Abstract
Charged particle flow includes ion beam flow and electron flow. The high-energy ion beams can take part in ion implantation, ion beam sputtering, and ion beam mixing on the material surface. Ion sources that generate high-energy ions include ion implanter, Hall ion source, Kaufman ion source, anode layer ion source, hollow cathode Hall ion source, and radio frequency ion source. The high-density arc electron flow in arc discharge can generate more argon ions and metal ions, thereby increasing the sputtering rate and metal ionization rate. In magnetron sputtering technology the electron flow has three functions: cleaning, ionization, and deposition. The flow can improve the film quality. High-density electron flow can be generated by hollow cathode guns, hot-wire arc guns, and various cathode arc sources.
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