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Abstract
In this study, the recent advances and trends in multiple system and heterogeneous integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC integration) will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of multiple system and heterogeneous integration with TSV-less interposer. Also, some recommendations of 2.3-D IC integration will be provided.
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