Abstract
The plasma-enhanced chemical vapor deposition (PECVD) technology involves derivation of film particles from gases. Whereas the conventional thermal chemical vapor deposition technology deposits compound films using thermal energy; in contrast, the PECVD technology ionizes or excites polyatomic gases into high-energy particles via gas discharges. The gas discharge method includes direct current (DC) glow discharge, radiofrequency (RF) glow discharge, microwave glow discharge, hot wire arc discharge, and plasma torch arc discharge. New types of PECVD technologies, such as plasma immersion ion implantation (PIII) technology and electromagnetic-enhanced winding coating technology, have recently been developed. In addition, atomic layer deposition technology is a new technology being used to deposit films with uniform thickness and with a wide range of applications.
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