Abstract
In this chapterTSV-less interposer, the recent advances in multiple systemMultiple system and heterogeneous integrationHeterogeneous integration with TSVThrough-silicon via (TSV) (through-silicon via)-less interposers (organic interposes or 2.3D IC integration2.3D IC integration) will be presented. Unlike 2.5D IC integration2.5D IC integration discussed in Chap. 3 , the TSV-interposer is replaced by the TSV-less interposers, which are meanly constructed by the fan-outFan-out packaging technology.
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