Analytical and Experimental Hybrid Study on Thermal Fatigue Strength of Electronic Solder Joints. 2nd Report. Evaluation by Isothermal Mechanical Fatigue Tests.

Abstract

An isothermal mechanical fatigue test method and fatigue testing equipment were developed to investigate the low cycle fatigue strength of Sn-Pb eutectic solder joints. Based upon the results of finite element analysis, it is found that the rate of inelastic strain components (plastic strain and creep strain) in the solder joints can be accurately controlled by the displacement rate of the linearactuator of the test equipment. The isothermal mechanical fatigue tests were carried out by controlling the displacement at a very high displacement rate, and a very low displacement rate, respectively ; only plastic strain was generated in the solder joints at the high displacement rate, and only creep strain at the low rate. It is found that the low cycle fatigue life of Sn-Pb eutectic solder joints is not grealty affected by the ratio of inelastic components. Therefore, it can be said that the low cycle fatigue life can be estimated from the equivalent inelastic strain range, and the relationship of the cycles to failure and the strain range follows Coffin-Manson's law. In comparison of the mechanical fatigue strength results with the results of the cyclic thermal tests, it was found that the mechanical fatigue test method can be used as a good accelerated test method for the thermal fatigue strength of Sn-Pb eutectic solder joints.