Abstract
Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. MEMS devices of films formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to resonator, piezoelectric switch, tactile sensor, electron source. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.
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