integration will be investigated in this study. Emphasis is placed on the design, materials, process, advantages and disadvantages, challenges (opportunities), and examples of 2.3D IC integration for chiplet design and heterogeneous integration packaging. Also, some recommendations of 2.3D IC integration will be presented.
Full Text
Published Version (
Free)
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call