Abstract
Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Films or MEMS devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to mirror array, resonator, piezoelectric switch, IR imager, tactile sensor, electron source and so on. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.
Highlights
Integrated MEMS (micro electro mechanical systems) as capacitive sensors and arrayed display have been produced successfully
Integrated MEMS as capacitive sensors and arrayed display have been produced successfully
MEMS as switches and filters fabricated on CMOS LSI are needed for future multiband wireless systems, in which good mechanical properties or piezoelectric materials are required for the MEMS and state of the art for the LSI
Summary
Integrated MEMS (micro electro mechanical systems) as capacitive sensors and arrayed display have been produced successfully. These heterogeneous integration processes can be applied to integrated MEMS and to other devices as integrated optical devices by bonding a compound semiconductor wafer for laser or LED to a CMOS LSI wafer. The carrier wafer is removed and the remained film is used to fabricate MEMS devices on the LSI wafer.
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