Abstract
Covalent bonding is based on a direct bonding process. The first step of this process consists in creating dangling bonds at the wafers surface. When the two activated surfaces are brought in contact, covalent bonds result between them. Dangling bonds are highly reactive. Any queue time between activation and bonding is crucial, as dangling bonds must be preserved. It can be even more difficult to preserve the dangling bonds in the case of bonding process in temperature. One way, commonly used, is to always stay under Ultra High Vacuum (UHV). However, the UHV environment may affect the bonding process. This paper aims at studying the impact of the UHV quality on the dangling bonds stability and bonding quality.
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