Abstract
A bit-cost scalable (BiCS) technology using a bulk erasing method instead of the conventional erase operation using gate-induced drain leakage (GIDL) is proposed to realize better cell characteristics and process feasibility for three-dimensional (3D) NAND flash memory. This has an additional electrode layer for a bulk erase operation in the middle of a vertical string cell. Here, we confirmed that this structure using an additional electrode provides good program and erasing speed by simulation. Furthermore, junction engineering is performed to realize a polysilicon layer of the flat plate type as a bulk electrode for better design feasibility. From this result, we expect that a bulk erasable BiCS technology using a flat plate erase electrode can be a candidate 3D NAND flash memory technology.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
