Abstract
Wafer-level adhesive bonding has been applied for the fabrication of microsystems which have heterogeneous components on LSI (large scale integrated circuit). Devices or functional materials formed on a carrier wafer are transferred to a LSI wafer, which enables versatile heterogeneous integration, overcoming process incompatibility. Based on the developed process technology, RF resonators, a piezoelectric microswitch, tactile sensors, a parallel electron beam source etc. have been demonstrated.
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