Abstract
This paper presents the result of verifying Miner's law of the solder joint part by mechanical fatigue tests and FEM analysis. The author's group have studied the Manson-Coffin's law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu solder, because this solder is attracted from the aspect of the decrease of solder leach in the flow process and material cost. To studying the Manson-Coffin's law, mechanical shear fatigue tests and FEM analysis are used. The mechanical shear fatigue test use the relative displacement corresponding to the thermal strain.
Published Version
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