Abstract
This paper describes phase growth of Sn-3.OAg-0.5Cu solder joints by a mechanical fatigue test. A lap joint type shear specimen was used to evaluate the influence of temperature and strain on the phase growth of solder joints. The fatigue test was carried out under constant temperature condition. Nonperiodically the specimen was taken out from the chamber and the micro structure of the solder joint was observed by the scanning electron microscope (SEM). Consequently, in Ag_3Sn phase growth proceeds so that the average phase size to the 4th power is proportional to the number of cycles, and is mainly induced by strain rather than thermal equilibrium.
Published Version
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