Abstract
The solder joint between 61.9Sn-38.1Pb lead solder and Sn-3.5Ag-0.75Cu lead-free solder were studied.The study focuses on the relation between the solder joint with loading rate,bonding thickness and bonding surface. In this study, the tensile test at room temperature were carried out for lead-solder and lead-free solder ,in order to investigate the mechanical properties of both solder. Based on the experiment result, the bonding increase with the loading rate but decrease with the bonding thickness.For the bonding surface experiment,the result shows that the effect of the bonding surface towards the solder joint are small.Comparisons in term of mechanical properties for lead-free solder and eutectic solder alloy also has been discussed.
Published Version
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