Abstract
Three-dimensional NAND Flash has been in production since 2013. Because of the 1.5-fold increase of memory capacity per year using 3D-NAND, revenue of the mass storage has extensively grown, such as SSD and so on. This chapter is devoted to 3D-NAND Flash memories of various aspects, including cell structures, process and integration issues, and electrical characteristics: (1) V-NAND, (2) BiCS, (3) FG-based 3D, and (4) reliability issues of 3D-NAND. This chapter will also discuss technology trends and emerging opportunities in the future.
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